JP2008527105A5 - - Google Patents
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- JP2008527105A5 JP2008527105A5 JP2007550372A JP2007550372A JP2008527105A5 JP 2008527105 A5 JP2008527105 A5 JP 2008527105A5 JP 2007550372 A JP2007550372 A JP 2007550372A JP 2007550372 A JP2007550372 A JP 2007550372A JP 2008527105 A5 JP2008527105 A5 JP 2008527105A5
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- JP
- Japan
- Prior art keywords
- group
- composition
- groups
- amine
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- -1 boron amine Chemical class 0.000 claims description 237
- 239000000203 mixture Substances 0.000 claims description 189
- 150000001875 compounds Chemical class 0.000 claims description 102
- 239000003054 catalyst Substances 0.000 claims description 64
- 229910052796 boron Inorganic materials 0.000 claims description 60
- 150000001412 amines Chemical class 0.000 claims description 58
- 229920001296 polysiloxane Polymers 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 50
- 229920000642 polymer Polymers 0.000 claims description 48
- 239000000178 monomer Substances 0.000 claims description 43
- 239000011347 resin Substances 0.000 claims description 41
- 229920005989 resin Polymers 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 36
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 34
- 239000000047 product Substances 0.000 claims description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 29
- 239000000853 adhesive Substances 0.000 claims description 27
- 229910052710 silicon Inorganic materials 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 24
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 21
- 239000010703 silicon Substances 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 20
- 239000007787 solid Substances 0.000 claims description 20
- 229910052739 hydrogen Inorganic materials 0.000 claims description 18
- 239000001257 hydrogen Substances 0.000 claims description 18
- 125000000217 alkyl group Chemical group 0.000 claims description 15
- 150000002894 organic compounds Chemical class 0.000 claims description 14
- 125000005375 organosiloxane group Chemical group 0.000 claims description 14
- 239000007789 gas Substances 0.000 claims description 13
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 12
- 229920001971 elastomer Polymers 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 11
- 239000006260 foam Substances 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 229910052697 platinum Inorganic materials 0.000 claims description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 9
- 239000012948 isocyanate Substances 0.000 claims description 8
- 150000001299 aldehydes Chemical class 0.000 claims description 7
- 150000002431 hydrogen Chemical class 0.000 claims description 7
- 239000005060 rubber Substances 0.000 claims description 7
- 229910000077 silane Inorganic materials 0.000 claims description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 6
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 6
- 150000002513 isocyanates Chemical class 0.000 claims description 6
- 150000001282 organosilanes Chemical group 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 claims description 6
- 150000001735 carboxylic acids Chemical class 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 125000000623 heterocyclic group Chemical group 0.000 claims description 5
- 229910052990 silicon hydride Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 claims description 3
- 239000002841 Lewis acid Substances 0.000 claims description 3
- 150000007513 acids Chemical class 0.000 claims description 3
- 125000004429 atom Chemical group 0.000 claims description 3
- 239000008393 encapsulating agent Substances 0.000 claims description 3
- 150000002118 epoxides Chemical class 0.000 claims description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 3
- 150000007517 lewis acids Chemical class 0.000 claims description 3
- 239000011707 mineral Chemical class 0.000 claims description 3
- 229920000768 polyamine Polymers 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 2
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 230000000536 complexating effect Effects 0.000 claims description 2
- 238000004382 potting Methods 0.000 claims description 2
- 239000011253 protective coating Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 230000002165 photosensitisation Effects 0.000 claims 1
- 239000003504 photosensitizing agent Substances 0.000 claims 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 claims 1
- 238000001723 curing Methods 0.000 description 33
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 29
- 125000003277 amino group Chemical group 0.000 description 28
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 28
- 239000004205 dimethyl polysiloxane Substances 0.000 description 27
- 150000003254 radicals Chemical class 0.000 description 24
- 125000000962 organic group Chemical group 0.000 description 21
- 125000000524 functional group Chemical group 0.000 description 19
- 150000001639 boron compounds Chemical class 0.000 description 18
- 239000000945 filler Substances 0.000 description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 238000002156 mixing Methods 0.000 description 17
- 239000000523 sample Substances 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 14
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 13
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 13
- 238000006116 polymerization reaction Methods 0.000 description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 12
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 9
- 239000003570 air Substances 0.000 description 9
- 125000003342 alkenyl group Chemical group 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 229910000085 borane Inorganic materials 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 9
- 238000006459 hydrosilylation reaction Methods 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 125000000304 alkynyl group Chemical group 0.000 description 8
- 238000009833 condensation Methods 0.000 description 8
- 230000005494 condensation Effects 0.000 description 8
- 239000012530 fluid Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 125000005395 methacrylic acid group Chemical group 0.000 description 8
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 8
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 8
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 8
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 7
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 7
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 7
- 230000008901 benefit Effects 0.000 description 7
- 239000011231 conductive filler Substances 0.000 description 7
- 238000004132 cross linking Methods 0.000 description 7
- 238000006197 hydroboration reaction Methods 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- 239000001993 wax Substances 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 150000008064 anhydrides Chemical group 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 6
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 6
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 6
- 125000005702 oxyalkylene group Chemical group 0.000 description 6
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 5
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000000806 elastomer Substances 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 125000000143 2-carboxyethyl group Chemical group [H]OC(=O)C([H])([H])C([H])([H])* 0.000 description 4
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 239000005058 Isophorone diisocyanate Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 125000000609 carbazolyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 125000004966 cyanoalkyl group Chemical group 0.000 description 4
- 125000004188 dichlorophenyl group Chemical group 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 4
- 239000013464 silicone adhesive Substances 0.000 description 4
- 125000003944 tolyl group Chemical group 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 125000005023 xylyl group Chemical group 0.000 description 4
- IUVCFHHAEHNCFT-INIZCTEOSA-N 2-[(1s)-1-[4-amino-3-(3-fluoro-4-propan-2-yloxyphenyl)pyrazolo[3,4-d]pyrimidin-1-yl]ethyl]-6-fluoro-3-(3-fluorophenyl)chromen-4-one Chemical compound C1=C(F)C(OC(C)C)=CC=C1C(C1=C(N)N=CN=C11)=NN1[C@@H](C)C1=C(C=2C=C(F)C=CC=2)C(=O)C2=CC(F)=CC=C2O1 IUVCFHHAEHNCFT-INIZCTEOSA-N 0.000 description 3
- NRGGMCIBEHEAIL-UHFFFAOYSA-N 2-ethylpyridine Chemical compound CCC1=CC=CC=N1 NRGGMCIBEHEAIL-UHFFFAOYSA-N 0.000 description 3
- JIUWLLYCZJHZCZ-UHFFFAOYSA-N 3-propyloxolane-2,5-dione Chemical group CCCC1CC(=O)OC1=O JIUWLLYCZJHZCZ-UHFFFAOYSA-N 0.000 description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 239000004971 Cross linker Substances 0.000 description 3
- 239000004593 Epoxy Chemical group 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229910004283 SiO 4 Inorganic materials 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000005336 allyloxy group Chemical group 0.000 description 3
- 125000004103 aminoalkyl group Chemical group 0.000 description 3
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 150000001805 chlorine compounds Chemical class 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 125000004093 cyano group Chemical group *C#N 0.000 description 3
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 150000008282 halocarbons Chemical group 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000013528 metallic particle Substances 0.000 description 3
- 125000005641 methacryl group Chemical group 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 150000003961 organosilicon compounds Chemical class 0.000 description 3
- 125000006353 oxyethylene group Chemical group 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 2
- FAOPZUAEZGKQNC-UHFFFAOYSA-N 3-propyl-1h-pyrrole Chemical group CCCC=1C=CNC=1 FAOPZUAEZGKQNC-UHFFFAOYSA-N 0.000 description 2
- LPFJFXRQANKTRA-UHFFFAOYSA-N 3-propylfuran-2,5-dione Chemical group CCCC1=CC(=O)OC1=O LPFJFXRQANKTRA-UHFFFAOYSA-N 0.000 description 2
- IQGSOFGPPDPEQW-UHFFFAOYSA-N 3-trimethylsilylpropyl prop-2-enoate Chemical compound C[Si](C)(C)CCCOC(=O)C=C IQGSOFGPPDPEQW-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical group CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- 0 C*(B(C(CC(*)(N)[Si](*)(*)*)N)*(*(C)C*)=C)*C* Chemical compound C*(B(C(CC(*)(N)[Si](*)(*)*)N)*(*(C)C*)=C)*C* 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
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- 239000011718 vitamin C Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
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| KR101214395B1 (ko) | 2005-02-16 | 2012-12-24 | 다우 코닝 코포레이션 | 오가노보란 아민 착체를 사용하는 중합체 입자 및 캡슐화조성물 |
| CN101267949A (zh) * | 2005-09-21 | 2008-09-17 | 陶氏康宁公司 | 使用有机基硼烷胺络合物的环境平版印刷方法 |
| KR101409252B1 (ko) * | 2006-05-23 | 2014-07-03 | 다우 코닝 코포레이션 | 아마이드 작용성 중합체와의 보레인 촉매 착물 및 이로부터제조된 경화성 조성물 |
| US8377852B2 (en) | 2007-10-26 | 2013-02-19 | Dow Corning Corporation | Method of preparing a substrate with a composition including an organoborane initiator |
| US8232350B2 (en) * | 2008-06-02 | 2012-07-31 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
| WO2009148716A2 (en) * | 2008-06-02 | 2009-12-10 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
| KR101665534B1 (ko) * | 2008-07-28 | 2016-10-13 | 다우 코닝 코포레이션 | 복합 물품 |
| JP5206970B2 (ja) * | 2009-01-09 | 2013-06-12 | 信越化学工業株式会社 | 親水化処理基材、親水化処理粉体、及び親水化処理粉体分散液の製造方法 |
| EP2393855B1 (en) | 2009-02-04 | 2015-06-17 | Dow Corning Corporation | Method of forming a non-random copolymer |
| JP6196038B2 (ja) | 2009-10-23 | 2017-09-13 | ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ | 膨潤シリコーンゲルを含むシリコーン組成物 |
| KR20120101015A (ko) | 2009-10-23 | 2012-09-12 | 다우 코닝 코포레이션 | 친수성-개질된 실리콘 조성물 |
| EP2536786B1 (en) | 2010-02-18 | 2015-12-30 | Dow Corning Corporation | Surface-modified hydrogels and hydrogel microparticles |
| JP5684511B2 (ja) * | 2010-08-11 | 2015-03-11 | 三菱樹脂株式会社 | 金属箔積層体、ｌｅｄ搭載用基板及び光源装置 |
| WO2012051487A1 (en) | 2010-10-15 | 2012-04-19 | Dow Corning Corporation | Silicon-containing materials with controllable microstructure |
| US8070046B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Amine flux composition and method of soldering |
| US8070045B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable amine flux composition and method of soldering |
| WO2012092142A1 (en) | 2010-12-27 | 2012-07-05 | Dow Corning Corporation | Curable silicate-siloxane mixed matrix membrane compositions |
| CN103547347A (zh) | 2011-02-16 | 2014-01-29 | 道康宁公司 | 涂覆多孔基材的方法 |
| EP2900354B1 (en) | 2012-09-26 | 2019-04-03 | Dow Silicones Corporation | Method of separating a gas using at least one membrane in contact with an organosilicon fluid |
| CN105916924B (zh) * | 2014-03-25 | 2019-01-11 | 美国陶氏有机硅公司 | 改性的弹性体表面 |
| WO2016028783A1 (en) | 2014-08-18 | 2016-02-25 | Lord Corporation | Method for low temperature bonding of elastomers |
| JP6404645B2 (ja) * | 2014-08-28 | 2018-10-10 | スリーエム イノベイティブ プロパティズ カンパニー | ２液型接着剤及びそれを含む構造体 |
| US11220610B2 (en) | 2014-11-24 | 2022-01-11 | Ppg Industries Ohio, Inc. | Methods for reactive three-dimensional printing by inkjet printing |
| KR101887993B1 (ko) * | 2016-07-27 | 2018-08-13 | 주식회사 엘지화학 | 광경화 수지 조성물 및 이의 용도 |
| JP6294927B1 (ja) * | 2016-09-15 | 2018-03-14 | 日清紡ホールディングス株式会社 | 樹脂組成物及びこれを用いた熱伝導性軟質シート、並びに放熱構造 |
| CN108659029A (zh) * | 2017-04-01 | 2018-10-16 | 中国科学院成都有机化学有限公司 | 一种硅烷偶联剂中间体的制备方法 |
| AU2018279855B2 (en) | 2017-06-09 | 2020-06-18 | Prc-Desoto International, Inc. | Dual cure sealants |
| US12384097B2 (en) | 2017-08-18 | 2025-08-12 | Ppg Industries Ohio, Inc. | Additive manufacturing using reactive compositions |
| US10434704B2 (en) | 2017-08-18 | 2019-10-08 | Ppg Industries Ohio, Inc. | Additive manufacturing using polyurea materials |
| JP7025953B2 (ja) * | 2018-02-22 | 2022-02-25 | デンカ株式会社 | 組成物 |
| JP6927166B2 (ja) * | 2018-07-13 | 2021-08-25 | 信越化学工業株式会社 | 酸素硬化性シリコーン組成物およびその硬化物 |
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-
2005
- 2005-12-13 JP JP2007550372A patent/JP5242168B2/ja not_active Expired - Fee Related
- 2005-12-13 DE DE200560015766 patent/DE602005015766D1/de not_active Expired - Lifetime
- 2005-12-13 AT AT05849542T patent/ATE437899T1/de not_active IP Right Cessation
- 2005-12-13 US US11/791,942 patent/US7928174B2/en not_active Expired - Fee Related
- 2005-12-13 WO PCT/US2005/044947 patent/WO2006073695A1/en not_active Ceased
- 2005-12-13 EP EP05849542A patent/EP1866344B1/en not_active Expired - Lifetime
- 2005-12-13 KR KR1020077015391A patent/KR101249708B1/ko not_active Expired - Fee Related
- 2005-12-30 TW TW94147816A patent/TWI382995B/zh not_active IP Right Cessation
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