JP2008520433A5 - - Google Patents

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Publication number
JP2008520433A5
JP2008520433A5 JP2007543312A JP2007543312A JP2008520433A5 JP 2008520433 A5 JP2008520433 A5 JP 2008520433A5 JP 2007543312 A JP2007543312 A JP 2007543312A JP 2007543312 A JP2007543312 A JP 2007543312A JP 2008520433 A5 JP2008520433 A5 JP 2008520433A5
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JP
Japan
Prior art keywords
microneedles
coating
coating solution
flexible film
microneedle array
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JP2007543312A
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JP2008520433A (ja
JP5015787B2 (ja
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Priority claimed from PCT/US2005/041993 external-priority patent/WO2006055844A2/en
Publication of JP2008520433A publication Critical patent/JP2008520433A/ja
Publication of JP2008520433A5 publication Critical patent/JP2008520433A5/ja
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Claims (10)

  1. 基材および複数のマイクロニードルを有するマイクロニードルアレイを提供する工程と;
    フレキシブルフィルムを提供する工程と;
    キャリア流体およびコーティング材料を含むコーティング溶液を提供する工程と;
    前記フレキシブルフィルムの第1の主面上に前記コーティング溶液を適用する工程と;
    前記フレキシブルフィルムの前記第1の主面を前記マイクロニードルと接触させ、そして前記フレキシブルフィルムを前記マイクロニードルとの接触から解除する転写工程を実行する工程と;
    前記キャリア流体を蒸発させる工程と
    を含む、マイクロニードルアレイのコーティング方法。
  2. 基材および複数のマイクロニードルを有するマイクロニードルアレイを提供する工程と;
    キャリア流体およびコーティング材料を含むコーティング溶液を提供する工程と;
    コーティング基材と、前記マイクロニードルアレイのための支持部材とを含むコーティング装置を提供する工程であって、前記コーティング装置内にて前記コーティング基材および前記マイクロニードルアレイの少なくとも一方がフレキシブルに取り付けられている、工程と;
    前記コーティング基材の第1の主面上に前記コーティング溶液を適用して、前記マイクロニードルのうち少なくとも1つの高さ以下の厚さを有する適用されたコーティング溶液の層を形成する工程と;
    前記コーティング基材の前記第1の主面を前記マイクロニードルと接触させ、そして前記コーティング基材を前記マイクロニードルとの接触から解除することにより、前記コーティング溶液の少なくとも一部を前記マイクロニードルアレイに転写する、転写工程を実行する工程と;
    その転写したキャリア流体を蒸発させる工程と
    を含む、マイクロニードルアレイのコーティング方法。
  3. 前記コーティング基材がフレキシブルに取り付けられており、前記コーティング基材がフレキシブルフィルムである、請求項に記載の方法。
  4. 前記フレキシブルフィルムが前記マイクロニードルと接触する時に、前記マイクロニードルが上方を向きかつ前記フレキシブルフィルム上の前記コーティング溶液が下方を向くように、前記マイクロニードルアレイを配向させる、請求項に記載の方法。
  5. 前記フレキシブルフィルム上の前記コーティング溶液が前記マイクロニードルと接触している間に、前記マイクロニードルを横切って直線方向に前記フレキシブルフィルムが移動する、請求項に記載の方法。
  6. 転写工程中に前記マイクロニードルに転写されるコーティング溶液の量が、0.1μL〜10μLである、請求項に記載の方法。
  7. 乾燥した前記コーティング材料が優先的に前記マイクロニードル上に付着する、請求項に記載の方法。
  8. 前記コーティング溶液が治療剤を含む、請求項1〜のいずれか一項に記載の方法。
  9. 前記コーティング溶液がワクチン、ワクチン補助剤またはそれらの混合物を含む、請求項1〜のいずれか一項に記載の方法。
  10. 前記マイクロニードルアレイがフレキシブルに取り付けられている、請求項3に記載の方法。
JP2007543312A 2004-11-18 2005-11-18 マイクロニードルアレイの接触コーティング法 Active JP5015787B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62918704P 2004-11-18 2004-11-18
US60/629,187 2004-11-18
PCT/US2005/041993 WO2006055844A2 (en) 2004-11-18 2005-11-18 Method of contact coating a microneedle array

Publications (3)

Publication Number Publication Date
JP2008520433A JP2008520433A (ja) 2008-06-19
JP2008520433A5 true JP2008520433A5 (ja) 2009-01-08
JP5015787B2 JP5015787B2 (ja) 2012-08-29

Family

ID=36130000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007543312A Active JP5015787B2 (ja) 2004-11-18 2005-11-18 マイクロニードルアレイの接触コーティング法

Country Status (9)

Country Link
US (2) US8414959B2 (ja)
EP (2) EP2388078B1 (ja)
JP (1) JP5015787B2 (ja)
KR (1) KR101246015B1 (ja)
CN (1) CN101076409B (ja)
AU (1) AU2005306372B2 (ja)
CA (1) CA2587387C (ja)
IL (1) IL183132A (ja)
WO (1) WO2006055844A2 (ja)

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US7627938B2 (en) * 2004-10-15 2009-12-08 Board Of Regents, The Univeristy Of Texas System Tapered hollow metallic microneedle array assembly and method of making and using the same

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