JP2008515182A - Ｃｍｐプロセスにおけるフレキシブル洗浄ステップ - Google Patents

Ｃｍｐプロセスにおけるフレキシブル洗浄ステップ Download PDF

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Publication number
JP2008515182A
JP2008515182A JP2007533018A JP2007533018A JP2008515182A JP 2008515182 A JP2008515182 A JP 2008515182A JP 2007533018 A JP2007533018 A JP 2007533018A JP 2007533018 A JP2007533018 A JP 2007533018A JP 2008515182 A JP2008515182 A JP 2008515182A
Authority
JP
Japan
Prior art keywords
polishing
time
cleaning
processing
cmp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007533018A
Other languages
English (en)
Japanese (ja)
Inventor
ビエ、グェン、ホアン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JP2008515182A publication Critical patent/JP2008515182A/ja
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
JP2007533018A 2004-09-27 2005-09-15 Ｃｍｐプロセスにおけるフレキシブル洗浄ステップ Withdrawn JP2008515182A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04104686 2004-09-27
PCT/IB2005/053043 WO2006035337A1 (en) 2004-09-27 2005-09-15 Flexible rinsing step in a cmp process

Publications (1)

Publication Number Publication Date
JP2008515182A true JP2008515182A (ja) 2008-05-08

Family

ID=35501116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007533018A Withdrawn JP2008515182A (ja) 2004-09-27 2005-09-15 Ｃｍｐプロセスにおけるフレキシブル洗浄ステップ

Country Status (6)

Country Link
EP (1) EP1796873A1 (de)
JP (1) JP2008515182A (de)
KR (1) KR20070055567A (de)
CN (1) CN101065218B (de)
TW (1) TW200624221A (de)
WO (1) WO2006035337A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101663739B (zh) * 2007-04-20 2011-10-26 株式会社荏原制作所 研磨装置
CN109262442A (zh) * 2017-07-18 2019-01-25 中芯国际集成电路制造(上海)有限公司 一种清洗化学机械研磨设备的系统和化学机械研磨系统
KR102434418B1 (ko) * 2022-03-10 2022-08-22 (주)뉴이스트 반도체 웨이퍼의 연마 공정에 사용되는 캐리어 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6293845B1 (en) * 1999-09-04 2001-09-25 Mitsubishi Materials Corporation System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current
WO2001064395A2 (en) * 2000-03-01 2001-09-07 Speedfam-Ipec Corporation A modular control system and method for a cmp tool
US6602724B2 (en) * 2000-07-27 2003-08-05 Applied Materials, Inc. Chemical mechanical polishing of a metal layer with polishing rate monitoring

Also Published As

Publication number Publication date
WO2006035337A1 (en) 2006-04-06
TW200624221A (en) 2006-07-16
CN101065218B (zh) 2011-08-17
KR20070055567A (ko) 2007-05-30
CN101065218A (zh) 2007-10-31
EP1796873A1 (de) 2007-06-20

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