TW200624221A - Flexible rinsing step in a cmp process - Google Patents

Flexible rinsing step in a cmp process

Info

Publication number
TW200624221A
TW200624221A TW094133140A TW94133140A TW200624221A TW 200624221 A TW200624221 A TW 200624221A TW 094133140 A TW094133140 A TW 094133140A TW 94133140 A TW94133140 A TW 94133140A TW 200624221 A TW200624221 A TW 200624221A
Authority
TW
Taiwan
Prior art keywords
cmp process
rinsing step
cmp
flexible
flexible rinsing
Prior art date
Application number
TW094133140A
Other languages
Chinese (zh)
Inventor
Hoang Viet Nguyen
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200624221A publication Critical patent/TW200624221A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

The present invention relates to chemical mechanical planarizing (CMP) and to an apparatus for performing such a CMP process. The method and apparatus according to the invention prevent or at least minimize the time during which a wafer is exposed to air in between two subsequent polishing steps during a CMP process by adjusting the time period of the rinsing steps such that each rinsing step ends at substantially the same time. In that way, damage such as corrosion can be avoided or at least minimized and high quality devices can be achieved.
TW094133140A 2004-09-27 2005-09-23 Flexible rinsing step in a cmp process TW200624221A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04104686 2004-09-27

Publications (1)

Publication Number Publication Date
TW200624221A true TW200624221A (en) 2006-07-16

Family

ID=35501116

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133140A TW200624221A (en) 2004-09-27 2005-09-23 Flexible rinsing step in a cmp process

Country Status (6)

Country Link
EP (1) EP1796873A1 (en)
JP (1) JP2008515182A (en)
KR (1) KR20070055567A (en)
CN (1) CN101065218B (en)
TW (1) TW200624221A (en)
WO (1) WO2006035337A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2141737B1 (en) * 2007-04-20 2013-07-03 Ebara Corporation Polishing apparatus and program thereof
CN109262442A (en) * 2017-07-18 2019-01-25 中芯国际集成电路制造(上海)有限公司 A kind of system and chemical machinery polishing system for cleaning chemical-mechanical grinding device
KR102434418B1 (en) * 2022-03-10 2022-08-22 (주)뉴이스트 Manufacturing Method for Carrier Used in Polishing Wafer for Seimi-Conductor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6293845B1 (en) * 1999-09-04 2001-09-25 Mitsubishi Materials Corporation System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current
WO2001064395A2 (en) * 2000-03-01 2001-09-07 Speedfam-Ipec Corporation A modular control system and method for a cmp tool
US6602724B2 (en) * 2000-07-27 2003-08-05 Applied Materials, Inc. Chemical mechanical polishing of a metal layer with polishing rate monitoring

Also Published As

Publication number Publication date
CN101065218B (en) 2011-08-17
KR20070055567A (en) 2007-05-30
EP1796873A1 (en) 2007-06-20
WO2006035337A1 (en) 2006-04-06
JP2008515182A (en) 2008-05-08
CN101065218A (en) 2007-10-31

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