CN109262442A - A kind of system and chemical machinery polishing system for cleaning chemical-mechanical grinding device - Google Patents
A kind of system and chemical machinery polishing system for cleaning chemical-mechanical grinding device Download PDFInfo
- Publication number
- CN109262442A CN109262442A CN201710586839.1A CN201710586839A CN109262442A CN 109262442 A CN109262442 A CN 109262442A CN 201710586839 A CN201710586839 A CN 201710586839A CN 109262442 A CN109262442 A CN 109262442A
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- China
- Prior art keywords
- cleaning
- chemical
- grinding
- mechanical grinding
- mechanical
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Abstract
The present invention provides a kind of system and chemical machinery polishing system for cleaning chemical-mechanical grinding device, the chemical-mechanical grinding device includes transmission device, for rotating above the grinding table of the chemical-mechanical grinding device to transmit wafer, the system comprises: cleaning device, the cleaning device includes the cleaning sprayer being arranged on the transmission device, and the cleaning sprayer is mobile to clean the chemical-mechanical grinding device with the rotation of the transmission device；And control module, the control module are configured to the cleaning parameters that external command signal controls the cleaning device, the cleaning parameters include at least cleaning time started and cleaning end time.A kind of system and chemical machinery polishing system for cleaning chemical-mechanical grinding device is provided according to the present invention, the full automation of equipment cleaning can be achieved, it is entirely avoided artificial operation realizes the quantization of equipment cleaning, the clean-up performance for improving equipment, improves processing quality.
Description
Technical field
The present invention relates to field of semiconductor manufacture, in particular to a kind of system for cleaning chemical-mechanical grinding device and
Chemical machinery polishing system.
Background technique
With the increase of the diminution of characteristic size and metal interconnection in ic manufacturing process, to wafer surface flatness
Requirement it is also higher and higher.Chemical mechanical grinding (CMP) is the technology for combining mechanical lapping and chemical attack, is most to have at present
The wafer planarization method of effect is widely used in semi-conductor industry manufacture production.
However, processing procedure is continuously increased with semiconductor product type, the semiconductor being related on chemical-mechanical grinding device
Wafer type such as Silicon Wafer, SOI wafer etc. and grinding technics are also continuously increased, and are such as applied to back side illuminaton (BSI) type CMOS and are passed
Sensor technique, integrated CMOS technique+MEMS technology CMEMS technique etc..Continually changing wafer type and technology type, so that
Chemical-mechanical grinding device needs to face the variation of the switching of various lapping liquids, pH value, so that it is residual to form this lapping liquid crystallization
Object is stayed, equipment is polluted.And it is once insufficient to residual inside equipment or the processing of the lapping liquid of crystallization, it will be to next type
Wafer or technique generate pollution.Mainly by the way that various checklists are arranged in technique conversion process in current production, by work
It carries out flowing through the flushing that the environment in the pipeline and equipment of lapping liquid carries out different time in equipment in skill conversion process, so that
Environment needed for equipment enters next technique use.This method, which controls industrial production, requires height, and human factor influence is higher,
Control process is complicated, needs periodically to track, and is unfavorable for producing control.
It is necessary to propose a kind of system for cleaning chemical-mechanical grinding device thus.
Summary of the invention
A series of concept of reduced forms is introduced in Summary, this will in the detailed description section into
One step is described in detail.Summary of the invention is not meant to attempt to limit technical solution claimed
Key feature and essential features do not mean that the protection scope for attempting to determine technical solution claimed more.
The present invention provides a kind of system for cleaning chemical-mechanical grinding device, the chemical-mechanical grinding device includes passing
Dynamic device, for above the grinding table of the chemical-mechanical grinding device rotation to transmit wafer, the system comprises:
Cleaning device, the cleaning device include the cleaning sprayer being arranged on the transmission device, the cleaning sprayer
It moves with the rotation of the transmission device to clean the chemical-mechanical grinding device；And
Control module, the control module are configured to the cleaning ginseng that external command signal controls the cleaning device
Number, the cleaning parameters include at least cleaning time started and cleaning end time；Wherein,
Under the cleaning time started, the control module controls the cleaning device and automatically turns on to the chemical machine
The cleaning of tool milling apparatus；
Under the cleaning end time, the control module controls the cleaning device and is automatically stopped to the chemical machine
The cleaning of tool milling apparatus.
Illustratively, the chemical-mechanical grinding device includes several grinding tables by institute's transmission device interval, institute
Transmission device is stated for transmitting wafer between the different grinding tables；
The transmission device includes the cross transmission arm being arranged in above grinding table and the cross is driven to be driven arm
The driving device of rotation, wherein the grinding table is driven arm interval by the cross；
The cleaning sprayer is set as several cleaning sprayers being arranged on the cross transmission arm, can be with institute
Cross transmission arm is stated to move between different grinding tables to clean each grinding table.
Illustratively, the control module includes control panel, Air Valve Control plate and/or air valve；
The control panel receives the command signal of the outside, and it is described clear that described instruction signal is converted to control control
The control signal that cleaning device cleans the cleaning parameters of the chemical-mechanical grinding device is sent to the Air Valve Control plate, wherein
The control signal of the cleaning parameters include at least the cleaning time started control signal and the cleaning end time
Control signal；
Under the control signal of the cleaning time started, the Air Valve Control plate controls the air valve unlatching and cleans dress
The cleaning to the chemical-mechanical grinding device set；
Under the control signal of the cleaning end time, the Air Valve Control plate controls the air valve stopping and cleans dress
The cleaning to the chemical-mechanical grinding device set.
Illustratively, the cleaning sprayer includes setting corresponding cleaning chemical machinery on cross transmission arm
The grinding head of milling apparatus, grinding table, ground cover cleaning sprayer.
Illustratively, the cleaning sprayer further includes setting corresponding cleaning transmission dress on cross transmission arm
Set the cleaning sprayer of lower section.
Illustratively, the cleaning device further includes the cleaning switching valve being arranged on lapping liquid output channel, described clear
Switching valve is washed for switching in the liquid passed through in the lapping liquid output channel, wherein the liquid includes lapping liquid and cleaning
Liquid.
Illustratively, the cleaning device further includes that grinding above the grinding table of the chemical-mechanical grinding device is arranged in
Mill pad cleaning device.
Illustratively, the grinding pad cleaning device includes high-pressure wash control ring.
Illustratively, the cleaning time started is arranged after the completion of the first chemical mechanical milling tech, the cleaning knot
The beam time is arranged before the second chemical mechanical milling tech starts, first chemical mechanical milling tech and second chemistry
Mechanical milling tech is that same semiconductor crystal wafer carries out front and back phase on different grinding tables on the chemical-mechanical grinding device
Adjacent chemical mechanical milling tech twice, the cleaning device is in the transmission device by the semiconductor crystal wafer by executing described the
First grinding table of one chemical mechanical milling tech is sent to the second grinding table for executing second chemical mechanical milling tech
During the chemical-mechanical grinding device is cleaned.
Illustratively, the pre- timing after the chemical-mechanical grinding device stop process is arranged in the cleaning time started
Between after.
Illustratively, the predetermined time is 4~6 hours.
Illustratively, the cleaning end time is arranged before the chemical-mechanical grinding device starts technique.
Illustratively, the cleaning parameters further include cleaning solution type, grinding flow quantity.
The present invention also provides a kind of chemical machinery polishing system, the system comprises chemical-mechanical grinding devices and above-mentioned
The system of chemical-mechanical grinding device is cleaned described in any one.
In conclusion the cleaning system and chemical machinery polishing system of chemical-mechanical grinding device according to the present invention, one
The full automation of equipment cleaning can be achieved in aspect, it is entirely avoided artificial operation, a possibility that substantially reducing maloperation,
On the other hand the quantization of equipment cleaning is realized, to improve the clean-up performance of equipment, reduces chemical mechanical milling tech and lack
It falls into, improves product quality.Meanwhile realizing during transmitting wafer, chemical-mechanical grinding device is cleaned, from
And cleaning area coverage is increased, it avoids lapping liquid from crystallizing, improves cleaning quality, reduce scavenging period, improve yield.
Detailed description of the invention
Following drawings of the invention is incorporated herein as part of the present invention for the purpose of understanding the present invention.Shown in the drawings of this hair
Bright embodiment and its description, principle used to explain the present invention.
In attached drawing:
Fig. 1 is clear according to the cleaning sprayer and high pressure that are arranged on transmission device in the cleaning device of the embodiment of the present invention
Wash the schematic diagram of control ring；
Fig. 2 be it is according to the present invention cleaning chemical-mechanical grinding device cleaning systems chemical-mechanical grinding device with do not adopt
On the chemical-mechanical grinding device cleaned with cleaning system of the invention, semiconductor crystal wafer is after carrying out chemical mechanical milling tech
The defect concentration comparison diagram on surface.
Specific embodiment
In the following description, a large amount of concrete details are given so as to provide a more thorough understanding of the present invention.So
And it is obvious to the skilled person that the present invention may not need one or more of these details and be able to
Implement.In other examples, in order to avoid confusion with the present invention, for some technical characteristics well known in the art not into
Row description.
In order to thoroughly understand the present invention, detailed description will be proposed in following description, to illustrate of the present invention half
Conductor device manufacturing method.Obviously, the technical staff that execution of the invention is not limited to semiconductor field is familiar with special thin
Section.Presently preferred embodiments of the present invention is described in detail as follows, however other than these detailed descriptions, the present invention can also have other
Embodiment.
It should give it is noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to exemplary embodiment of the present invention.As used herein, unless the context clearly indicates otherwise, otherwise singular
It is intended to include plural form.Additionally, it should be understood that when using term "comprising" and/or " comprising " in the present specification
When, indicate that there are the feature, entirety, step, operation, element and/or component, but do not preclude the presence or addition of one or more
Other a features, entirety, step, operation, element, component and/or their combination.
Now, an exemplary embodiment of the present invention is more fully described with reference to the accompanying drawings.However, these exemplary realities
Applying example can be implemented with many different forms, and should not be construed to be limited solely to the embodiments set forth herein.It should
These embodiments that are to provide understood are in order to enable disclosure of the invention is thoroughly and complete, and by these exemplary implementations
The design of example is fully conveyed to those of ordinary skill in the art.In the accompanying drawings, for the sake of clarity, the thickness of layer and region is exaggerated
Degree, and make that identical element is presented with like reference characters, thus description of them will be omitted.
Continually changing wafer type and technology type, so that chemical-mechanical grinding device needs to face various lapping liquids
Switching, the variation of pH value pollute equipment to form this lapping liquid crystalline residue.And once to inside equipment
Residual or the processing of the lapping liquid of crystallization are insufficient, will generate pollution to next type wafer or technique.Mainly lead in current production
It crosses in technique conversion process and various checklists is set, pass through the pipe for carrying out flowing through lapping liquid in equipment in technique conversion process
Environment in road and equipment carries out the flushing of different time so that equipment enter next technique use needed for environment.It is this
Method, which controls industrial production, requires height, and human factor influence is higher, and control process is complicated, needs periodically to track, is unfavorable for giving birth to
Produce control.
For this purpose, the present invention provides a kind of system for cleaning chemical-mechanical grinding device, the chemical-mechanical grinding device
Including transmission device, for rotating above the grinding table of the chemical-mechanical grinding device to transmit wafer, the system packet
It includes:
Cleaning device, the cleaning device include the cleaning sprayer being arranged on the transmission device, the cleaning sprayer
It moves with the rotation of the transmission device to clean the chemical-mechanical grinding device；And
Control module, the control module are configured to the cleaning ginseng that external command signal controls the cleaning device
Number, the cleaning parameters include at least cleaning time started and cleaning end time；Wherein,
Under the cleaning time started, the control module controls the cleaning device and automatically turns on to the chemical machine
The cleaning of tool milling apparatus；
Under the cleaning end time, the control module controls the cleaning device and is automatically stopped to the chemical machine
The cleaning of tool milling apparatus.
On the one hand the fully automated of equipment cleaning can be achieved in the cleaning system of chemical-mechanical grinding device according to the present invention
Change, it is entirely avoided artificial operation, a possibility that substantially reducing maloperation, on the other hand realize the amount of equipment cleaning
Change, to improve the clean-up performance of equipment, reduces chemical mechanical milling tech defect, improve product quality.Meanwhile it realizing
During transmitting wafer, chemical-mechanical grinding device is cleaned, to increase cleaning area coverage, avoids grinding
Grinding fluid crystallization, improves cleaning quality, reduces scavenging period, improves yield.
Embodiment one
It is described referring now to system of the Fig. 1 and Fig. 2 to a kind of cleaning chemical-mechanical grinding device of the invention；Its
In, Fig. 1 is according to the cleaning sprayer and high-pressure wash control being arranged on transmission device in the cleaning device of the embodiment of the present invention
The schematic diagram of ring processed；Fig. 2 is the cleaning systems chemical-mechanical grinding device of cleaning chemical-mechanical grinding device according to the present invention
On the chemical-mechanical grinding device not using cleaning system cleaning of the invention, semiconductor crystal wafer is carrying out chemical mechanical grinding
The defect concentration comparison diagram of technique rear surface.
The present invention provides a kind of systems for cleaning chemical-mechanical grinding device, and the system comprises be arranged in chemical machinery
Transmission device on milling apparatus.The chemical-mechanical grinding device can be any carry out chemical mechanical grinding in the prior art
Equipment.Illustratively, the chemical-mechanical grinding device includes grinding table and the grinding pad for being fixed on the grinding table surface,
The grinding table can be such that the grinding pad rotates；Grinding head, the grinding head can clamp wafer and keep the wafer to be ground
Surface contacts downwards grinding pad, and the relative motion between the grinding pad；And lapping liquid feeder, the lapping liquid supply
Device is provided with slurry nozzle, to spray the lapping liquid to grinding pad.
Illustratively, the chemical-mechanical grinding device includes several grinding tables by institute's transmission device interval, institute
Transmission device is stated for transmitting wafer between the different grinding tables；The transmission device includes being arranged in above grinding table
Cross is driven arm and drives the driving device of the cross transmission arm rotation, wherein the grinding table is driven by the cross
Arm interval；The cleaning sprayer is set as several cleaning sprayers being arranged on cross transmission arm, can be with
The cross transmission arm moves between different grinding tables to clean to each grinding table.
It include that there are three grinding table 101-1,101-2,101-3 on chemical-mechanical grinding device, respectively to right referring to Fig. 1
It should be arranged between three grinding tables in three grinding heads 100-1,100-2,100-3 of support wafer, transmission device, it will
Three grinding table intervals, the transmission device is for transmitting wafer between three grinding tables.The transmission device
Including cross transmission arm 102 and the driving device (not shown) for driving the cross transmission arm 102 to rotate.The driving dress
It sets and can be any power device to the cross transmission offer rotational power of arm 102, such as drive motor.Described three are ground
Mill platform 101-1,101-2,101-3 is spaced by cross transmission arm 102.It is to be appreciated that the present embodiment is to have three
The chemical-mechanical grinding device of a grinding table is illustrated for example, is only exemplary, any chemical-mechanical grinding device,
With being rotated above grinding table to be driven the transmission device of wafer, it is suitable for the present invention.Also, it is understood that this
Transmission device is set cross transmission arm by embodiment and driving device is also only exemplary, any in chemical machine
The transmission device that wafer is driven on tool milling apparatus is suitable for the present invention.
The system of the cleaning chemical-mechanical grinding device further includes cleaning device, and the cleaning device includes being arranged in institute
The cleaning sprayer on transmission device is stated, the cleaning sprayer is mobile to clean the chemistry with the rotation of the transmission device
Mechanical grinding device.With continued reference to Fig. 1, it is provided with cleaning sprayer 103 on the cross transmission arm 102 of transmission device, thus
Cleaning sprayer 103 can be driven the transmission of arm 102 with cross and rotate, to realize to the clear of the chemical-mechanical grinding device
It washes.The cleaning sprayer is moved with the transmission of the transmission device, on the one hand increases the flexibility of cleaning device cleaning, is increased
Add the area coverage of cleaning.On the other hand, it realizes and is driven between different grinding plates in technique conversion process, in wafer
In the process, chemical-mechanical grinding device is cleaned, make inside equipment, cover board environment etc. by cleaning with keep wet, keep away
Exempting from lapping liquid crystallization influences next technique, improves cleaning quality, reduces scavenging period, improve yield.
Illustratively, the cleaning sprayer includes setting corresponding cleaning chemical machinery on cross transmission arm
The grinding head of milling apparatus, grinding table, ground cover cleaning sprayer.With continued reference to Fig. 1, setting is on cross transmission arm 102
Corresponding cleaning grinding table 101-1,101-2, the 101-3 of cleaning sprayer 103 and each grinding table on grinding head 100-1,100-
2, the chemical-mechanical grinding devices such as 100-3 and ground cover (not shown), while to realize to each grinding table and grinding head
Cleaning.Meanwhile cleaning sprayer 103 further includes that setting corresponds under the cleaning transmission device on cross transmission arm 102
The cleaning sprayer of side, to realize the cleaning to transmission device.It is to be appreciated that the setting form of the cleaning sprayer can make
Any form, including cleaning sprayer is fixed on cross transmission arm, sets cleaning sprayer to that direction is adjustable, angle
Adjustable a variety of spray heads etc., cleaning sprayer also can be set into that atomizer etc. is various can to spray cleaning solution, to chemical machinery
The spray head of the corresponding cleaning of all parts of milling apparatus, those skilled in the art, which can according to need, to be configured.Meanwhile it cleaning
The setting of spray head arm outside or inside progress cleaning solution supplying device can be driven by cross and cleaning solution supplying pipeline is set
It sets.Illustratively, cross transmission arm is set as hollow pipeline, to the cleaning solution that circulates；It is set on cross transmission arm
Cleaning sprayer is set, the cleaning solution for flowing through cross transmission arm is sprayed to all parts of chemical-mechanical grinding device to realize
Cleaning to chemical-mechanical grinding device.
The cleaning system of institute's chemical-mechanical grinding device further includes control module, and the control module is configured to outside
Command signal control the cleaning parameters that the cleaning device cleans the chemical-mechanical grinding device, the cleaning parameters are at least
Including cleaning time started and cleaning end time；Wherein, under the cleaning time started, described in the control module control
Cleaning device automatically turns on the cleaning to the chemical-mechanical grinding device；Under the cleaning end time, the control mould
Block controls the cleaning device and is automatically stopped cleaning to the chemical-mechanical grinding device.The control module control is described clear
Cleaning device, which is automatically turned on, can realize the fully automated of equipment cleaning to cleaning the party face of the chemical-mechanical grinding device
Change, it is entirely avoided artificial operation, a possibility that substantially reducing maloperation, on the other hand realize the amount of equipment cleaning
Change, to improve the clean-up performance of equipment, reduces chemical mechanical milling tech defect, improve product quality.
Illustratively, control module includes control panel, Air Valve Control plate and/or air valve.Illustratively, the control panel connects
It is converted to described in control control by the command signal that the operable computer program instruction issues, and by described instruction signal
Cleaning device cleans the control signal of the cleaning parameters of the chemical-mechanical grinding device, and the cleaning parameters include that cleaning starts
Time and cleaning end time.The control signal of the control cleaning parameters is sent to Air Valve Control by the control panel
Plate, under the control signal of the cleaning time started, the Air Valve Control plate controls the air valve and opens institute's cleaning device
Cleaning to the chemical-mechanical grinding device；Under the control signal of the cleaning end time, the Air Valve Control plate control
Make the cleaning to the chemical-mechanical grinding device that the air valve stops institute's cleaning device.It is to be appreciated that the control
Module is only exemplary the control of the cleaning device using control panel, Air Valve Control plate and/or air valve, any to incite somebody to action
The command signal of operable computer program instruction is converted into control signal, and is controlled by controlling signal to cleaning device
The control module of system is suitable for the present invention.
Illustratively, the cleaning device further includes the cleaning switching valve being arranged on lapping liquid output channel, described clear
Switching valve is washed for switching in the liquid passed through in the lapping liquid output channel, wherein the liquid includes lapping liquid and cleaning
Liquid.The cleaning switching valve under the control of control module, may be implemented the switching between lapping liquid and cleaning solution, clean
Under time started, control module control cleaning switching Vavle switching, so that the cleaning solution that circulates in lapping liquid output channel, thus to grinding
Grinding fluid output channel is cleaned；In the case where cleaning the end time, control module control cleaning switching Vavle switching, so that lapping liquid is defeated
Circulate in pipeline lapping liquid out, to enter chemical mechanical milling tech.
Illustratively, the cleaning device further includes that grinding above the grinding table of the chemical-mechanical grinding device is arranged in
Mill pad cleaning device, to carry out individually cleaning to grinding pad, pollution and particle on grinding pad are often that chemical mechanical grinding lacks
Sunken important sources, carrying out independent emphasis cleaning to grinding pad may further ensure that the cleannes of grinding pad.Illustratively, institute
Stating grinding pad cleaning device includes high-pressure wash control ring, and the high-pressure wash control ring will spray after cleaning solution high-pressure atomization,
Expand grinding pad cleaning area and dynamics, is cleaned comprehensively to realize to easily forming remaining grinding pad, further promotion
The quality of cleaning.With continued reference to Fig. 1, the cleaning device further includes high-pressure wash control ring 104-1,104-2, to grinding table
Grinding pad on 101-1 and grinding table 101-2 carries out emphasis cleaning.It is to be appreciated that the chemical-mechanical grinding device
The setting of cleaning switching valve and high-pressure wash ring in cleaning device in cleaning system is only exemplary, any to can be achieved
The cleaning device cleaned comprehensively to chemical-mechanical grinding device is suitable for the present invention.
It is to be appreciated that setting corresponding cleaning chemical machinery on grinding arm in the present embodiment for cleaning device and grinding
Grind the grinding head of equipment, grinding table, ground cover cleaning sprayer, the cleaning sprayer below corresponding cleaning transmission device, setting exists
Cleaning switching valve and grinding pad cleaning device on lapping liquid output channel, to each of the chemical-mechanical grinding device
Component carries out as purpose is arranged, and those skilled in the art can according to need position and the quantity of setting cleaning sprayer, Yi Jishe
Set the form of other cleaning devices.
Illustratively, the cleaning time started is arranged after the completion of the first chemical mechanical milling tech, the cleaning knot
The beam time is arranged before the second chemical mechanical milling tech starts, first chemical mechanical milling tech and second chemistry
Mechanical milling tech is that same semiconductor crystal wafer carries out front and back phase on different grinding tables on the chemical-mechanical grinding device
Adjacent chemical mechanical milling tech twice, the cleaning device is in the transmission device by the semiconductor crystal wafer by executing described the
First grinding table of one chemical mechanical milling tech is sent to the second grinding table for executing second chemical mechanical milling tech
During the chemical-mechanical grinding device is cleaned.
As shown in Figure 1, show according to one embodiment of present invention, illustratively, the cleaning time started setting
After carrying out the first chemical mechanical milling tech completion on grinding table 101-1 for grinding head 100-1 aid wafer, grinding head
100-1 aid wafer, which is resent on grinding table 101-2, to carry out before the second chemical mechanical milling tech starts, thus grinding head
After the wafer of 100-1 aid completes the first chemical mechanical milling tech on grinding table 101-1, it is being sent to grinding table 101-
The cleaning sprayer 103 being arranged on cross transmission arm 102 during on 2 is opened to grinding table 101-1,101-2,101-3
Cleaning.It does so, on the one hand, reduce the cleaning waiting time, increase the degree of automation of equipment cleaning, improve equipment utilization effect
Rate；On the other hand, in technique conversion process, wafer equipment is cleaned in transmission process between different grinding tables, make
Inside equipment, cover board environment etc. by cleaning with keep wet, avoid lapping liquid from crystallizing, influence next technique.Meanwhile it is this
The cleaning process being performed fully automatic is further reduced a possibility that maloperation during manual operation, realizes that different process switched
Automatic cleaning process in journey increases the stability of equipment cleaning, different process is reduced, caused by different grinding wafer technique switchings
Pollution promotes chemical mechanical grinding quality.
Illustratively, the pre- timing after the chemical-mechanical grinding device stop process is arranged in the cleaning time started
Between after.In dry environments, equipment off position tends to occur the crystallization of grinding liquid material, and the setting of cleaning time started is existed
After predetermined time after the chemical-mechanical grinding device stop process, so as to avoid avoiding equipment because for a long time
It does not work and environment variation, influences chemical mechanical grinding quality next time, increase chemical mechanical grinding next time and scrape probability, shadow
Ring yield.Started to crystallize at 6 hours or so based on existing lapping liquid, can will be set as the predetermined time 4~6 hours, it is on the one hand anti-
Only lapping liquid crystallizes, and on the other hand avoids unnecessary waste.Illustratively, the predetermined time is 5 hours, and cleaning terminates
The 5min after cleaning starts is arranged in time, will be set as the predetermined time that lapping liquid can be prevented within 5 hours sufficiently sharp while crystallization
With cleaning solution, and it is unlikely to that cleaning solution is caused to waste.Illustratively, the cleaning systems of the cleaning chemical-mechanical grinding device
The process of chemical-mechanical grinding device continues 5min, further avoids causing to waste to cleaning solution.
Illustratively, the cleaning end time is arranged before chemical mechanical milling tech starts.To make chemical machine
Before tool grinding technics starts, chemical-mechanical grinding device is cleaned and keeps wet.Illustratively, the cleaning device exists
Stop the cleaning to the chemical-mechanical grinding device under the control of control module, it can also be further at the end of the cleaning
Between under, setting chemical mechanical milling tech starts, so that chemical-mechanical grinding device is from cleaning state automatically into technique shape
State.Progress is alternated to form grinding technics-cleaning process-grinding technics-cleaning process of Chemical mechanical equipment.
Illustratively, the cleaning parameters further include cleaning solution type, cleaning solution flow to adjust the cleaning device
On the one hand the type of cleaning solution in cleaning process, flow make chemical-mechanical grinding device cleaning sufficiently, promote cleaning quality,
Unnecessary waste is caused when on the other hand reducing cleaning chemical-mechanical grinding device, is further reduced production cost.
Fig. 2 shows the cleaning systems chemical-mechanical grinding devices of cleaning chemical-mechanical grinding device according to the present invention
On the chemical-mechanical grinding device not using cleaning system cleaning of the invention, semiconductor crystal wafer is carrying out chemical mechanical grinding
The defect concentration comparison diagram of technique rear surface, in figure, curve a is that semiconductor crystal wafer is ground using cleaning chemical machinery of the invention
The surface defect density after grinding on the chemical-mechanical grinding device of the cleaning systems of equipment is ground, curve b is that semiconductor crystal wafer exists
The surface defect density after grinding on chemical-mechanical grinding device is cleaned in the prior art, it can be seen that using of the invention clear
After washing the chemical-mechanical grinding device of the cleaning systems of chemical-mechanical grinding device, the defect concentration of semiconductor wafer surface is significant
It reduces.
Embodiment two
The present invention also provides a kind of chemical machinery polishing systems, the system comprises chemical-mechanical grinding device and strictly according to the facts
The system for applying cleaning chemical-mechanical grinding device described in example one kind.Chemical machinery polishing system according to the present invention, Ke Yishi
The full automation of existing chemical mechanical milling tech and equipment cleaning.
In conclusion the cleaning system and chemical machinery polishing system of chemical-mechanical grinding device according to the present invention, one
The full automation of equipment cleaning can be achieved in aspect, it is entirely avoided artificial operation, a possibility that substantially reducing maloperation,
On the other hand the quantization of equipment cleaning is realized, to improve the clean-up performance of equipment, reduces chemical mechanical milling tech and lack
It falls into, improves product quality.Meanwhile realizing during transmitting wafer, chemical-mechanical grinding device is cleaned, from
And cleaning area coverage is increased, it avoids lapping liquid from crystallizing, improves cleaning quality, reduce scavenging period, improve yield.
The present invention has been explained by the above embodiments, but it is to be understood that, above-described embodiment is only intended to
The purpose of citing and explanation, is not intended to limit the invention to the scope of the described embodiments.Furthermore those skilled in the art
It is understood that the present invention is not limited to the above embodiments, introduction according to the present invention can also be made more kinds of member
Variants and modifications, all fall within the scope of the claimed invention for these variants and modifications.Protection scope of the present invention by
The appended claims and its equivalent scope are defined.
Claims (14)
1. a kind of system for cleaning chemical-mechanical grinding device, which is characterized in that the chemical-mechanical grinding device includes transmission
Device, for above the grinding table of the chemical-mechanical grinding device rotation to transmit wafer, the system comprises:
Cleaning device, the cleaning device include the cleaning sprayer being arranged on the transmission device, the cleaning sprayer with
The rotation of the transmission device and it is mobile to clean the chemical-mechanical grinding device；And
Control module, the control module are configured to the cleaning parameters that external command signal controls the cleaning device,
The cleaning parameters include at least cleaning time started and cleaning end time；Wherein,
Under the cleaning time started, the control module controls the cleaning device automatic opening and grinds to the chemical machinery
Grind the cleaning of equipment；
Under the cleaning end time, the control module control cleaning device, which is automatically stopped, grinds the chemical machinery
Grind the cleaning of equipment.
2. the system as claimed in claim 1, which is characterized in that the chemical-mechanical grinding device includes several by being driven dress
The grinding table at interval is set, the transmission device is used to transmit wafer between the different grinding tables；
The transmission device includes the cross transmission arm being arranged in above grinding table and the cross transmission arm is driven to rotate
Driving device, wherein the grinding table by the cross be driven arm interval；
The cleaning sprayer is set as several cleaning sprayers being arranged on the cross transmission arm, can be with described ten
Word is driven arm and moves between different grinding tables to clean to each grinding table.
3. the system as claimed in claim 1, which is characterized in that the control module include control panel, Air Valve Control plate and/or
Air valve；
The control panel receives the command signal of the outside, and described instruction signal is converted to control and controls the cleaning dress
It sets and cleans the control signals of the cleaning parameters of the chemical-mechanical grinding device and be sent to the Air Valve Control plate, wherein is described
The control signal of cleaning parameters includes at least control signal and the control of the cleaning end time of the cleaning time started
Signal；
Under the control signal of the cleaning time started, the Air Valve Control plate controls the air valve and opens institute's cleaning device
Cleaning to the chemical-mechanical grinding device；
Under the control signal of the cleaning end time, the Air Valve Control plate controls the air valve and stops institute's cleaning device
Cleaning to the chemical-mechanical grinding device.
4. system as claimed in claim 2, which is characterized in that the cleaning sprayer includes setting in cross transmission arm
The upper corresponding grinding head for cleaning the chemical-mechanical grinding device, grinding table, ground cover cleaning sprayer.
5. system as claimed in claim 2, which is characterized in that the cleaning sprayer further includes setting in cross transmission hand
The corresponding cleaning sprayer cleaned below the transmission device on arm.
6. the system as claimed in claim 1, which is characterized in that the cleaning device further includes being arranged in lapping liquid output channel
On cleaning switching valve, the cleaning switching valve is for switching in the liquid passed through in the lapping liquid output channel, wherein institute
Stating liquid includes lapping liquid and cleaning solution.
7. the system as claimed in claim 1, which is characterized in that the cleaning device further includes that setting is ground in the chemical machinery
Grind the grinding pad cleaning device above the grinding table of equipment.
8. system as claimed in claim 5, which is characterized in that the grinding pad cleaning device includes high-pressure wash control ring.
9. system as claimed in claim 3, which is characterized in that the cleaning time started is arranged in the first chemical mechanical grinding
After the completion of technique, the cleaning end time is arranged before the second chemical mechanical milling tech starts, first chemical machinery
Grinding technics and second chemical mechanical milling tech be same semiconductor crystal wafer on the chemical-mechanical grinding device not
The adjacent chemical mechanical milling tech twice with the front and back carried out on grinding table, the cleaning device will be described in the transmission device
Semiconductor crystal wafer is sent to by the first grinding table for executing first chemical mechanical milling tech executes the described second chemical machine
The chemical-mechanical grinding device is cleaned during second grinding table of tool grinding technics.
10. the system as claimed in claim 1, which is characterized in that the cleaning time started setting is ground in the chemical machinery
After predetermined time after grinding equipment stop process.
11. system as claimed in claim 10, which is characterized in that the predetermined time is 4~6 hours.
12. the system as claimed in claim 1, which is characterized in that the cleaning end time setting is ground in the chemical machinery
Mill equipment starts before technique.
13. the system as claimed in claim 1, which is characterized in that the cleaning parameters further include cleaning solution type, grinding liquid stream
Amount.
14. a kind of chemical machinery polishing system, which is characterized in that wanted the system comprises chemical-mechanical grinding device and such as right
Seek the system that chemical-mechanical grinding device is cleaned described in 1-13 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710586839.1A CN109262442A (en) | 2017-07-18 | 2017-07-18 | A kind of system and chemical machinery polishing system for cleaning chemical-mechanical grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710586839.1A CN109262442A (en) | 2017-07-18 | 2017-07-18 | A kind of system and chemical machinery polishing system for cleaning chemical-mechanical grinding device |
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| Publication Number | Publication Date |
|---|---|
| CN109262442A true CN109262442A (en) | 2019-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710586839.1A Pending CN109262442A (en) | 2017-07-18 | 2017-07-18 | A kind of system and chemical machinery polishing system for cleaning chemical-mechanical grinding device |
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| Country | Link |
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| CN (1) | CN109262442A (en) |
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| CN114012604A (en) * | 2021-10-27 | 2022-02-08 | 长鑫存储技术有限公司 | Method and system for cleaning grinding pad, electronic equipment and storage medium |
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