JP2008510180A5 - - Google Patents

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Publication number
JP2008510180A5
JP2008510180A5 JP2007525614A JP2007525614A JP2008510180A5 JP 2008510180 A5 JP2008510180 A5 JP 2008510180A5 JP 2007525614 A JP2007525614 A JP 2007525614A JP 2007525614 A JP2007525614 A JP 2007525614A JP 2008510180 A5 JP2008510180 A5 JP 2008510180A5
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Japan
Prior art keywords
tool
cavities
cutting
substrate
forming
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JP2007525614A
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English (en)
Japanese (ja)
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JP2008510180A (ja
JP4922935B2 (ja
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Priority claimed from US10/915,632 external-priority patent/US20050024849A1/en
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Publication of JP2008510180A5 publication Critical patent/JP2008510180A5/ja
Application granted granted Critical
Publication of JP4922935B2 publication Critical patent/JP4922935B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2007525614A 2004-08-10 2005-06-28 光学フィルム、構成要素または導波管の製作に使用するために基板にキャビティを切削または形成する方法 Expired - Fee Related JP4922935B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/915,632 US20050024849A1 (en) 1999-02-23 2004-08-10 Methods of cutting or forming cavities in a substrate for use in making optical films, components or wave guides
US10/915,632 2004-08-10
PCT/US2005/022886 WO2006023077A2 (en) 2004-08-10 2005-06-28 Methods of cutting or forming cavities in a substrate for use in making optical films, components or wave guides

Publications (3)

Publication Number Publication Date
JP2008510180A JP2008510180A (ja) 2008-04-03
JP2008510180A5 true JP2008510180A5 (enExample) 2008-08-07
JP4922935B2 JP4922935B2 (ja) 2012-04-25

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ID=35968017

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JP2007525614A Expired - Fee Related JP4922935B2 (ja) 2004-08-10 2005-06-28 光学フィルム、構成要素または導波管の製作に使用するために基板にキャビティを切削または形成する方法

Country Status (7)

Country Link
US (2) US20050024849A1 (enExample)
EP (1) EP1779162A4 (enExample)
JP (1) JP4922935B2 (enExample)
KR (1) KR101185616B1 (enExample)
CN (1) CN101039796B (enExample)
TW (1) TWI378278B (enExample)
WO (1) WO2006023077A2 (enExample)

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