JP2017188528A5 - - Google Patents

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Publication number
JP2017188528A5
JP2017188528A5 JP2016075046A JP2016075046A JP2017188528A5 JP 2017188528 A5 JP2017188528 A5 JP 2017188528A5 JP 2016075046 A JP2016075046 A JP 2016075046A JP 2016075046 A JP2016075046 A JP 2016075046A JP 2017188528 A5 JP2017188528 A5 JP 2017188528A5
Authority
JP
Japan
Prior art keywords
plate
electrode member
substrate
conductor pattern
bonding region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016075046A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017188528A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016075046A priority Critical patent/JP2017188528A/ja
Priority claimed from JP2016075046A external-priority patent/JP2017188528A/ja
Publication of JP2017188528A publication Critical patent/JP2017188528A/ja
Publication of JP2017188528A5 publication Critical patent/JP2017188528A5/ja
Pending legal-status Critical Current

Links

JP2016075046A 2016-04-04 2016-04-04 半導体装置 Pending JP2017188528A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016075046A JP2017188528A (ja) 2016-04-04 2016-04-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016075046A JP2017188528A (ja) 2016-04-04 2016-04-04 半導体装置

Publications (2)

Publication Number Publication Date
JP2017188528A JP2017188528A (ja) 2017-10-12
JP2017188528A5 true JP2017188528A5 (enExample) 2019-05-09

Family

ID=60045716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016075046A Pending JP2017188528A (ja) 2016-04-04 2016-04-04 半導体装置

Country Status (1)

Country Link
JP (1) JP2017188528A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021100199A1 (ja) * 2019-11-22 2021-05-27 三菱電機株式会社 半導体装置およびその製造方法ならびに電力変換装置
JP7438071B2 (ja) * 2020-09-15 2024-02-26 株式会社東芝 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156560U (enExample) * 1988-04-21 1989-10-27
JPH05315490A (ja) * 1992-05-07 1993-11-26 Fuji Electric Co Ltd 半導体素子
JP2007096004A (ja) * 2005-09-29 2007-04-12 Toshiba Corp 半導体装置
WO2015107871A1 (ja) * 2014-01-15 2015-07-23 パナソニックＩｐマネジメント株式会社 半導体装置

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