JP2008508180A - 脆い材料の罫書き方法および装置 - Google Patents
脆い材料の罫書き方法および装置 Download PDFInfo
- Publication number
- JP2008508180A JP2008508180A JP2007523586A JP2007523586A JP2008508180A JP 2008508180 A JP2008508180 A JP 2008508180A JP 2007523586 A JP2007523586 A JP 2007523586A JP 2007523586 A JP2007523586 A JP 2007523586A JP 2008508180 A JP2008508180 A JP 2008508180A
- Authority
- JP
- Japan
- Prior art keywords
- glass sheet
- laser
- heating zone
- glass
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/304—Including means to apply thermal shock to work
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
レーザービームの出力密度、
レーザービームによって生成される加熱ゾーンの寸法および形状、
加熱ゾーンと材料との相対的移動速度、
加熱されたゾーンに対する冷媒の物理的特性、質および供給条件、
クラックが施される材料の熱物理的および機械的特性、その厚さおよびその表面の状態。
16 クラック始点
18 クラック
20 加熱ゾーン
22 罫書き経路
24 冷媒
26 ノズル
32,44,50 光学素子
34 アクチュエータ
38 レーザービーム
40 レーザー
62 コリメータ
Claims (5)
- ほぼガウス分布的強度プロファイルを有する連続的に放射するレーザービームを1本の軸線の周りで円形軌道を描いて移動させるステップと、
前記レーザービームを少なくとも1個の光学素子を通じて導き、これにより前記円形ビーム軌道を細長いビーム軌道に変換するステップと、
変換されたビームをガラスシート上に衝突させ、これにより加熱ゾーンの中心部分内に最低温度を有する細長い加熱ゾーンを形成するステップと、
を含むことを特徴とする、平坦なガラスシートの罫書き方法。 - 前記移動させるステップが、前記連続的に放射するレーザービームを、回転する光学素子を通じて屈折させることを含むことを特徴とする請求項1記載の方法。
- 前記光学素子が複数のファセットを備えていることを特徴とする請求項2記載の方法。
- 前記移動させるステップが、前記連続的に放射するレーザービームを、動いているミラーから反射させることを含むことを特徴とする請求項1記載の方法。
- レーザーと前記ミラーとの間のビームの長さが変化するにつれて、前記円形軌道の半径が変化することを特徴とする請求項4記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/903,701 US7820941B2 (en) | 2004-07-30 | 2004-07-30 | Process and apparatus for scoring a brittle material |
US10/903,701 | 2004-07-30 | ||
PCT/US2005/023986 WO2006023133A2 (en) | 2004-07-30 | 2005-07-06 | Process and apparatus for scoring a brittle material |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008508180A true JP2008508180A (ja) | 2008-03-21 |
JP5016488B2 JP5016488B2 (ja) | 2012-09-05 |
Family
ID=35730972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007523586A Expired - Fee Related JP5016488B2 (ja) | 2004-07-30 | 2005-07-06 | 脆い材料の罫書き方法および装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7820941B2 (ja) |
EP (1) | EP1771283A4 (ja) |
JP (1) | JP5016488B2 (ja) |
KR (1) | KR101148637B1 (ja) |
CN (1) | CN100515651C (ja) |
TW (1) | TWI274743B (ja) |
WO (1) | WO2006023133A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011011917A (ja) * | 2009-06-30 | 2011-01-20 | Mitsuboshi Diamond Industrial Co Ltd | レーザ光によるガラス基板加工装置 |
JP2012017231A (ja) * | 2010-07-09 | 2012-01-26 | Mitsuboshi Diamond Industrial Co Ltd | レーザ光によるガラス基板加工装置 |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060021977A1 (en) * | 2004-07-30 | 2006-02-02 | Menegus Harry E | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
US20060249553A1 (en) * | 2005-05-06 | 2006-11-09 | Ljerka Ukrainczyk | Ultrasonic induced crack propagation in a brittle material |
JP2007275962A (ja) * | 2006-04-10 | 2007-10-25 | Disco Abrasive Syst Ltd | レーザー加工装置 |
CN101121220A (zh) * | 2006-08-11 | 2008-02-13 | 富士迈半导体精密工业(上海)有限公司 | 脆性材料基板切割方法 |
US7982162B2 (en) * | 2007-05-15 | 2011-07-19 | Corning Incorporated | Method and apparatus for scoring and separating a brittle material with a single beam of radiation |
US7971012B2 (en) * | 2007-05-15 | 2011-06-28 | Pitney Bowes Inc. | Mail processing computer automatic recovery system and method |
US20090085254A1 (en) * | 2007-09-28 | 2009-04-02 | Anatoli Anatolyevich Abramov | Laser scoring with flat profile beam |
US20090178298A1 (en) * | 2008-01-15 | 2009-07-16 | Anatoli Anatolyevich Abramov | Device for fluid removal after laser scoring |
JP5308718B2 (ja) | 2008-05-26 | 2013-10-09 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
WO2009150976A1 (ja) | 2008-06-11 | 2009-12-17 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
WO2009157282A1 (ja) | 2008-06-23 | 2009-12-30 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
TWI490176B (zh) * | 2009-03-20 | 2015-07-01 | Corning Inc | 分離玻璃板材的製程與設備 |
US8132427B2 (en) * | 2009-05-15 | 2012-03-13 | Corning Incorporated | Preventing gas from occupying a spray nozzle used in a process of scoring a hot glass sheet |
DE102009023602B4 (de) * | 2009-06-02 | 2012-08-16 | Grenzebach Maschinenbau Gmbh | Vorrichtung zum industriellen Herstellen elastisch verformbarer großflächiger Glasplatten in hoher Stückzahl |
TW201107258A (en) * | 2009-07-22 | 2011-03-01 | Corning Inc | Heat-and-quench scoring process quench zone |
US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
JP5481167B2 (ja) * | 2009-11-12 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
US8171753B2 (en) | 2009-11-18 | 2012-05-08 | Corning Incorporated | Method for cutting a brittle material |
JP5481173B2 (ja) | 2009-11-25 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5481172B2 (ja) | 2009-11-25 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5535590B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5466929B2 (ja) | 2009-11-25 | 2014-04-09 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5535588B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5535589B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5567319B2 (ja) | 2009-11-25 | 2014-08-06 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5525246B2 (ja) | 2009-11-25 | 2014-06-18 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
US20110174788A1 (en) * | 2010-01-21 | 2011-07-21 | Great Computer Corporation | Laser engraver with scanning function |
US8720228B2 (en) * | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
TWI576320B (zh) | 2010-10-29 | 2017-04-01 | 康寧公司 | 用於裁切玻璃帶之方法與設備 |
GB2490143B (en) * | 2011-04-20 | 2013-03-13 | Rolls Royce Plc | Method of manufacturing a component |
JP5409711B2 (ja) * | 2011-06-29 | 2014-02-05 | 三星ダイヤモンド工業株式会社 | レーザ光によるワーク加工装置 |
WO2013039230A1 (ja) * | 2011-09-15 | 2013-03-21 | 日本電気硝子株式会社 | ガラス板切断方法 |
TWI586612B (zh) * | 2011-11-18 | 2017-06-11 | 康寧公司 | 用於修整移動玻璃帶之設備及方法 |
US8677783B2 (en) * | 2011-11-28 | 2014-03-25 | Corning Incorporated | Method for low energy separation of a glass ribbon |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
WO2014022681A1 (en) | 2012-08-01 | 2014-02-06 | Gentex Corporation | Assembly with laser induced channel edge and method thereof |
KR101377239B1 (ko) | 2012-08-02 | 2014-03-21 | 한국미쯔보시다이아몬드공업(주) | 미러 타입의 레이저 스크라이브 라인 형성 장치 |
KR101355807B1 (ko) * | 2012-09-11 | 2014-02-03 | 로체 시스템즈(주) | 비금속 재료의 곡선 절단방법 |
US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
US9212081B2 (en) * | 2012-11-21 | 2015-12-15 | Corning Incorporated | Methods of cutting a laminate strengthened glass substrate |
US20140339280A1 (en) * | 2013-05-20 | 2014-11-20 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Method and Device for Scribing and Breaking Glass Substrate |
KR20150037047A (ko) * | 2013-09-30 | 2015-04-08 | 에스케이하이닉스 주식회사 | 전자 장치 및 그 제조 방법 |
WO2015084670A1 (en) | 2013-12-03 | 2015-06-11 | Corning Incorporated | Apparatus and method for severing a moving ribbon of inorganic material |
US20150165560A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US10471546B1 (en) * | 2013-12-20 | 2019-11-12 | Gentex Corporation | Distribution of damage volumes in laser-induced channels |
US10144668B2 (en) | 2014-08-20 | 2018-12-04 | Corning Incorporated | Method and apparatus for yielding high edge strength in cutting of flexible thin glass |
US10479719B2 (en) | 2014-08-28 | 2019-11-19 | Corning Incorporated | Apparatus and method for cutting a glass sheet |
JP6428113B2 (ja) * | 2014-09-30 | 2018-11-28 | 三星ダイヤモンド工業株式会社 | パターニング基板のブレイク方法並びにブレイク装置 |
US10576651B2 (en) * | 2015-02-03 | 2020-03-03 | Central Glass Co., Ltd. | Method of cutting brittle material, device for cutting brittle material, method of manufacturing cut brittle material and cut brittle material |
EP3088165B1 (en) * | 2015-02-25 | 2019-08-28 | Technology Research Association For Future Additive Manufacturing | Optical processing head, optical processing device, and optical processing method |
US10689286B2 (en) * | 2017-10-13 | 2020-06-23 | Seagate Technology Llc | Separation of glass shapes using engineered induced thermal gradients after process cutting |
EP3744468B1 (en) * | 2018-03-23 | 2024-03-06 | Primetals Technologies Japan, Ltd. | Laser processing device, and method for adjusting a laser processing head |
CN110509248B (zh) * | 2019-07-26 | 2022-05-27 | 中国航空工业集团公司济南特种结构研究所 | 一种用于雷达天线罩内外型面刻线的划线装置 |
JP2023525241A (ja) * | 2020-04-28 | 2023-06-15 | アイティーアイ カンパニー リミテッド | セラミックス切断法及び装備 |
US20220203481A1 (en) * | 2020-12-29 | 2022-06-30 | American Air Liquide, Inc. | Donut keyhole laser cutting |
CN114734153B (zh) * | 2022-03-31 | 2023-02-14 | 武汉华日精密激光股份有限公司 | 一种用于激光器加工脆性材料的裂片方法及系统 |
CN115229993B (zh) * | 2022-08-04 | 2024-05-17 | 广东工业大学 | 一种基于橡胶包覆层的玻璃打孔方法 |
CN117228945B (zh) * | 2023-11-15 | 2024-01-23 | 成都新世佳特种玻璃技术开发有限公司 | 一种特种玻璃生产用切割装置及分切工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1121141A (ja) * | 1997-04-14 | 1999-01-26 | Carl Zeiss:Fa | 脆い材料、特にガラス製の平坦な加工品を切断する方法及び装置 |
US6252197B1 (en) * | 1998-12-01 | 2001-06-26 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
JP2003305585A (ja) * | 2001-09-11 | 2003-10-28 | Seiko Epson Corp | レーザー加工方法および加工装置 |
WO2004002705A1 (ja) * | 2002-07-01 | 2004-01-08 | Mitsuboshi Diamond Industrial Co.,Ltd. | 脆性材料基板のスクライブ装置及びスクライブ方法 |
JP2004066745A (ja) * | 2002-08-08 | 2004-03-04 | Seiko Epson Corp | レーザー割断方法及びレーザー割断装置 |
WO2004020140A1 (ja) * | 2002-08-30 | 2004-03-11 | Sumitomo Heavy Industries, Ltd. | レーザ加工方法及び加工装置 |
WO2004062868A1 (ja) * | 2003-01-10 | 2004-07-29 | Mitsuboshi Diamond Industrial Co., Ltd. | 脆性材料基板のスクライブ装置及びスクライブ方法並びに自動分断ライン |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1244346B (de) * | 1964-10-19 | 1967-07-13 | Menzel Gerhard Glasbearbeitung | Verfahren zum Schneiden von Glas |
US3610871A (en) * | 1970-02-19 | 1971-10-05 | Western Electric Co | Initiation of a controlled fracture |
US4467168A (en) * | 1981-04-01 | 1984-08-21 | Creative Glassworks International | Method of cutting glass with a laser and an article made therewith |
US4500771A (en) * | 1982-10-20 | 1985-02-19 | Westinghouse Electric Corp. | Apparatus and process for laser treating sheet material |
EP0397236B1 (en) * | 1989-05-08 | 1994-10-05 | Koninklijke Philips Electronics N.V. | Method of severing a plate of brittle material |
JP2712723B2 (ja) * | 1990-03-07 | 1998-02-16 | 松下電器産業株式会社 | レーザ切断方法 |
US5132505A (en) * | 1990-03-21 | 1992-07-21 | U.S. Philips Corporation | Method of cleaving a brittle plate and device for carrying out the method |
RU2024441C1 (ru) * | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
JP2658809B2 (ja) * | 1992-08-27 | 1997-09-30 | 三菱電機株式会社 | レーザ加工装置 |
US5622540A (en) * | 1994-09-19 | 1997-04-22 | Corning Incorporated | Method for breaking a glass sheet |
US5776220A (en) * | 1994-09-19 | 1998-07-07 | Corning Incorporated | Method and apparatus for breaking brittle materials |
JPH0929472A (ja) * | 1995-07-14 | 1997-02-04 | Hitachi Ltd | 割断方法、割断装置及びチップ材料 |
JP3644145B2 (ja) * | 1996-08-21 | 2005-04-27 | 三菱電機株式会社 | レーザ装置 |
JPH10128567A (ja) * | 1996-10-30 | 1998-05-19 | Nec Kansai Ltd | レーザ割断方法 |
JP3498895B2 (ja) * | 1997-09-25 | 2004-02-23 | シャープ株式会社 | 基板の切断方法および表示パネルの製造方法 |
TW419867B (en) * | 1998-08-26 | 2001-01-21 | Samsung Electronics Co Ltd | Laser cutting apparatus and method |
US6420678B1 (en) * | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
US6211488B1 (en) * | 1998-12-01 | 2001-04-03 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe |
US6259058B1 (en) * | 1998-12-01 | 2001-07-10 | Accudyne Display And Semiconductor Systems, Inc. | Apparatus for separating non-metallic substrates |
US6327875B1 (en) * | 1999-03-09 | 2001-12-11 | Corning Incorporated | Control of median crack depth in laser scoring |
KR100626983B1 (ko) * | 1999-06-18 | 2006-09-22 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 레이저를 이용한 스크라이브 방법 |
US6501047B1 (en) * | 1999-11-19 | 2002-12-31 | Seagate Technology Llc | Laser-scribing brittle substrates |
KR100721391B1 (ko) * | 1999-11-24 | 2007-05-23 | 어플라이드 포토닉스 아이엔씨. | 비금속성 재료 분리 방법 및 장치 |
US6300593B1 (en) * | 1999-12-07 | 2001-10-09 | First Solar, Llc | Apparatus and method for laser scribing a coated substrate |
US20010035447A1 (en) * | 2000-05-05 | 2001-11-01 | Andreas Gartner | Methods for laser cut initiation |
WO2001085387A1 (en) * | 2000-05-11 | 2001-11-15 | Ptg Precision Technology Center Limited Llc | System for cutting brittle materials |
JP2002066780A (ja) * | 2000-08-30 | 2002-03-05 | Canon Inc | レーザ加工装置 |
-
2004
- 2004-07-30 US US10/903,701 patent/US7820941B2/en not_active Expired - Fee Related
-
2005
- 2005-07-06 EP EP05770158A patent/EP1771283A4/en not_active Withdrawn
- 2005-07-06 CN CNB2005800257382A patent/CN100515651C/zh not_active Expired - Fee Related
- 2005-07-06 JP JP2007523586A patent/JP5016488B2/ja not_active Expired - Fee Related
- 2005-07-06 WO PCT/US2005/023986 patent/WO2006023133A2/en active Application Filing
- 2005-07-06 KR KR1020077004693A patent/KR101148637B1/ko not_active IP Right Cessation
- 2005-07-13 TW TW94123826A patent/TWI274743B/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1121141A (ja) * | 1997-04-14 | 1999-01-26 | Carl Zeiss:Fa | 脆い材料、特にガラス製の平坦な加工品を切断する方法及び装置 |
US6252197B1 (en) * | 1998-12-01 | 2001-06-26 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
JP2003305585A (ja) * | 2001-09-11 | 2003-10-28 | Seiko Epson Corp | レーザー加工方法および加工装置 |
WO2004002705A1 (ja) * | 2002-07-01 | 2004-01-08 | Mitsuboshi Diamond Industrial Co.,Ltd. | 脆性材料基板のスクライブ装置及びスクライブ方法 |
JP2004066745A (ja) * | 2002-08-08 | 2004-03-04 | Seiko Epson Corp | レーザー割断方法及びレーザー割断装置 |
WO2004020140A1 (ja) * | 2002-08-30 | 2004-03-11 | Sumitomo Heavy Industries, Ltd. | レーザ加工方法及び加工装置 |
WO2004062868A1 (ja) * | 2003-01-10 | 2004-07-29 | Mitsuboshi Diamond Industrial Co., Ltd. | 脆性材料基板のスクライブ装置及びスクライブ方法並びに自動分断ライン |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011011917A (ja) * | 2009-06-30 | 2011-01-20 | Mitsuboshi Diamond Industrial Co Ltd | レーザ光によるガラス基板加工装置 |
JP2012017231A (ja) * | 2010-07-09 | 2012-01-26 | Mitsuboshi Diamond Industrial Co Ltd | レーザ光によるガラス基板加工装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5016488B2 (ja) | 2012-09-05 |
CN101005915A (zh) | 2007-07-25 |
KR20070041599A (ko) | 2007-04-18 |
US20060022008A1 (en) | 2006-02-02 |
US7820941B2 (en) | 2010-10-26 |
WO2006023133A3 (en) | 2007-01-25 |
CN100515651C (zh) | 2009-07-22 |
KR101148637B1 (ko) | 2012-05-21 |
TWI274743B (en) | 2007-03-01 |
EP1771283A2 (en) | 2007-04-11 |
EP1771283A4 (en) | 2009-04-22 |
WO2006023133A2 (en) | 2006-03-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5016488B2 (ja) | 脆い材料の罫書き方法および装置 | |
US20060021977A1 (en) | Process and apparatus for scoring a brittle material incorporating moving optical assembly | |
JP5352696B2 (ja) | 平面ガラスシートの製造方法およびガラス基板の分割方法 | |
US5776220A (en) | Method and apparatus for breaking brittle materials | |
KR101329477B1 (ko) | 단일 방사 빔으로 취성 재료를 스코어링 및 분리하는 방법 및 장치 | |
US6800831B1 (en) | Method and device for rapid cutting of a workpiece from a brittle material | |
KR100604765B1 (ko) | 레이저 스코링의 중간 균열 깊이의 제어 방법 | |
US5984159A (en) | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass | |
JP2008503355A (ja) | 基板材料の切断、分断または分割装置、システムおよび方法 | |
JP2008260688A (ja) | 平面ガラスシートの製造方法 | |
JP5562254B2 (ja) | 脆性材料の分割装置および割断方法 | |
JP3792639B2 (ja) | 切断装置 | |
JP2009255114A (ja) | 脆性材料基板の加工装置および切断方法 | |
JP5074272B2 (ja) | 脆性材料基板の加工装置および切断方法 | |
JP5081086B2 (ja) | 平面ガラスシートの製造方法およびガラス基板の分割方法 | |
JP2005314198A (ja) | ガラス割断用レーザ装置 | |
JPH091369A (ja) | 基板の割断方法及びその割断装置 | |
JP2020006397A (ja) | レーザ加工機及びレーザ加工方法 | |
KR20040083293A (ko) | 다중초점렌즈를 가지는 유리판커팅장치 | |
KR20040046421A (ko) | 레이저를 이용한 취성재료 절단장치 및 방법 | |
JP2013006706A (ja) | ガラス基板の割断方法および割断装置 | |
JP2009255346A (ja) | 脆性材料基板の加工装置および加工方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080704 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110830 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120515 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120608 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150615 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5016488 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |