JP2008502160A - 反射レンズを備えたパワー発光ダイパッケージおよびその作製方法 - Google Patents
反射レンズを備えたパワー発光ダイパッケージおよびその作製方法 Download PDFInfo
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- JP2008502160A JP2008502160A JP2007515656A JP2007515656A JP2008502160A JP 2008502160 A JP2008502160 A JP 2008502160A JP 2007515656 A JP2007515656 A JP 2007515656A JP 2007515656 A JP2007515656 A JP 2007515656A JP 2008502160 A JP2008502160 A JP 2008502160A
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- Prior art keywords
- optical lens
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- light emitting
- optical
- led
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- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 2
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Lenses (AREA)
Abstract
Description
<装置>
<方法>
<レンズ>
Claims (10)
- 複合光学レンズであって、
光を受けるよう適合された凹状底面と、
前記受光した光を反射するよう適合された反射面と、
前記反射光が前記光学レンズを出る光学面と、
を備え、
前記凹状底面は凹状キャビティを画定し、該凹状キャビティは、該凹状キャビティ内で発光デバイスの少なくとも一部を配置することを可能にする、複合光学レンズ。 - 前記凹状底面は、前記光に作用するよう適合された光学材料で被膜されている、請求項1に記載の複合光学レンズ。
- 前記光学材料は、蛍光体と散散物質と周波数偏移化学物質とから成る群から選ばれる、請求項2に記載の複合光学レンズ。
- 前記光学材料は、蛍光体と散散物質と周波数偏移化学物質とから成る群から選ばれる、請求項3に記載の複合光学レンズ。
- 前記反射面は前記凹状キャビティを取り囲む、請求項1に記載の複合光学レンズ。
- 前記反射面は反射材料で被膜されている、請求項1に記載の複合光学レンズ。
- 前記反射材料は、金と銀とアルミニウムとから成る群から選択される、請求項5に記載の複合光学レンズ。
- 前記反射面は、前記発光デバイスによって出射された光の少なくとも一部について全反射(TIR)させる、請求項1に記載の複合光学レンズ。
- 前記光学レンズは、前記発光デバイスを含むパッケージ上に前記レンズを配置するために、棚状突起を含む、請求項1に記載の複合光学レンズ。
- 前記反射面は、前記光を散乱させるよう適合された所定の光学仕上げ剤を有している、請求項1に記載の複合光学レンズ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/861,639 | 2004-06-04 | ||
US10/861,639 US7280288B2 (en) | 2004-06-04 | 2004-06-04 | Composite optical lens with an integrated reflector |
PCT/US2005/019722 WO2005119799A1 (en) | 2004-06-04 | 2005-06-03 | Composite optical lens with an integrated reflector |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011103758A Division JP5695488B2 (ja) | 2004-06-04 | 2011-05-06 | 発光体パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008502160A true JP2008502160A (ja) | 2008-01-24 |
JP5260049B2 JP5260049B2 (ja) | 2013-08-14 |
Family
ID=35063050
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007515656A Active JP5260049B2 (ja) | 2004-06-04 | 2005-06-03 | 反射レンズを備えたパワー発光ダイパッケージ |
JP2011103758A Active JP5695488B2 (ja) | 2004-06-04 | 2011-05-06 | 発光体パッケージ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011103758A Active JP5695488B2 (ja) | 2004-06-04 | 2011-05-06 | 発光体パッケージ |
Country Status (5)
Country | Link |
---|---|
US (1) | US7280288B2 (ja) |
EP (1) | EP1756880B1 (ja) |
JP (2) | JP5260049B2 (ja) |
TW (1) | TW200609538A (ja) |
WO (1) | WO2005119799A1 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
US20050270666A1 (en) | 2005-12-08 |
EP1756880A1 (en) | 2007-02-28 |
TW200609538A (en) | 2006-03-16 |
EP1756880B1 (en) | 2014-04-02 |
WO2005119799A1 (en) | 2005-12-15 |
JP5695488B2 (ja) | 2015-04-08 |
JP2011176356A (ja) | 2011-09-08 |
JP5260049B2 (ja) | 2013-08-14 |
US7280288B2 (en) | 2007-10-09 |
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