JP2008501240A5 - - Google Patents
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- Publication number
- JP2008501240A5 JP2008501240A5 JP2007515185A JP2007515185A JP2008501240A5 JP 2008501240 A5 JP2008501240 A5 JP 2008501240A5 JP 2007515185 A JP2007515185 A JP 2007515185A JP 2007515185 A JP2007515185 A JP 2007515185A JP 2008501240 A5 JP2008501240 A5 JP 2008501240A5
- Authority
- JP
- Japan
- Prior art keywords
- poly
- acid
- polishing composition
- alcohol
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 57
- 238000005498 polishing Methods 0.000 claims 47
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 19
- 238000000034 method Methods 0.000 claims 16
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical group CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims 12
- 150000003839 salts Chemical class 0.000 claims 12
- 239000008139 complexing agent Substances 0.000 claims 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 8
- 238000005260 corrosion Methods 0.000 claims 8
- 230000007797 corrosion Effects 0.000 claims 8
- 239000003112 inhibitor Substances 0.000 claims 8
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 6
- 229920002125 Sokalan® Polymers 0.000 claims 6
- 239000002253 acid Substances 0.000 claims 6
- 239000012964 benzotriazole Substances 0.000 claims 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 6
- 239000004310 lactic acid Substances 0.000 claims 6
- 235000014655 lactic acid Nutrition 0.000 claims 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 229920000867 polyelectrolyte Polymers 0.000 claims 5
- BWLBGMIXKSTLSX-UHFFFAOYSA-N 2-hydroxyisobutyric acid Chemical compound CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 claims 4
- WHBMMWSBFZVSSR-UHFFFAOYSA-N 3-hydroxybutyric acid Chemical compound CC(O)CC(O)=O WHBMMWSBFZVSSR-UHFFFAOYSA-N 0.000 claims 4
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims 4
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 claims 4
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 claims 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims 4
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 claims 4
- -1 poly (ethene sulfone Chemical class 0.000 claims 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 4
- 239000005518 polymer electrolyte Substances 0.000 claims 3
- AFENDNXGAFYKQO-VKHMYHEASA-N (S)-2-hydroxybutyric acid Chemical compound CC[C@H](O)C(O)=O AFENDNXGAFYKQO-VKHMYHEASA-N 0.000 claims 2
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 claims 2
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 claims 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims 2
- 229920000536 2-Acrylamido-2-methylpropane sulfonic acid Polymers 0.000 claims 2
- XHZPRMZZQOIPDS-UHFFFAOYSA-N 2-Methyl-2-[(1-oxo-2-propenyl)amino]-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(C)(C)NC(=O)C=C XHZPRMZZQOIPDS-UHFFFAOYSA-N 0.000 claims 2
- 125000006022 2-methyl-2-propenyl group Chemical group 0.000 claims 2
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 claims 2
- KFNGWPXYNSJXOP-UHFFFAOYSA-N 3-(2-methylprop-2-enoyloxy)propane-1-sulfonic acid Chemical compound CC(=C)C(=O)OCCCS(O)(=O)=O KFNGWPXYNSJXOP-UHFFFAOYSA-N 0.000 claims 2
- GETJHIYPEXUGHO-UHFFFAOYSA-N 3-(prop-2-enoylamino)propane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCNC(=O)C=C GETJHIYPEXUGHO-UHFFFAOYSA-N 0.000 claims 2
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims 2
- 229920002907 Guar gum Polymers 0.000 claims 2
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 claims 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims 2
- 229920002873 Polyethylenimine Polymers 0.000 claims 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims 2
- 235000010489 acacia gum Nutrition 0.000 claims 2
- 239000001785 acacia senegal l. willd gum Substances 0.000 claims 2
- 150000007513 acids Chemical class 0.000 claims 2
- BEHLMOQXOSLGHN-UHFFFAOYSA-N benzenamine sulfate Chemical compound OS(=O)(=O)NC1=CC=CC=C1 BEHLMOQXOSLGHN-UHFFFAOYSA-N 0.000 claims 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 2
- 235000015165 citric acid Nutrition 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- NLVXSWCKKBEXTG-UHFFFAOYSA-M ethenesulfonate Chemical compound [O-]S(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-M 0.000 claims 2
- 239000000665 guar gum Substances 0.000 claims 2
- 235000010417 guar gum Nutrition 0.000 claims 2
- 229960002154 guar gum Drugs 0.000 claims 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 claims 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 claims 2
- 239000011976 maleic acid Substances 0.000 claims 2
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims 2
- 229910001392 phosphorus oxide Inorganic materials 0.000 claims 2
- 229940081066 picolinic acid Drugs 0.000 claims 2
- 229920000729 poly(L-lysine) polymer Polymers 0.000 claims 2
- 229920000371 poly(diallyldimethylammonium chloride) polymer Polymers 0.000 claims 2
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 claims 2
- 229920001464 poly(sodium 4-styrenesulfonate) Polymers 0.000 claims 2
- 229920001467 poly(styrenesulfonates) Polymers 0.000 claims 2
- 229920002401 polyacrylamide Polymers 0.000 claims 2
- 229920001223 polyethylene glycol Polymers 0.000 claims 2
- 229920001444 polymaleic acid Polymers 0.000 claims 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 2
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical group [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims 2
- 229910052939 potassium sulfate Inorganic materials 0.000 claims 2
- 235000011151 potassium sulphates Nutrition 0.000 claims 2
- 235000019260 propionic acid Nutrition 0.000 claims 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims 2
- 229960004889 salicylic acid Drugs 0.000 claims 2
- 235000010413 sodium alginate Nutrition 0.000 claims 2
- 239000000661 sodium alginate Substances 0.000 claims 2
- 229940005550 sodium alginate Drugs 0.000 claims 2
- SONHXMAHPHADTF-UHFFFAOYSA-M sodium;2-methylprop-2-enoate Chemical compound [Na+].CC(=C)C([O-])=O SONHXMAHPHADTF-UHFFFAOYSA-M 0.000 claims 2
- NFJNJCYJOUZNSO-UHFFFAOYSA-M sodium;ethenyl sulfate Chemical compound [Na+].[O-]S(=O)(=O)OC=C NFJNJCYJOUZNSO-UHFFFAOYSA-M 0.000 claims 2
- 239000011975 tartaric acid Substances 0.000 claims 2
- 235000002906 tartaric acid Nutrition 0.000 claims 2
- VSAISIQCTGDGPU-UHFFFAOYSA-N tetraphosphorus hexaoxide Chemical compound O1P(O2)OP3OP1OP2O3 VSAISIQCTGDGPU-UHFFFAOYSA-N 0.000 claims 2
- 150000003628 tricarboxylic acids Chemical class 0.000 claims 2
- 239000000230 xanthan gum Substances 0.000 claims 2
- 235000010493 xanthan gum Nutrition 0.000 claims 2
- 229920001285 xanthan gum Polymers 0.000 claims 2
- 229940082509 xanthan gum Drugs 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/857,432 US20050263407A1 (en) | 2004-05-28 | 2004-05-28 | Electrochemical-mechanical polishing composition and method for using the same |
| PCT/US2005/017579 WO2005118736A1 (en) | 2004-05-28 | 2005-05-19 | Electrochemical-mechanical polishing composition and method for using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008501240A JP2008501240A (ja) | 2008-01-17 |
| JP2008501240A5 true JP2008501240A5 (enExample) | 2008-07-03 |
Family
ID=34973029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007515185A Pending JP2008501240A (ja) | 2004-05-28 | 2005-05-19 | 電気化学−機械研磨組成物及び同組成物の使用方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20050263407A1 (enExample) |
| JP (1) | JP2008501240A (enExample) |
| CN (1) | CN1961055B (enExample) |
| IL (1) | IL179192A0 (enExample) |
| TW (1) | TWI316083B (enExample) |
| WO (1) | WO2005118736A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006030595A1 (ja) * | 2004-09-14 | 2006-03-23 | Hitachi Chemical Company, Ltd. | Ｃｍｐ用研磨スラリー |
| US7531105B2 (en) * | 2004-11-05 | 2009-05-12 | Cabot Microelectronics Corporation | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
| US7504044B2 (en) | 2004-11-05 | 2009-03-17 | Cabot Microelectronics Corporation | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
| US20060137995A1 (en) * | 2004-12-29 | 2006-06-29 | Sukanta Ghosh | Method for removal of metal from a workpiece |
| US20060163083A1 (en) * | 2005-01-21 | 2006-07-27 | International Business Machines Corporation | Method and composition for electro-chemical-mechanical polishing |
| EP1899111A2 (en) * | 2005-06-06 | 2008-03-19 | Advanced Technology Materials, Inc. | Integrated chemical mechanical polishing composition and process for single platen processing |
| US7879255B2 (en) * | 2005-11-04 | 2011-02-01 | Applied Materials, Inc. | Method and composition for electrochemically polishing a conductive material on a substrate |
| JP4954558B2 (ja) * | 2006-01-31 | 2012-06-20 | 富士フイルム株式会社 | 金属用研磨液、及びそれを用いた化学的機械的研磨方法 |
| US7732393B2 (en) * | 2006-03-20 | 2010-06-08 | Cabot Microelectronics Corporation | Oxidation-stabilized CMP compositions and methods |
| WO2008082177A1 (en) * | 2006-12-29 | 2008-07-10 | Lg Chem, Ltd. | Cmp slurry composition for forming metal wiring line |
| JP5616273B2 (ja) | 2011-03-31 | 2014-10-29 | 富士フイルム株式会社 | 有機半導体ポリマー、有機半導体材料用組成物および光電池 |
| TW201305291A (zh) * | 2011-07-28 | 2013-02-01 | Anji Microelectronics Co Ltd | 化學機械拋光液 |
| CN102337580A (zh) * | 2011-09-21 | 2012-02-01 | 合肥金盟工贸有限公司 | 一种用于电化学抛光镁合金的离子液体抛光液及其制备方法 |
| KR20140000496A (ko) * | 2012-06-22 | 2014-01-03 | 에스케이하이닉스 주식회사 | 연마 조성물, 이의 제조 방법 및 이를 이용한 화학적 기계적 연마 방법 |
| CN103012495B (zh) * | 2012-11-21 | 2016-04-20 | 宁波大学 | D-酒石酸2,2-二吡啶胺钴铁电功能材料及制备方法 |
| CN102977153B (zh) * | 2012-11-21 | 2016-04-20 | 宁波大学 | L-酒石酸2,2-二吡啶胺钴铁电功能材料及制备方法 |
| US9732430B2 (en) * | 2013-10-24 | 2017-08-15 | Baker Hughes Incorporated | Chemical inhibition of pitting corrosion in methanolic solutions containing an organic halide |
| TWI583756B (zh) * | 2016-01-12 | 2017-05-21 | 常州時創能源科技有限公司 | 結晶矽酸性拋光液的添加劑及其應用 |
| KR102575250B1 (ko) * | 2017-02-17 | 2023-09-06 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물, 그 제조 방법 및 연마용 조성물을 사용한 연마 방법 |
| US11043151B2 (en) * | 2017-10-03 | 2021-06-22 | Cmc Materials, Inc. | Surface treated abrasive particles for tungsten buff applications |
| JP7035773B2 (ja) * | 2018-04-27 | 2022-03-15 | 三菱ケミカル株式会社 | 研磨組成物 |
| CN110172031B (zh) * | 2019-05-23 | 2021-03-16 | 北京师范大学 | 一种阴离子型n-取代苯胺离子液体及其制备方法 |
| KR102859110B1 (ko) * | 2020-01-07 | 2025-09-12 | 씨엠씨 머티리얼즈 엘엘씨 | 유도체화된 폴리아미노산 |
| WO2022114330A1 (ko) * | 2020-11-30 | 2022-06-02 | 한국과학기술연구원 | Cis계 박막의 평탄화 방법, 이를 이용하여 제조된 cis계 박막 및 상기 cis계 박막을 포함하는 태양전지 |
| CN115287739B (zh) * | 2022-08-11 | 2025-07-29 | 临沂市兴冠精细化工有限公司 | 一种金属表面清洗剂的制备方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1049259C (zh) * | 1994-12-29 | 2000-02-09 | 华中理工大学 | 铝及铝合金焊丝的电化学抛光方法 |
| EP0786504A3 (en) * | 1996-01-29 | 1998-05-20 | Fujimi Incorporated | Polishing composition |
| US6117783A (en) * | 1996-07-25 | 2000-09-12 | Ekc Technology, Inc. | Chemical mechanical polishing composition and process |
| JPH10166258A (ja) * | 1996-12-06 | 1998-06-23 | Tadahiro Omi | 研磨剤組成物 |
| US6348076B1 (en) * | 1999-10-08 | 2002-02-19 | International Business Machines Corporation | Slurry for mechanical polishing (CMP) of metals and use thereof |
| US6379223B1 (en) * | 1999-11-29 | 2002-04-30 | Applied Materials, Inc. | Method and apparatus for electrochemical-mechanical planarization |
| US6299741B1 (en) * | 1999-11-29 | 2001-10-09 | Applied Materials, Inc. | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus |
| US7066800B2 (en) * | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US6736952B2 (en) * | 2001-02-12 | 2004-05-18 | Speedfam-Ipec Corporation | Method and apparatus for electrochemical planarization of a workpiece |
| US6811680B2 (en) * | 2001-03-14 | 2004-11-02 | Applied Materials Inc. | Planarization of substrates using electrochemical mechanical polishing |
| US7128825B2 (en) * | 2001-03-14 | 2006-10-31 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US7160432B2 (en) * | 2001-03-14 | 2007-01-09 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US7232514B2 (en) * | 2001-03-14 | 2007-06-19 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US6899804B2 (en) * | 2001-04-10 | 2005-05-31 | Applied Materials, Inc. | Electrolyte composition and treatment for electrolytic chemical mechanical polishing |
| US6592742B2 (en) * | 2001-07-13 | 2003-07-15 | Applied Materials Inc. | Electrochemically assisted chemical polish |
| US7029373B2 (en) * | 2001-08-14 | 2006-04-18 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| US6821897B2 (en) * | 2001-12-05 | 2004-11-23 | Cabot Microelectronics Corporation | Method for copper CMP using polymeric complexing agents |
| JP3813865B2 (ja) * | 2001-12-11 | 2006-08-23 | 株式会社荏原製作所 | 研磨方法及び研磨装置 |
| KR20040093725A (ko) * | 2002-02-26 | 2004-11-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 연마용 조성물 및 방법 |
| JP2003311540A (ja) * | 2002-04-30 | 2003-11-05 | Sony Corp | 電解研磨液、電解研磨方法及び半導体装置の製造方法 |
| US20030224184A1 (en) * | 2002-05-07 | 2003-12-04 | Hermes Ann Robertson | Method of producing wear resistant traffic markings |
-
2004
- 2004-05-28 US US10/857,432 patent/US20050263407A1/en not_active Abandoned
-
2005
- 2005-05-19 WO PCT/US2005/017579 patent/WO2005118736A1/en not_active Ceased
- 2005-05-19 CN CN2005800173014A patent/CN1961055B/zh not_active Expired - Fee Related
- 2005-05-19 JP JP2007515185A patent/JP2008501240A/ja active Pending
- 2005-05-20 TW TW094116517A patent/TWI316083B/zh active
-
2006
- 2006-11-12 IL IL179192A patent/IL179192A0/en unknown
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