JP2008311351A5 - - Google Patents
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- Publication number
- JP2008311351A5 JP2008311351A5 JP2007156357A JP2007156357A JP2008311351A5 JP 2008311351 A5 JP2008311351 A5 JP 2008311351A5 JP 2007156357 A JP2007156357 A JP 2007156357A JP 2007156357 A JP2007156357 A JP 2007156357A JP 2008311351 A5 JP2008311351 A5 JP 2008311351A5
- Authority
- JP
- Japan
- Prior art keywords
- sample
- electrostatic chuck
- charged particle
- particle beam
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 claims 14
- 230000002093 peripheral effect Effects 0.000 claims 7
- 239000000463 material Substances 0.000 claims 3
- 238000001179 sorption measurement Methods 0.000 claims 1
- 230000007723 transport mechanism Effects 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007156357A JP2008311351A (ja) | 2007-06-13 | 2007-06-13 | 荷電粒子線装置 |
| US12/137,128 US7763863B2 (en) | 2007-06-13 | 2008-06-11 | Charged particle beam application apparatus |
| US12/828,781 US8158955B2 (en) | 2007-06-13 | 2010-07-01 | Charged particle beam application apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007156357A JP2008311351A (ja) | 2007-06-13 | 2007-06-13 | 荷電粒子線装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008311351A JP2008311351A (ja) | 2008-12-25 |
| JP2008311351A5 true JP2008311351A5 (https=) | 2009-07-30 |
Family
ID=40131437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007156357A Pending JP2008311351A (ja) | 2007-06-13 | 2007-06-13 | 荷電粒子線装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US7763863B2 (https=) |
| JP (1) | JP2008311351A (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008311351A (ja) * | 2007-06-13 | 2008-12-25 | Hitachi High-Technologies Corp | 荷電粒子線装置 |
| JP2009302415A (ja) * | 2008-06-17 | 2009-12-24 | Hitachi High-Technologies Corp | 荷電粒子線装置,試料保持システム,試料の保持方法、および、試料の離脱方法 |
| TWI465708B (zh) * | 2008-12-29 | 2014-12-21 | Ind Tech Res Inst | 聚焦式離子束系統之物件加工方法及應用於該方法之載具 |
| WO2010097858A1 (ja) * | 2009-02-27 | 2010-09-02 | 株式会社 日立ハイテクノロジーズ | 電子顕微鏡および試料保持方法 |
| JP5174750B2 (ja) * | 2009-07-03 | 2013-04-03 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置及び荷電粒子線画像を安定に取得する方法 |
| KR101849383B1 (ko) * | 2010-06-08 | 2018-04-16 | 액셀리스 테크놀러지스, 인크. | 고온에서 기계적 클램프 성능을 포함하는 가열된 정전 척 |
| JP5331828B2 (ja) * | 2011-01-14 | 2013-10-30 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
| WO2014144533A1 (en) * | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Position and temperature monitoring of ald platen susceptor |
| JP6064032B2 (ja) | 2013-03-15 | 2017-01-18 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
| JP2015026553A (ja) * | 2013-07-29 | 2015-02-05 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
| JP6174972B2 (ja) * | 2013-11-12 | 2017-08-02 | 株式会社ディスコ | 位置出しテーブル |
| JP6496184B2 (ja) * | 2014-06-27 | 2019-04-03 | 日本電子株式会社 | 試料導入方法、試料ステージ、および荷電粒子線装置 |
| US9449805B2 (en) * | 2014-09-23 | 2016-09-20 | Agilent Technologies Inc. | Isolation of charged particle optics from vacuum chamber deformations |
| US10186446B2 (en) * | 2016-09-30 | 2019-01-22 | Axcelis Technology, Inc. | Adjustable circumference electrostatic clamp |
| JP2019215957A (ja) * | 2018-06-11 | 2019-12-19 | 株式会社荏原製作所 | ビームベンダ |
| JP6994437B2 (ja) * | 2018-07-06 | 2022-01-14 | 株式会社日立ハイテク | 基板保持具及び走査型電子顕微鏡装置 |
| JP2020199517A (ja) * | 2019-06-07 | 2020-12-17 | ファナック株式会社 | レーザ加工システム |
| CN110982686B (zh) * | 2019-12-27 | 2025-01-17 | 珠海迪尔生物工程股份有限公司 | 微生物观测测试卡、观测系统和观测方法 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4789294A (en) * | 1985-08-30 | 1988-12-06 | Canon Kabushiki Kaisha | Wafer handling apparatus and method |
| US5556204A (en) * | 1990-07-02 | 1996-09-17 | Hitachi, Ltd. | Method and apparatus for detecting the temperature of a sample |
| US5539609A (en) * | 1992-12-02 | 1996-07-23 | Applied Materials, Inc. | Electrostatic chuck usable in high density plasma |
| US5350479A (en) * | 1992-12-02 | 1994-09-27 | Applied Materials, Inc. | Electrostatic chuck for high power plasma processing |
| KR100238629B1 (ko) * | 1992-12-17 | 2000-01-15 | 히가시 데쓰로 | 정전척을 가지는 재치대 및 이것을 이용한 플라즈마 처리장치 |
| US5822171A (en) * | 1994-02-22 | 1998-10-13 | Applied Materials, Inc. | Electrostatic chuck with improved erosion resistance |
| US5631803A (en) * | 1995-01-06 | 1997-05-20 | Applied Materials, Inc. | Erosion resistant electrostatic chuck with improved cooling system |
| US5535090A (en) * | 1994-03-03 | 1996-07-09 | Sherman; Arthur | Electrostatic chuck |
| TW295677B (https=) * | 1994-08-19 | 1997-01-11 | Tokyo Electron Co Ltd | |
| US5572398A (en) * | 1994-11-14 | 1996-11-05 | Hewlett-Packard Co. | Tri-polar electrostatic chuck |
| JP3208044B2 (ja) * | 1995-06-07 | 2001-09-10 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| US6370007B2 (en) * | 1995-09-20 | 2002-04-09 | Hitachi, Ltd. | Electrostatic chuck |
| US5781400A (en) * | 1995-09-20 | 1998-07-14 | Hitachi, Ltd. | Electrostatically attracting electrode and a method of manufacture thereof |
| TW334609B (en) * | 1996-09-19 | 1998-06-21 | Hitachi Ltd | Electrostatic chuck, method and device for processing sanyle use the same |
| US6077357A (en) * | 1997-05-29 | 2000-06-20 | Applied Materials, Inc. | Orientless wafer processing on an electrostatic chuck |
| JP3463599B2 (ja) | 1998-04-20 | 2003-11-05 | 株式会社日立製作所 | 試料保持機,半導体製造装置,半導体検査装置,回路パターン検査装置,荷電粒子線応用装置,校正用基板,試料の保持方法,回路パターン検査方法、および、荷電粒子線応用方法 |
| JP3952997B2 (ja) * | 1998-04-20 | 2007-08-01 | 株式会社日立製作所 | 半導体製造装置、および半導体検査装置 |
| US6509564B1 (en) * | 1998-04-20 | 2003-01-21 | Hitachi, Ltd. | Workpiece holder, semiconductor fabricating apparatus, semiconductor inspecting apparatus, circuit pattern inspecting apparatus, charged particle beam application apparatus, calibrating substrate, workpiece holding method, circuit pattern inspecting method, and charged particle beam application method |
| US6506687B1 (en) * | 1998-06-24 | 2003-01-14 | Hitachi, Ltd. | Dry etching device and method of producing semiconductor devices |
| JP4151749B2 (ja) * | 1998-07-16 | 2008-09-17 | 東京エレクトロンAt株式会社 | プラズマ処理装置およびその方法 |
| JP2001057359A (ja) * | 1999-08-17 | 2001-02-27 | Tokyo Electron Ltd | プラズマ処理装置 |
| US6490144B1 (en) * | 1999-11-29 | 2002-12-03 | Applied Materials, Inc. | Support for supporting a substrate in a process chamber |
| KR100502268B1 (ko) * | 2000-03-01 | 2005-07-22 | 가부시끼가이샤 히다치 세이사꾸쇼 | 플라즈마처리장치 및 방법 |
| TW483037B (en) * | 2000-03-24 | 2002-04-11 | Hitachi Ltd | Semiconductor manufacturing apparatus and method of processing semiconductor wafer using plasma, and wafer voltage probe |
| US6646233B2 (en) * | 2002-03-05 | 2003-11-11 | Hitachi High-Technologies Corporation | Wafer stage for wafer processing apparatus and wafer processing method |
| JP3905462B2 (ja) * | 2002-11-20 | 2007-04-18 | 東京エレクトロン株式会社 | プラズマ処理方法およびプラズマ処理装置 |
| US6903338B2 (en) | 2003-01-30 | 2005-06-07 | Kla-Tencor Technologies Corporation | Method and apparatus for reducing substrate edge effects in electron lenses |
| US6825617B2 (en) * | 2003-02-27 | 2004-11-30 | Hitachi High-Technologies Corporation | Semiconductor processing apparatus |
| US7138629B2 (en) | 2003-04-22 | 2006-11-21 | Ebara Corporation | Testing apparatus using charged particles and device manufacturing method using the testing apparatus |
| JP2004363085A (ja) * | 2003-05-09 | 2004-12-24 | Ebara Corp | 荷電粒子線による検査装置及びその検査装置を用いたデバイス製造方法 |
| JP4637684B2 (ja) * | 2004-09-10 | 2011-02-23 | 株式会社日立ハイテクノロジーズ | 荷電粒子線応用装置 |
| JP4997842B2 (ja) * | 2005-10-18 | 2012-08-08 | 東京エレクトロン株式会社 | 処理装置 |
| JP4935149B2 (ja) * | 2006-03-30 | 2012-05-23 | 東京エレクトロン株式会社 | プラズマ処理用の電極板及びプラズマ処理装置 |
| US8177990B2 (en) * | 2006-03-31 | 2012-05-15 | Tokyo Electron Limited | Etching method, plasma processing system and storage medium |
| JP2008311351A (ja) * | 2007-06-13 | 2008-12-25 | Hitachi High-Technologies Corp | 荷電粒子線装置 |
-
2007
- 2007-06-13 JP JP2007156357A patent/JP2008311351A/ja active Pending
-
2008
- 2008-06-11 US US12/137,128 patent/US7763863B2/en not_active Expired - Fee Related
-
2010
- 2010-07-01 US US12/828,781 patent/US8158955B2/en not_active Expired - Fee Related
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