JP2008311312A - 半導体装置およびその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 112
- 230000002093 peripheral effect Effects 0.000 claims abstract description 80
- 238000002955 isolation Methods 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 20
- 238000005530 etching Methods 0.000 claims description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 85
- 210000004027 cell Anatomy 0.000 description 84
- 239000010410 layer Substances 0.000 description 79
- 229920005591 polysilicon Polymers 0.000 description 73
- 239000000758 substrate Substances 0.000 description 16
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- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 11
- 229910052814 silicon oxide Inorganic materials 0.000 description 11
- 238000001020 plasma etching Methods 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 210000001744 T-lymphocyte Anatomy 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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Abstract
【解決手段】半導体層1のメモリーセル形成領域6および周辺回路形成領域7上に第1の絶縁膜2を設ける。領域7内の厚さを領域6内の厚さよりも厚くして第1の絶縁膜2上に第1の電極層3を設ける。領域6,7内に複数個の素子分離領域5を形成する。各素子分離領域5および第1の電極層3上に第2の絶縁膜8を設ける。第2の絶縁膜8上に第2の電極層12を設けるとともに、領域6,7内において第2の絶縁膜8を貫通して第1の電極層3の内部に至る各開口部11a,11b内に第2の電極層12の一部を埋め込んで第1の電極層3に電気的に接続する。
【選択図】 図3
Description
Claims (5)
- 表面上にメモリーセルおよび周辺回路が形成される半導体層と、
前記メモリーセルが形成される領域および前記周辺回路が形成される領域にわたって前記半導体層の表面上に設けられた第1の絶縁膜と、
前記周辺回路形成領域内の厚さを前記メモリーセル形成領域内の厚さよりも厚くして前記第1の絶縁膜の上に設けられた第1の電極層と、
この第1の電極層および前記第1の絶縁膜を貫通して前記半導体層の内部に至るとともに、前記メモリーセル形成領域内では上面を前記第1の電極層の上面よりも下げられて複数箇所に形成された素子分離領域と、
これら各素子分離領域および前記第1の電極層の上に設けられた第2の絶縁膜と、
この第2の絶縁膜を前記第1の電極層および前記各素子分離領域との間に挟んで前記第2の絶縁膜の上に設けられているとともに、前記メモリーセル形成領域および前記周辺回路形成領域の各領域において前記第2の絶縁膜を貫通して前記第1の電極層の内部に至って形成された各開口部内に一部を埋め込まれて前記第1の電極層に電気的に接続された第2の電極層と、
を具備することを特徴とする半導体装置。 - 前記周辺回路形成領域内の前記第1の電極層の厚さは、前記各開口部を形成する際に前記周辺回路形成領域内の前記第1の電極層が削られる深さから前記メモリーセル形成領域内の前記第1の電極層が削られる深さを差し引いた値を、前記メモリーセル形成領域内の前記第1の電極層の厚さに足し合わせた値と同等以上の大きさであることを特徴とする請求項1に記載の半導体装置。
- 半導体層の表面上のメモリーセルが形成される領域および周辺回路が形成される領域にわたって第1の絶縁膜および第1の電極層を積層して設けるとともに、前記第1の電極層および前記第1の絶縁膜を貫通して前記半導体層の内部に至る素子分離領域を複数箇所に形成し、
前記メモリーセル形成領域内の前記第1の電極層の上面を前記周辺回路形成領域内の前記第1の電極層の上面よりも低い位置まで後退させるとともに、この後退した前記第1の電極層の上面よりもさらに低い位置まで前記メモリーセル形成領域内の前記各素子分離領域の上面を後退させ、
前記各素子分離領域および前記第1の電極層の上に第2の絶縁膜を設けるとともに、この第2の絶縁膜を貫通して前記第1の電極層の内部に至る開口部を前記メモリーセル形成領域および前記周辺回路形成領域の各領域内に並行して形成し、
前記第2の絶縁膜の上に第2の電極層を設けるとともに、この第2の電極層の一部を前記各開口部内に埋め込んで前記第1の電極層に電気的に接続する、
ことを特徴とする半導体装置の製造方法。 - 前記メモリーセル形成領域内の前記第1の電極層の上面を後退させることにより、前記各開口部を形成する際に前記周辺回路形成領域内の前記第1の電極層が削られる深さから前記メモリーセル形成領域内前記第1の電極層が削られる深さを差し引いた値を、前記周辺回路形成領域内の前記第1の電極層の厚さからさらに差し引いた値と同等以上の膜厚を有する前記第1の電極層を前記メモリーセル形成領域内に残すことを特徴とする請求項3に記載の半導体装置の製造方法。
- 前記メモリーセル形成領域内の前記第1の電極層の上面および前記各素子分離領域の上面をエッチングにより並行して後退させつつ、前記各素子分離領域の上面を前記第1の電極層の上面よりもさらに低い位置まで自己整合的かつ選択的に後退させることを特徴とする請求項3または4に記載の半導体装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2007155614A JP4461158B2 (ja) | 2007-06-12 | 2007-06-12 | 半導体装置およびその製造方法 |
US12/135,339 US7847337B2 (en) | 2007-06-12 | 2008-06-09 | Integral circuit including non-volatile memory cell |
KR1020080054571A KR100951981B1 (ko) | 2007-06-12 | 2008-06-11 | 반도체 장치 및 그 제조 방법 |
US12/917,689 US8241984B2 (en) | 2007-06-12 | 2010-11-02 | Semiconductor device and method for manufacturing the same |
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JP2007155614A JP4461158B2 (ja) | 2007-06-12 | 2007-06-12 | 半導体装置およびその製造方法 |
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JP4461158B2 JP4461158B2 (ja) | 2010-05-12 |
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JP (1) | JP4461158B2 (ja) |
KR (1) | KR100951981B1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011204756A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | 不揮発性半導体記憶装置及び不揮発性半導体記憶装置の製造方法 |
US9006812B2 (en) | 2013-03-22 | 2015-04-14 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method for manufacturing the same |
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KR20100085651A (ko) * | 2009-01-21 | 2010-07-29 | 주식회사 하이닉스반도체 | 플래시 메모리 소자 및 그 제조방법 |
US20220359690A1 (en) * | 2021-05-10 | 2022-11-10 | Sandisk Technologies Llc | Transistor circuits including fringeless transistors and method of making the same |
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JPH0817949A (ja) * | 1994-03-25 | 1996-01-19 | Nippon Steel Corp | 不揮発性半導体記憶装置及びその製造方法 |
JP2002176114A (ja) * | 2000-09-26 | 2002-06-21 | Toshiba Corp | 半導体装置及びその製造方法 |
JP4429036B2 (ja) * | 2004-02-27 | 2010-03-10 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置の製造方法 |
KR20060082945A (ko) * | 2005-01-13 | 2006-07-20 | 주식회사 하이닉스반도체 | 플래쉬 메모리 소자의 제조 방법 |
KR100669346B1 (ko) | 2005-11-11 | 2007-01-16 | 삼성전자주식회사 | 플로팅 게이트를 갖는 비휘발성 기억 소자 및 그 형성 방법 |
JP2007311566A (ja) * | 2006-05-18 | 2007-11-29 | Toshiba Corp | 不揮発性半導体記憶装置及び不揮発性半導体記憶装置の製造方法 |
KR100760634B1 (ko) | 2006-10-02 | 2007-09-20 | 삼성전자주식회사 | 낸드형 비휘발성 기억 소자 및 그 형성 방법 |
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- 2007-06-12 JP JP2007155614A patent/JP4461158B2/ja not_active Expired - Fee Related
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2008
- 2008-06-09 US US12/135,339 patent/US7847337B2/en not_active Expired - Fee Related
- 2008-06-11 KR KR1020080054571A patent/KR100951981B1/ko not_active IP Right Cessation
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011204756A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | 不揮発性半導体記憶装置及び不揮発性半導体記憶装置の製造方法 |
US8378431B2 (en) | 2010-03-24 | 2013-02-19 | Kabushiki Kaisha Toshiba | Semiconductor device and method for producing the semiconductor device |
US9006812B2 (en) | 2013-03-22 | 2015-04-14 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method for manufacturing the same |
Also Published As
Publication number | Publication date |
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US8241984B2 (en) | 2012-08-14 |
US20080308859A1 (en) | 2008-12-18 |
US7847337B2 (en) | 2010-12-07 |
KR100951981B1 (ko) | 2010-04-08 |
JP4461158B2 (ja) | 2010-05-12 |
KR20080109637A (ko) | 2008-12-17 |
US20110053363A1 (en) | 2011-03-03 |
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