JP2008305937A - 電子部品内蔵モジュールおよびその製造方法 - Google Patents

電子部品内蔵モジュールおよびその製造方法 Download PDF

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Publication number
JP2008305937A
JP2008305937A JP2007151147A JP2007151147A JP2008305937A JP 2008305937 A JP2008305937 A JP 2008305937A JP 2007151147 A JP2007151147 A JP 2007151147A JP 2007151147 A JP2007151147 A JP 2007151147A JP 2008305937 A JP2008305937 A JP 2008305937A
Authority
JP
Japan
Prior art keywords
insulating layer
electronic component
component built
wiring
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007151147A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008305937A5 (enExample
Inventor
Tsukasa Shiraishi
司 白石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2007151147A priority Critical patent/JP2008305937A/ja
Priority to US12/131,439 priority patent/US20080304237A1/en
Priority to CNA2008101082893A priority patent/CN101321437A/zh
Publication of JP2008305937A publication Critical patent/JP2008305937A/ja
Publication of JP2008305937A5 publication Critical patent/JP2008305937A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2007151147A 2007-06-07 2007-06-07 電子部品内蔵モジュールおよびその製造方法 Withdrawn JP2008305937A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007151147A JP2008305937A (ja) 2007-06-07 2007-06-07 電子部品内蔵モジュールおよびその製造方法
US12/131,439 US20080304237A1 (en) 2007-06-07 2008-06-02 Electronic component built-in module and method for manufacturing the same
CNA2008101082893A CN101321437A (zh) 2007-06-07 2008-06-05 电子部件内置组件及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007151147A JP2008305937A (ja) 2007-06-07 2007-06-07 電子部品内蔵モジュールおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2008305937A true JP2008305937A (ja) 2008-12-18
JP2008305937A5 JP2008305937A5 (enExample) 2010-05-13

Family

ID=40095688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007151147A Withdrawn JP2008305937A (ja) 2007-06-07 2007-06-07 電子部品内蔵モジュールおよびその製造方法

Country Status (3)

Country Link
US (1) US20080304237A1 (enExample)
JP (1) JP2008305937A (enExample)
CN (1) CN101321437A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013080790A1 (ja) 2011-11-30 2013-06-06 株式会社フジクラ 部品内蔵基板及びその製造方法並びに部品内蔵基板実装体
US10952310B2 (en) 2016-11-16 2021-03-16 Murata Manufacturing Co., Ltd. High-frequency module
WO2021140975A1 (ja) 2020-01-10 2021-07-15 住友電気工業株式会社 高周波増幅器
WO2022225314A1 (ko) * 2021-04-21 2022-10-27 엘지이노텍 주식회사 Sip 모듈
WO2023090920A1 (ko) * 2021-11-18 2023-05-25 엘지이노텍 주식회사 Sip 모듈
US11916519B2 (en) 2020-04-14 2024-02-27 Sumitomo Electric Industries, Ltd. High frequency amplifier

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9219206B2 (en) * 2010-01-19 2015-12-22 Lg Innotek Co., Ltd. Package and manufacturing method of the same
KR20110085481A (ko) * 2010-01-20 2011-07-27 삼성전자주식회사 적층 반도체 패키지
JP2012049496A (ja) * 2010-01-29 2012-03-08 Nitto Denko Corp 放熱構造体
JP4948613B2 (ja) * 2010-02-25 2012-06-06 三菱電機株式会社 樹脂封止形電子制御装置、及びその製造方法
CN102786772A (zh) * 2011-05-20 2012-11-21 吴江华诚复合材料科技有限公司 一种半导体封包用环氧树脂组成物
CN104380848B (zh) * 2012-07-05 2019-07-23 株式会社村田制作所 部件内置基板
JP2014175485A (ja) 2013-03-08 2014-09-22 Ibiden Co Ltd 配線板及びその製造方法
AT515069B1 (de) 2013-11-07 2019-10-15 At & S Austria Tech & Systemtechnik Ag Leiterplattenstruktur
JP6312527B2 (ja) * 2014-05-23 2018-04-18 新日本無線株式会社 放熱板を備えた電子部品の実装構造
FR3036918B1 (fr) * 2015-05-29 2018-08-10 Thales Carte electronique et procede de fabrication associe
US11452198B2 (en) * 2019-07-25 2022-09-20 Borgwarner, Inc. Thermally insulated printed circuit board
CN110600438A (zh) * 2019-10-12 2019-12-20 广东佛智芯微电子技术研究有限公司 嵌入式多芯片及元件sip扇出型封装结构及其制作方法
KR102789025B1 (ko) * 2019-12-16 2025-04-01 삼성전기주식회사 전자부품 내장기판
WO2022222015A1 (en) * 2021-04-20 2022-10-27 Huawei Technologies Co., Ltd. Semiconductor package
CN113840449A (zh) * 2021-09-06 2021-12-24 华为技术有限公司 一种基板和电子设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5541449A (en) * 1994-03-11 1996-07-30 The Panda Project Semiconductor chip carrier affording a high-density external interface
US6320257B1 (en) * 1994-09-27 2001-11-20 Foster-Miller, Inc. Chip packaging technique
US5896038A (en) * 1996-11-08 1999-04-20 W. L. Gore & Associates, Inc. Method of wafer level burn-in
TWI255001B (en) * 2001-12-13 2006-05-11 Matsushita Electric Industrial Co Ltd Metal wiring substrate, semiconductor device and the manufacturing method thereof
TW200302685A (en) * 2002-01-23 2003-08-01 Matsushita Electric Industrial Co Ltd Circuit component built-in module and method of manufacturing the same
KR20060003078A (ko) * 2003-05-09 2006-01-09 마츠시타 덴끼 산교 가부시키가이샤 회로 소자 내장 모듈
US7446262B2 (en) * 2004-01-27 2008-11-04 Murata Manufacturing Co., Ltd. Laminated electronic component and method for producing the same
JP2006295119A (ja) * 2005-03-17 2006-10-26 Matsushita Electric Ind Co Ltd 積層型半導体装置
US20080042302A1 (en) * 2006-08-16 2008-02-21 Crispell Robert B Plastic overmolded packages with molded lid attachments

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013080790A1 (ja) 2011-11-30 2013-06-06 株式会社フジクラ 部品内蔵基板及びその製造方法並びに部品内蔵基板実装体
US9591767B2 (en) 2011-11-30 2017-03-07 Fujikura Ltd. Component built-in board and method of manufacturing the same, and component built-in board mounting body
US10952310B2 (en) 2016-11-16 2021-03-16 Murata Manufacturing Co., Ltd. High-frequency module
WO2021140975A1 (ja) 2020-01-10 2021-07-15 住友電気工業株式会社 高周波増幅器
US12199572B2 (en) 2020-01-10 2025-01-14 Sumitomo Electric Industries, Ltd. High-frequency amplifier
US11916519B2 (en) 2020-04-14 2024-02-27 Sumitomo Electric Industries, Ltd. High frequency amplifier
US12176860B2 (en) 2020-04-14 2024-12-24 Sumitomo Electric Industries, Ltd. High frequency amplifier
WO2022225314A1 (ko) * 2021-04-21 2022-10-27 엘지이노텍 주식회사 Sip 모듈
WO2023090920A1 (ko) * 2021-11-18 2023-05-25 엘지이노텍 주식회사 Sip 모듈
WO2023090809A1 (ko) * 2021-11-18 2023-05-25 엘지이노텍 주식회사 Sip 모듈

Also Published As

Publication number Publication date
CN101321437A (zh) 2008-12-10
US20080304237A1 (en) 2008-12-11

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