JP2008300588A - 電子装置及びその製造方法 - Google Patents

電子装置及びその製造方法 Download PDF

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Publication number
JP2008300588A
JP2008300588A JP2007144492A JP2007144492A JP2008300588A JP 2008300588 A JP2008300588 A JP 2008300588A JP 2007144492 A JP2007144492 A JP 2007144492A JP 2007144492 A JP2007144492 A JP 2007144492A JP 2008300588 A JP2008300588 A JP 2008300588A
Authority
JP
Japan
Prior art keywords
sealing body
wiring board
sealing
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007144492A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008300588A5 (enrdf_load_stackoverflow
Inventor
Minoru Shinohara
稔 篠原
Takao Sonobe
隆生 園部
Hironori Iwasaki
浩典 岩崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2007144492A priority Critical patent/JP2008300588A/ja
Publication of JP2008300588A publication Critical patent/JP2008300588A/ja
Publication of JP2008300588A5 publication Critical patent/JP2008300588A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2007144492A 2007-05-31 2007-05-31 電子装置及びその製造方法 Pending JP2008300588A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007144492A JP2008300588A (ja) 2007-05-31 2007-05-31 電子装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007144492A JP2008300588A (ja) 2007-05-31 2007-05-31 電子装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2008300588A true JP2008300588A (ja) 2008-12-11
JP2008300588A5 JP2008300588A5 (enrdf_load_stackoverflow) 2010-07-15

Family

ID=40173813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007144492A Pending JP2008300588A (ja) 2007-05-31 2007-05-31 電子装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP2008300588A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016077092A (ja) * 2014-10-07 2016-05-12 三菱電機株式会社 電動機、空気調和機、および電動機の製造方法
KR102520070B1 (ko) * 2022-08-25 2023-04-10 김민선 아이씨 타입 점퍼 패키지 및 이를 장착한 인쇄회로기판

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59138264U (ja) * 1983-03-07 1984-09-14 カシオ計算機株式会社 配線基板装置
JPS61183575U (enrdf_load_stackoverflow) * 1985-05-07 1986-11-15
JPS62291086A (ja) * 1986-06-10 1987-12-17 株式会社東芝 配線回路基板
JPS63241983A (ja) * 1987-03-30 1988-10-07 株式会社東芝 回路配線基板
JPH01124288A (ja) * 1987-11-09 1989-05-17 Mitsubishi Electric Corp 半導体装置
JPH04343288A (ja) * 1991-05-21 1992-11-30 Sony Corp プリント配線板
JPH05211280A (ja) * 1991-11-20 1993-08-20 Nec Corp 混成集積回路装置
JPH06244524A (ja) * 1993-02-22 1994-09-02 Mitsubishi Electric Corp 半導体装置
JPH0738225A (ja) * 1993-07-22 1995-02-07 Mitsubishi Electric Corp 半導体装置及びその製造方法
JPH10284828A (ja) * 1997-04-02 1998-10-23 Denso Corp 混成集積回路装置の実装方法
JP2001326237A (ja) * 2000-05-15 2001-11-22 Apic Yamada Corp 樹脂封止方法
JP2002353259A (ja) * 2001-05-24 2002-12-06 Sony Corp 半導体装置およびその製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59138264U (ja) * 1983-03-07 1984-09-14 カシオ計算機株式会社 配線基板装置
JPS61183575U (enrdf_load_stackoverflow) * 1985-05-07 1986-11-15
JPS62291086A (ja) * 1986-06-10 1987-12-17 株式会社東芝 配線回路基板
JPS63241983A (ja) * 1987-03-30 1988-10-07 株式会社東芝 回路配線基板
JPH01124288A (ja) * 1987-11-09 1989-05-17 Mitsubishi Electric Corp 半導体装置
JPH04343288A (ja) * 1991-05-21 1992-11-30 Sony Corp プリント配線板
JPH05211280A (ja) * 1991-11-20 1993-08-20 Nec Corp 混成集積回路装置
JPH06244524A (ja) * 1993-02-22 1994-09-02 Mitsubishi Electric Corp 半導体装置
JPH0738225A (ja) * 1993-07-22 1995-02-07 Mitsubishi Electric Corp 半導体装置及びその製造方法
JPH10284828A (ja) * 1997-04-02 1998-10-23 Denso Corp 混成集積回路装置の実装方法
JP2001326237A (ja) * 2000-05-15 2001-11-22 Apic Yamada Corp 樹脂封止方法
JP2002353259A (ja) * 2001-05-24 2002-12-06 Sony Corp 半導体装置およびその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016077092A (ja) * 2014-10-07 2016-05-12 三菱電機株式会社 電動機、空気調和機、および電動機の製造方法
KR102520070B1 (ko) * 2022-08-25 2023-04-10 김민선 아이씨 타입 점퍼 패키지 및 이를 장착한 인쇄회로기판
WO2024043418A1 (ko) * 2022-08-25 2024-02-29 주식회사 글로벌테크놀로지 아이씨 타입 점퍼 패키지 및 이를 장착한 인쇄회로기판

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