JP2008300588A5 - - Google Patents

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Publication number
JP2008300588A5
JP2008300588A5 JP2007144492A JP2007144492A JP2008300588A5 JP 2008300588 A5 JP2008300588 A5 JP 2008300588A5 JP 2007144492 A JP2007144492 A JP 2007144492A JP 2007144492 A JP2007144492 A JP 2007144492A JP 2008300588 A5 JP2008300588 A5 JP 2008300588A5
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JP
Japan
Prior art keywords
electronic device
wiring board
base material
sealing body
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007144492A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008300588A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007144492A priority Critical patent/JP2008300588A/ja
Priority claimed from JP2007144492A external-priority patent/JP2008300588A/ja
Publication of JP2008300588A publication Critical patent/JP2008300588A/ja
Publication of JP2008300588A5 publication Critical patent/JP2008300588A5/ja
Pending legal-status Critical Current

Links

JP2007144492A 2007-05-31 2007-05-31 電子装置及びその製造方法 Pending JP2008300588A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007144492A JP2008300588A (ja) 2007-05-31 2007-05-31 電子装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007144492A JP2008300588A (ja) 2007-05-31 2007-05-31 電子装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2008300588A JP2008300588A (ja) 2008-12-11
JP2008300588A5 true JP2008300588A5 (enrdf_load_stackoverflow) 2010-07-15

Family

ID=40173813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007144492A Pending JP2008300588A (ja) 2007-05-31 2007-05-31 電子装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP2008300588A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6184388B2 (ja) * 2014-10-07 2017-08-23 三菱電機株式会社 電動機、空気調和機、および電動機の製造方法
KR102520070B1 (ko) * 2022-08-25 2023-04-10 김민선 아이씨 타입 점퍼 패키지 및 이를 장착한 인쇄회로기판

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59138264U (ja) * 1983-03-07 1984-09-14 カシオ計算機株式会社 配線基板装置
JPS61183575U (enrdf_load_stackoverflow) * 1985-05-07 1986-11-15
JPS62291086A (ja) * 1986-06-10 1987-12-17 株式会社東芝 配線回路基板
JPS63241983A (ja) * 1987-03-30 1988-10-07 株式会社東芝 回路配線基板
JPH01124288A (ja) * 1987-11-09 1989-05-17 Mitsubishi Electric Corp 半導体装置
JPH04343288A (ja) * 1991-05-21 1992-11-30 Sony Corp プリント配線板
JP2705408B2 (ja) * 1991-11-20 1998-01-28 日本電気株式会社 混成集積回路装置
JPH06244524A (ja) * 1993-02-22 1994-09-02 Mitsubishi Electric Corp 半導体装置
JPH0738225A (ja) * 1993-07-22 1995-02-07 Mitsubishi Electric Corp 半導体装置及びその製造方法
JPH10284828A (ja) * 1997-04-02 1998-10-23 Denso Corp 混成集積回路装置の実装方法
JP2001326237A (ja) * 2000-05-15 2001-11-22 Apic Yamada Corp 樹脂封止方法
JP2002353259A (ja) * 2001-05-24 2002-12-06 Sony Corp 半導体装置およびその製造方法

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