JP2008277824A - 移動体装置、露光装置及び光学系ユニット、並びにデバイス製造方法 - Google Patents

移動体装置、露光装置及び光学系ユニット、並びにデバイス製造方法 Download PDF

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Publication number
JP2008277824A
JP2008277824A JP2008115543A JP2008115543A JP2008277824A JP 2008277824 A JP2008277824 A JP 2008277824A JP 2008115543 A JP2008115543 A JP 2008115543A JP 2008115543 A JP2008115543 A JP 2008115543A JP 2008277824 A JP2008277824 A JP 2008277824A
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JP
Japan
Prior art keywords
exposure apparatus
gas
bearing member
chamber
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2008115543A
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English (en)
Japanese (ja)
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JP2008277824A5 (enExample
Inventor
Keiichi Tanaka
慶一 田中
Yukio Kakizaki
幸雄 柿崎
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Nikon Corp
Original Assignee
Nikon Corp
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Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of JP2008277824A publication Critical patent/JP2008277824A/ja
Publication of JP2008277824A5 publication Critical patent/JP2008277824A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C29/00—Bearings for parts moving only linearly
    • F16C29/02—Sliding-contact bearings
    • F16C29/025—Hydrostatic or aerostatic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00—Bearings not otherwise provided for
    • F16C32/06—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings
    • F16C32/0603—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816—Bearings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2008115543A 2007-04-27 2008-04-25 移動体装置、露光装置及び光学系ユニット、並びにデバイス製造方法 Pending JP2008277824A (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US92405907P 2007-04-27 2007-04-27
US92406007P 2007-04-27 2007-04-27
US92414207P 2007-05-01 2007-05-01
US92414307P 2007-05-01 2007-05-01
US92413707P 2007-05-01 2007-05-01
US12/109,069 US8749753B2 (en) 2007-04-27 2008-04-24 Movable body apparatus, exposure apparatus and optical system unit, and device manufacturing method

Publications (2)

Publication Number Publication Date
JP2008277824A true JP2008277824A (ja) 2008-11-13
JP2008277824A5 JP2008277824A5 (enExample) 2011-05-26

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JP2008115543A Pending JP2008277824A (ja) 2007-04-27 2008-04-25 移動体装置、露光装置及び光学系ユニット、並びにデバイス製造方法

Country Status (3)

Country Link
US (1) US8749753B2 (enExample)
JP (1) JP2008277824A (enExample)
WO (1) WO2008140027A1 (enExample)

Cited By (3)

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Publication number Priority date Publication date Assignee Title
JP2011119727A (ja) * 2009-12-02 2011-06-16 Asml Netherlands Bv リソグラフィ装置およびリソグラフィ装置用のシール装置
KR20150066634A (ko) * 2013-12-06 2015-06-17 엘지디스플레이 주식회사 평판표시패널용 노광장치
CN111684164A (zh) * 2018-02-06 2020-09-18 蒂森克虏伯罗特艾德德国有限公司 具有自调节的和对干扰不敏感的力元件的轴承装置

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US7550744B1 (en) * 2007-03-23 2009-06-23 Kla-Tencor Corporation Chamberless substrate handling
US20090304537A1 (en) * 2008-06-06 2009-12-10 Hung Kuo-Yu Pneumatic chemical pump
JP5315100B2 (ja) * 2009-03-18 2013-10-16 株式会社ニューフレアテクノロジー 描画装置
JP5667568B2 (ja) * 2009-08-07 2015-02-12 株式会社ニコン 移動体装置、露光装置、及びデバイス製造方法
JP5618261B2 (ja) * 2009-08-07 2014-11-05 株式会社ニコン 露光装置及びデバイス製造方法
JP5422416B2 (ja) * 2010-01-28 2014-02-19 株式会社日立製作所 試料搬送装置
JP5140103B2 (ja) * 2010-03-17 2013-02-06 株式会社日立ハイテクノロジーズ リニアモータ対、移動ステージ、及び電子顕微鏡
US9341942B2 (en) * 2010-08-24 2016-05-17 Nikon Research Corporation Of America Vacuum chamber assembly for supporting a workpiece
CN102789136B (zh) * 2011-05-19 2014-08-20 上海微电子装备有限公司 气浮支撑系统
CN103797420A (zh) 2011-09-12 2014-05-14 迈普尔平版印刷Ip有限公司 具有基底板的真空腔室
NL2007423C2 (en) * 2011-09-15 2013-03-18 Mapper Lithography Ip Bv Vacuum chamber with base plate.
KR20130092843A (ko) * 2012-02-13 2013-08-21 삼성전자주식회사 빛의 인텐시티를 컨트롤할 수 있는 컨트롤 모듈 미러를 갖는 반사형 포토리소그래피 설비
US9422978B2 (en) * 2013-06-22 2016-08-23 Kla-Tencor Corporation Gas bearing assembly for an EUV light source
JP5532175B1 (ja) * 2013-07-02 2014-06-25 日本精工株式会社 テーブル装置、及び搬送装置
CN103592824B (zh) * 2013-11-29 2015-04-22 中国科学院光电技术研究所 一种二自由度高精度大行程气浮工件台
JP6525567B2 (ja) * 2014-12-02 2019-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
CN110959139B (zh) 2017-07-28 2023-02-28 Asml荷兰有限公司 颗粒抑制系统和方法
WO2019020443A1 (en) * 2017-07-28 2019-01-31 Asml Netherlands B.V. SYSTEMS AND METHODS FOR DELETION OF PARTICLES
KR20240030249A (ko) 2022-08-30 2024-03-07 삼성전자주식회사 조명 보정 장치 및 이를 포함하는 euv 노광 장치

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JP2002257998A (ja) * 2001-02-28 2002-09-11 Sony Corp 電子ビーム照射装置及び電子ビーム照射装置における真空シール方法
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011119727A (ja) * 2009-12-02 2011-06-16 Asml Netherlands Bv リソグラフィ装置およびリソグラフィ装置用のシール装置
KR20150066634A (ko) * 2013-12-06 2015-06-17 엘지디스플레이 주식회사 평판표시패널용 노광장치
KR102221592B1 (ko) * 2013-12-06 2021-03-02 엘지디스플레이 주식회사 평판표시패널용 노광장치
CN111684164A (zh) * 2018-02-06 2020-09-18 蒂森克虏伯罗特艾德德国有限公司 具有自调节的和对干扰不敏感的力元件的轴承装置
CN111684164B (zh) * 2018-02-06 2022-04-01 蒂森克虏伯罗特艾德德国有限公司 具有自调节的和对干扰不敏感的力元件的轴承装置

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WO2008140027A1 (en) 2008-11-20
US8749753B2 (en) 2014-06-10
US20090059190A1 (en) 2009-03-05

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