JP2008270762A - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP2008270762A
JP2008270762A JP2008062132A JP2008062132A JP2008270762A JP 2008270762 A JP2008270762 A JP 2008270762A JP 2008062132 A JP2008062132 A JP 2008062132A JP 2008062132 A JP2008062132 A JP 2008062132A JP 2008270762 A JP2008270762 A JP 2008270762A
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Prior art keywords
substrate
element substrate
organic resin
fibrous body
forming
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Withdrawn
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JP2008062132A
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Japanese (ja)
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JP2008270762A5 (enExample
Inventor
Yoshitaka Michimae
芳隆 道前
Eiji Sugiyama
栄二 杉山
Hisashi Otani
久 大谷
Takuya Tsurume
卓也 鶴目
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2008062132A priority Critical patent/JP2008270762A/ja
Publication of JP2008270762A publication Critical patent/JP2008270762A/ja
Publication of JP2008270762A5 publication Critical patent/JP2008270762A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
JP2008062132A 2007-03-26 2008-03-12 半導体装置の作製方法 Withdrawn JP2008270762A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008062132A JP2008270762A (ja) 2007-03-26 2008-03-12 半導体装置の作製方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007079264 2007-03-26
JP2008062132A JP2008270762A (ja) 2007-03-26 2008-03-12 半導体装置の作製方法

Publications (2)

Publication Number Publication Date
JP2008270762A true JP2008270762A (ja) 2008-11-06
JP2008270762A5 JP2008270762A5 (enExample) 2011-03-17

Family

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Family Applications (1)

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JP2008062132A Withdrawn JP2008270762A (ja) 2007-03-26 2008-03-12 半導体装置の作製方法

Country Status (6)

Country Link
US (1) US7785933B2 (enExample)
EP (1) EP1976000A3 (enExample)
JP (1) JP2008270762A (enExample)
KR (1) KR101466594B1 (enExample)
CN (1) CN101276767B (enExample)
TW (1) TWI442513B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011244111A (ja) * 2010-05-14 2011-12-01 Murata Mfg Co Ltd 無線ｉｃデバイス
US8710683B2 (en) 2010-09-29 2014-04-29 Samsung Electronics Co., Ltd. Method of forming wafer level mold using glass fiber and wafer structure formed by the same
KR20150014563A (ko) * 2013-07-29 2015-02-09 삼성디스플레이 주식회사 박막 트랜지스터 기판, 이의 제조 방법 및 이를 포함하는 표시 장치
KR101821861B1 (ko) 2015-10-15 2018-01-25 한국과학기술원 섬유 기판을 이용하는 착용 가능한 메모리 및 그 제작 방법

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KR101478810B1 (ko) 2006-07-28 2015-01-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 축전 장치
EP2372756A1 (en) 2007-03-13 2011-10-05 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device and manufacturing method thereof
EP1970951A3 (en) * 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP1976001A3 (en) * 2007-03-26 2012-08-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2009205669A (ja) * 2008-01-31 2009-09-10 Semiconductor Energy Lab Co Ltd 半導体装置
JP5473413B2 (ja) 2008-06-20 2014-04-16 株式会社半導体エネルギー研究所 配線基板の作製方法、アンテナの作製方法及び半導体装置の作製方法
US8563397B2 (en) * 2008-07-09 2013-10-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5358324B2 (ja) * 2008-07-10 2013-12-04 株式会社半導体エネルギー研究所 電子ペーパー
JP2010041040A (ja) * 2008-07-10 2010-02-18 Semiconductor Energy Lab Co Ltd 光電変換装置および光電変換装置の製造方法
WO2010005064A1 (en) * 2008-07-10 2010-01-14 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic device
WO2010035627A1 (en) * 2008-09-25 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5583951B2 (ja) * 2008-11-11 2014-09-03 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP5470054B2 (ja) 2009-01-22 2014-04-16 株式会社半導体エネルギー研究所 半導体装置
GB2469628A (en) * 2009-04-20 2010-10-27 Michael Edward Beese Two Part Identification Label
WO2010140522A1 (en) * 2009-06-05 2010-12-09 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and manufacturing method thereof
KR101677076B1 (ko) * 2009-06-05 2016-11-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 광전 변환 디바이스 및 그 제조 방법
WO2010140539A1 (en) * 2009-06-05 2010-12-09 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and method for manufacturing the same
US8345435B2 (en) * 2009-08-07 2013-01-01 Semiconductor Energy Laboratory Co., Ltd. Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof
JP5719560B2 (ja) * 2009-10-21 2015-05-20 株式会社半導体エネルギー研究所 端子構造の作製方法
CN102403225B (zh) * 2010-09-07 2013-08-14 无锡华润上华半导体有限公司 沟渠双扩散金属氧化半导体制作方法及装置
US8518798B2 (en) * 2010-09-23 2013-08-27 Infineon Technologies Ag Semiconductor structure and method for making same
EP2643704B1 (en) * 2010-11-26 2018-01-24 The National Microelectronics Applications Centre An ac current or voltage sensor
US20130229776A1 (en) * 2011-12-23 2013-09-05 Wisconsin Alumni Research Foundation High-speed, flexible integrated circuits and methods for making high-speed, flexible integrated circuits
JP2014135422A (ja) * 2013-01-11 2014-07-24 Toyota Motor Corp 半導体装置の製造方法
KR102086098B1 (ko) * 2013-07-03 2020-03-09 삼성디스플레이 주식회사 표시 장치
KR101418974B1 (ko) * 2014-01-23 2014-07-14 김용석 스마트 단말기용 보호필름 관리시스템
US20170170016A1 (en) * 2015-12-14 2017-06-15 Globalfoundries Inc. Multiple patterning method for substrate
DE102016107678B4 (de) 2016-04-26 2023-12-28 Infineon Technologies Ag Halbleitervorrichtungen mit on-chip-antennen und deren herstellung
JP6577910B2 (ja) * 2016-06-23 2019-09-18 ルネサスエレクトロニクス株式会社 電子装置

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JPH04196346A (ja) * 1990-11-28 1992-07-16 Hitachi Ltd 薄型樹脂封止型半導体装置
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011244111A (ja) * 2010-05-14 2011-12-01 Murata Mfg Co Ltd 無線ｉｃデバイス
US8710683B2 (en) 2010-09-29 2014-04-29 Samsung Electronics Co., Ltd. Method of forming wafer level mold using glass fiber and wafer structure formed by the same
KR20150014563A (ko) * 2013-07-29 2015-02-09 삼성디스플레이 주식회사 박막 트랜지스터 기판, 이의 제조 방법 및 이를 포함하는 표시 장치
KR102135275B1 (ko) * 2013-07-29 2020-07-20 삼성디스플레이 주식회사 박막 트랜지스터 기판, 이의 제조 방법 및 이를 포함하는 표시 장치
KR101821861B1 (ko) 2015-10-15 2018-01-25 한국과학기술원 섬유 기판을 이용하는 착용 가능한 메모리 및 그 제작 방법

Also Published As

Publication number Publication date
CN101276767A (zh) 2008-10-01
EP1976000A3 (en) 2009-05-13
KR20080087693A (ko) 2008-10-01
US20080311706A1 (en) 2008-12-18
TW200903720A (en) 2009-01-16
KR101466594B1 (ko) 2014-11-28
TWI442513B (zh) 2014-06-21
CN101276767B (zh) 2012-12-12
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