JP2008247038A5 - - Google Patents

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Publication number
JP2008247038A5
JP2008247038A5 JP2008136127A JP2008136127A JP2008247038A5 JP 2008247038 A5 JP2008247038 A5 JP 2008247038A5 JP 2008136127 A JP2008136127 A JP 2008136127A JP 2008136127 A JP2008136127 A JP 2008136127A JP 2008247038 A5 JP2008247038 A5 JP 2008247038A5
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JP
Japan
Prior art keywords
full cut
conceptual perspective
brittle material
view
cut cleaving
Prior art date
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Granted
Application number
JP2008136127A
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English (en)
Japanese (ja)
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JP2008247038A (ja
JP5005612B2 (ja
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Priority to JP2008136127A priority Critical patent/JP5005612B2/ja
Priority claimed from JP2008136127A external-priority patent/JP5005612B2/ja
Publication of JP2008247038A publication Critical patent/JP2008247038A/ja
Publication of JP2008247038A5 publication Critical patent/JP2008247038A5/ja
Application granted granted Critical
Publication of JP5005612B2 publication Critical patent/JP5005612B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2008136127A 2008-05-24 2008-05-24 脆性材料のフルカット割断方法 Expired - Fee Related JP5005612B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008136127A JP5005612B2 (ja) 2008-05-24 2008-05-24 脆性材料のフルカット割断方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008136127A JP5005612B2 (ja) 2008-05-24 2008-05-24 脆性材料のフルカット割断方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2005264727A Division JP4179314B2 (ja) 2005-09-13 2005-09-13 脆性材料のフルカット割断装置

Publications (3)

Publication Number Publication Date
JP2008247038A JP2008247038A (ja) 2008-10-16
JP2008247038A5 true JP2008247038A5 (https=) 2008-11-27
JP5005612B2 JP5005612B2 (ja) 2012-08-22

Family

ID=39972521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008136127A Expired - Fee Related JP5005612B2 (ja) 2008-05-24 2008-05-24 脆性材料のフルカット割断方法

Country Status (1)

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JP (1) JP5005612B2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2432744B1 (en) * 2009-05-21 2020-07-15 Corning Inc. Thin substrates having mechanically durable edges
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
WO2012096053A1 (ja) * 2011-01-11 2012-07-19 旭硝子株式会社 強化ガラス板の切断方法
CN103429545B (zh) 2011-03-18 2017-07-07 旭硝子株式会社 显示装置用化学强化玻璃
JP2014210670A (ja) * 2011-09-01 2014-11-13 旭硝子株式会社 強化ガラスパネルの製造方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
JP6206406B2 (ja) * 2012-06-28 2017-10-04 旭硝子株式会社 ガラス基板の切断方法及びガラス基板の製造方法
WO2014010490A1 (ja) * 2012-07-09 2014-01-16 旭硝子株式会社 強化ガラス板の切断方法
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
JP7695498B2 (ja) * 2021-07-20 2025-06-19 株式会社アドテックエンジニアリング レーザ加工方法及びレーザ加工装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63159832A (ja) * 1986-12-24 1988-07-02 Hamamatsu Photonics Kk 波長可変レ−ザ装置
JP3036906B2 (ja) * 1991-07-30 2000-04-24 ホーヤ株式会社 ガラス加工方法及びその装置
JP3532100B2 (ja) * 1997-12-03 2004-05-31 日本碍子株式会社 レーザ割断方法
JP2002049064A (ja) * 2000-08-07 2002-02-15 Toshiba Corp 光パラメトリック発振器
JP2002090787A (ja) * 2000-09-19 2002-03-27 Nikon Corp 波長変換光学系及びこの波長変換光学系を用いた露光装置
JP4329978B2 (ja) * 2001-02-06 2009-09-09 古河電気工業株式会社 半導体レーザモジュールと、光帰還機能を有する半導体レーザ素子
WO2003076151A1 (en) * 2002-03-12 2003-09-18 Mitsuboshi Diamond Industrial Co., Ltd. Method and device for processing fragile material
JP2005088078A (ja) * 2003-09-17 2005-04-07 Lemi Ltd 走査型レーザ装置
JP2005314198A (ja) * 2004-04-26 2005-11-10 Lemi Ltd ガラス割断用レーザ装置
JP4179314B2 (ja) * 2005-09-13 2008-11-12 株式会社レミ 脆性材料のフルカット割断装置

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