JP2008221717A - 樹脂計量供給装置 - Google Patents
樹脂計量供給装置 Download PDFInfo
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- JP2008221717A JP2008221717A JP2007065442A JP2007065442A JP2008221717A JP 2008221717 A JP2008221717 A JP 2008221717A JP 2007065442 A JP2007065442 A JP 2007065442A JP 2007065442 A JP2007065442 A JP 2007065442A JP 2008221717 A JP2008221717 A JP 2008221717A
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- JP
- Japan
- Prior art keywords
- resin
- metering
- container
- weighing
- weighing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 222
- 229920005989 resin Polymers 0.000 title claims abstract description 222
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 238000005303 weighing Methods 0.000 claims description 127
- 238000005259 measurement Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 8
- 238000000926 separation method Methods 0.000 description 10
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
【解決手段】樹脂封止に使用するために所定量の粉状又は粒状の樹脂を計量・供給する樹脂計量供給装置100であって、樹脂を計量・分離可能な計量部140が、所定量に満たない範囲で所定量の概量を計量・分離可能な粗計量部140Aと、粗計量部140Aの計量値と所定量との差分を粗計量部140Aよりも精密に計量・分離可能な微計量部140Bと、を備えて構成する。
【選択図】図1
Description
樹脂計量供給装置として好適である。
101…保持部
110…回転テーブル(位置変換機構)
120A…第1容器
120B…第2容器
120C…第3容器
120D…第4容器
140A…粗計量部
140B…微計量部
O…回転中心
Claims (3)
- 樹脂封止に使用するために所定量の粉状又は粒状の樹脂を計量・供給する樹脂計量供給装置であって、
前記樹脂を計量・分離可能な計量部が、前記所定量に満たない範囲で前記所定量の概量を計量・分離可能な粗計量部と、該粗計量部の計量値と前記所定量との差分を前記粗計量部よりも精密に計量・分離可能な微計量部と、を備える
ことを特徴とする樹脂計量供給装置。 - 請求項1において、
前記粗計量部及び前記微計量部により計量・分離された前記樹脂の両方を同時に保持可能な容器を備え、
該容器に保持された前記樹脂が前記所定量を超えた場合に当該容器内に保持される前記樹脂が破棄される
ことを特徴とする樹脂計量供給装置。 - 樹脂封止に使用するために所定量の粉状又は粒状の樹脂を計量・供給する樹脂計量供給方法であって、
前記樹脂を計量・分離可能な計量部を、前記樹脂を計量・分離可能な粗計量部と、前記樹脂を前記粗計量部よりも精密に計量・分離可能な微計量部とで構成した上で、
前記粗計量部により、前記所定量に満たない範囲で前記樹脂の概量を計量・分離した後に、
前記微計量部により、前記粗計量部の計量値と前記所定量との差分を前記粗計量部よりも精密に計量・分離する
ことを特徴とする樹脂計量供給方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007065442A JP5074062B2 (ja) | 2007-03-14 | 2007-03-14 | 樹脂計量供給装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007065442A JP5074062B2 (ja) | 2007-03-14 | 2007-03-14 | 樹脂計量供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008221717A true JP2008221717A (ja) | 2008-09-25 |
JP5074062B2 JP5074062B2 (ja) | 2012-11-14 |
Family
ID=39840870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007065442A Active JP5074062B2 (ja) | 2007-03-14 | 2007-03-14 | 樹脂計量供給装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5074062B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014121826A (ja) * | 2012-12-20 | 2014-07-03 | Sumitomo Heavy Ind Ltd | 樹脂成形装置及びその方法 |
JP2014133831A (ja) * | 2013-01-10 | 2014-07-24 | Panasonic Corp | 圧縮成形用エポキシ樹脂組成物と半導体装置 |
JP6279047B1 (ja) * | 2016-10-11 | 2018-02-14 | Towa株式会社 | 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003231145A (ja) * | 2001-12-04 | 2003-08-19 | Sainekkusu:Kk | 樹脂封止装置及びその方法 |
JP2004012216A (ja) * | 2002-06-05 | 2004-01-15 | Matsushita Electric Ind Co Ltd | 粉粒状材料計量供給方法およびその装置 |
-
2007
- 2007-03-14 JP JP2007065442A patent/JP5074062B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003231145A (ja) * | 2001-12-04 | 2003-08-19 | Sainekkusu:Kk | 樹脂封止装置及びその方法 |
JP2004012216A (ja) * | 2002-06-05 | 2004-01-15 | Matsushita Electric Ind Co Ltd | 粉粒状材料計量供給方法およびその装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014121826A (ja) * | 2012-12-20 | 2014-07-03 | Sumitomo Heavy Ind Ltd | 樹脂成形装置及びその方法 |
JP2014133831A (ja) * | 2013-01-10 | 2014-07-24 | Panasonic Corp | 圧縮成形用エポキシ樹脂組成物と半導体装置 |
JP6279047B1 (ja) * | 2016-10-11 | 2018-02-14 | Towa株式会社 | 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法 |
JP2018062076A (ja) * | 2016-10-11 | 2018-04-19 | Towa株式会社 | 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法 |
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JP5074062B2 (ja) | 2012-11-14 |
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