JP2008218814A - パワーモジュール - Google Patents
パワーモジュール Download PDFInfo
- Publication number
- JP2008218814A JP2008218814A JP2007055947A JP2007055947A JP2008218814A JP 2008218814 A JP2008218814 A JP 2008218814A JP 2007055947 A JP2007055947 A JP 2007055947A JP 2007055947 A JP2007055947 A JP 2007055947A JP 2008218814 A JP2008218814 A JP 2008218814A
- Authority
- JP
- Japan
- Prior art keywords
- power module
- solder
- semiconductor chip
- layer
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4901—Structure
- H01L2224/4903—Connectors having different sizes, e.g. different diameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13062—Junction field-effect transistor [JFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Abstract
【解決手段】パワーモジュール10は、半導体素子が形成された半導体チップ11と、半導体チップ11で発生した熱を熱交換媒体に放出するためのヒートシンク21と、ヒートシンク21と半導体チップ11との間に介在する金属配線23とを備えている。半導体チップ11と金属配線23との間には、Pbフリー半田を用いた半田層14が設けられ、金属配線23とヒートシンク21との間には、樹脂接着剤からなる絶縁樹脂層26が設けられている。半田層が単一であることにより、低融点のPbフリー半田のみを用いることができ、接続信頼性が確保される。
【選択図】図2
Description
図1は、実施の形態におけるパワーモジュールセットの構造を示す斜視図である。同図に示すように、本実施形態のパワーモジュールセットは、放熱器50の上に、複数のパワーモジュール10を取り付けて構成されている。放熱器50は、天板50aと天板50aに接合された容器50bとからなり、天板50aには、パワーモジュール10を組み込むための多数の矩形状貫通穴が設けられている。本実施形態においては、矩形状貫通穴が多数設けられているが、1つだけでもよい。放熱器50を構成する天板50aと容器50bとは、アルミニウムまたはアルミニウム合金からなり、ダイキャスト,押し出し,鍛造,鋳造,機械加工等によって組み立てることができる。
次に、図4(a)〜(d),図5(a)〜(d)および図6(a)〜(c)を参照しながら、本実施の形態のパワーモジュールの製造方法について説明する。図4(a)〜(d)は、本実施の形態の製造工程における,樹脂接着剤の塗布からモジュール樹脂枠の取付までの工程を示す断面図である。図5(a)〜(d)は、本実施の形態の製造工程における,チップマウントからポッティングまでの工程を示す断面図である。図6(a)〜(c)は、本実施の形態の製造工程における,Oリングの設置からボルトの締結までの工程を示す断面図である。
本発明のパワーモジュールに配置される半導体素子は、ワイドバンドギャップ半導体(SiC,GaNなど)を用いたパワーデバイスでもよいし、Siを用いたパワーデバイスでもよい。
11 半導体チップ
12 上面電極
13 裏面電極
14 半田層
17 信号配線
18 大電流用配線
21 ヒートシンク
21a 平板部
21b フィン部
23 金属配線
25 Oリング
26 絶縁樹脂層
40 ゲル層
50 放熱器
50a 天板
50b 容器
53 モジュール樹脂枠
56 電極端子層
Claims (5)
- 半導体素子が形成された半導体チップと、
前記半導体素子と外部とを電気的に接続するための配線部材と、
前記半導体チップと前記配線部材との間に介在する,Pbフリー半田を含む半田層と、
前記配線部材を支持する支持部材と、
前記配線部材と前記支持部材との間に介在する絶縁樹脂層と、
を備えたパワーモジュール。 - 請求項1記載のパワーモジュールにおいて、
前記絶縁樹脂層の使用可能温度は、前記Pbフリー半田の液相点よりも高い、パワーモジュール。 - 請求項1または2記載のパワーモジュールにおいて、
前記絶縁樹脂層の熱伝導率は、3(W/m・K)以上である、パワーモジュール。 - 請求項3記載のパワーモジュールにおいて、
前記絶縁樹脂層の厚みは、0.4mm以下である、パワーモジュール。 - 請求項1〜4のいずれかに記載のパワーモジュールにおいて、
前記支持部材は、フィンを有するヒートシンク部材である、パワーモジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007055947A JP2008218814A (ja) | 2007-03-06 | 2007-03-06 | パワーモジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007055947A JP2008218814A (ja) | 2007-03-06 | 2007-03-06 | パワーモジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008218814A true JP2008218814A (ja) | 2008-09-18 |
Family
ID=39838482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007055947A Pending JP2008218814A (ja) | 2007-03-06 | 2007-03-06 | パワーモジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2008218814A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016051878A (ja) * | 2014-09-02 | 2016-04-11 | 三菱電機株式会社 | 電力用半導体装置 |
KR20200026822A (ko) * | 2017-07-14 | 2020-03-11 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 고열전도성의 디바이스 기판 및 그 제조 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001007281A (ja) * | 1999-06-18 | 2001-01-12 | Hitachi Ltd | パワー半導体モジュール |
JP2001057406A (ja) * | 1999-06-11 | 2001-02-27 | Matsushita Electric Ind Co Ltd | 放熱基板及びその製造方法 |
JP2002353383A (ja) * | 2001-05-30 | 2002-12-06 | Moric Co Ltd | 半導体装置 |
JP2003303940A (ja) * | 2002-04-12 | 2003-10-24 | Hitachi Ltd | 絶縁回路基板および半導体装置 |
-
2007
- 2007-03-06 JP JP2007055947A patent/JP2008218814A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001057406A (ja) * | 1999-06-11 | 2001-02-27 | Matsushita Electric Ind Co Ltd | 放熱基板及びその製造方法 |
JP2001007281A (ja) * | 1999-06-18 | 2001-01-12 | Hitachi Ltd | パワー半導体モジュール |
JP2002353383A (ja) * | 2001-05-30 | 2002-12-06 | Moric Co Ltd | 半導体装置 |
JP2003303940A (ja) * | 2002-04-12 | 2003-10-24 | Hitachi Ltd | 絶縁回路基板および半導体装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016051878A (ja) * | 2014-09-02 | 2016-04-11 | 三菱電機株式会社 | 電力用半導体装置 |
KR20200026822A (ko) * | 2017-07-14 | 2020-03-11 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 고열전도성의 디바이스 기판 및 그 제조 방법 |
CN110892506A (zh) * | 2017-07-14 | 2020-03-17 | 信越化学工业株式会社 | 具有高热导率的器件基板及其制造方法 |
KR102558905B1 (ko) * | 2017-07-14 | 2023-07-21 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 고열전도성의 디바이스 기판 및 그 제조 방법 |
CN110892506B (zh) * | 2017-07-14 | 2024-04-09 | 信越化学工业株式会社 | 具有高热导率的器件基板及其制造方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103035601B (zh) | 在烧结银层上包括扩散焊接层的半导体器件 | |
JP2009021530A (ja) | 絶縁性樹脂膜およびパワーモジュール | |
US9887338B2 (en) | Light emitting diode device | |
JP2007305962A (ja) | パワー半導体モジュール | |
JP2007251076A (ja) | パワー半導体モジュール | |
KR101013001B1 (ko) | 효과적인 열 방출을 위한 선이 없는 반도체 패키지 | |
JP2002368168A (ja) | 半導体装置用複合部材、それを用いた絶縁型半導体装置、又は非絶縁型半導体装置 | |
JP2008300379A (ja) | パワーモジュール | |
JP5957862B2 (ja) | パワーモジュール用基板 | |
JP2006303400A (ja) | 電子部品収納用パッケージおよび電子装置ならびに電子装置の実装構造 | |
US20050258550A1 (en) | Circuit board and semiconductor device using the same | |
JP2008300476A (ja) | パワーモジュール | |
JP2006282417A (ja) | 金属−セラミックス接合基板 | |
JP6429208B2 (ja) | 半導体装置および移動体 | |
JP6638282B2 (ja) | 冷却器付き発光モジュールおよび冷却器付き発光モジュールの製造方法 | |
JP2005340268A (ja) | トランジスタパッケージ | |
JP2009038162A (ja) | 放熱部品、その製造方法及びパワーモジュール | |
JP2008270294A (ja) | ヒートシンク部材および半導体装置 | |
JP5141061B2 (ja) | パワーモジュール | |
JP2009019182A (ja) | 表面コートフィラー,複合接着剤およびパワーモジュール | |
JP2008218814A (ja) | パワーモジュール | |
JP6529632B1 (ja) | はんだ合金、ソルダペースト、成形はんだ、及びはんだ合金を用いた半導体装置 | |
KR20180059778A (ko) | 발광 모듈용 기판, 발광 모듈, 냉각기가 형성된 발광 모듈용 기판, 및 발광 모듈용 기판의 제조 방법 | |
JP2002232022A (ja) | 熱電モジュール及びその製造方法 | |
JP2008218940A (ja) | パワーモジュールおよびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20091221 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100226 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20100514 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20111129 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120412 |