JP2008218589A5 - - Google Patents
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- Publication number
- JP2008218589A5 JP2008218589A5 JP2007052169A JP2007052169A JP2008218589A5 JP 2008218589 A5 JP2008218589 A5 JP 2008218589A5 JP 2007052169 A JP2007052169 A JP 2007052169A JP 2007052169 A JP2007052169 A JP 2007052169A JP 2008218589 A5 JP2008218589 A5 JP 2008218589A5
- Authority
- JP
- Japan
- Prior art keywords
- fin
- cooling device
- refrigerant
- base
- base member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007052169A JP4876975B2 (ja) | 2007-03-02 | 2007-03-02 | 電子機器用の冷却装置および受熱部材 |
US12/039,962 US20080216991A1 (en) | 2007-03-02 | 2008-02-29 | Cooling device for information equipment |
CN200810080940.0A CN101257784B (zh) | 2007-03-02 | 2008-02-29 | 电子设备用的冷却装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007052169A JP4876975B2 (ja) | 2007-03-02 | 2007-03-02 | 電子機器用の冷却装置および受熱部材 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011131804A Division JP2011223019A (ja) | 2011-06-14 | 2011-06-14 | 電子機器用の冷却装置および冷却デバイス |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008218589A JP2008218589A (ja) | 2008-09-18 |
JP2008218589A5 true JP2008218589A5 (ru) | 2009-04-23 |
JP4876975B2 JP4876975B2 (ja) | 2012-02-15 |
Family
ID=39740475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007052169A Expired - Fee Related JP4876975B2 (ja) | 2007-03-02 | 2007-03-02 | 電子機器用の冷却装置および受熱部材 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20080216991A1 (ru) |
JP (1) | JP4876975B2 (ru) |
CN (1) | CN101257784B (ru) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5117287B2 (ja) * | 2008-06-06 | 2013-01-16 | 株式会社日立製作所 | 電子機器の冷却装置 |
JP5994103B2 (ja) * | 2011-09-22 | 2016-09-21 | パナソニックIpマネジメント株式会社 | 冷却装置およびこれを搭載した電気自動車および電子機器 |
JP5957686B2 (ja) * | 2012-01-13 | 2016-07-27 | パナソニックIpマネジメント株式会社 | 冷却装置およびこれを搭載した電子機器および電気自動車 |
EP2820725A4 (en) * | 2012-03-02 | 2016-04-27 | Logos Technologies Llc | SYSTEMS AND METHOD FOR COOLING GLASS LASERS |
JP6124742B2 (ja) | 2013-09-05 | 2017-05-10 | 三菱電機株式会社 | 半導体装置 |
JP6238800B2 (ja) * | 2014-03-17 | 2017-11-29 | 株式会社フジクラ | 冷却構造 |
JP6394289B2 (ja) | 2014-11-04 | 2018-09-26 | 富士通株式会社 | 蒸発器、冷却装置、及び電子機器 |
CN105025691B (zh) * | 2015-08-10 | 2018-03-06 | 苏州大景能源科技有限公司 | 一种利用液冷散热的电子装置、散热装置及其冷却方法 |
TWM511640U (zh) * | 2015-08-11 | 2015-11-01 | Cooler Master Co Ltd | 具有分流設計之液冷式水冷頭及其散熱結構 |
US10171778B2 (en) * | 2015-11-24 | 2019-01-01 | Cooler Master Co., Ltd. | Liquid cooling apparatus |
JP6939481B2 (ja) | 2017-11-30 | 2021-09-22 | 富士通株式会社 | 冷却ジャケット及び電子機器 |
DE102018101453A1 (de) * | 2018-01-23 | 2019-07-25 | Borgwarner Ludwigsburg Gmbh | Heizvorrichtung und Verfahren zum Herstellung eines Heizstabes |
US10962299B2 (en) * | 2018-11-09 | 2021-03-30 | Ldc Precision Engineering Co., Ltd. | Evaporator structure with improved layout of cooling fluid channels |
TWI689698B (zh) | 2019-05-10 | 2020-04-01 | 訊凱國際股份有限公司 | 流量調整件與液冷式散熱裝置 |
US11744044B2 (en) * | 2020-11-05 | 2023-08-29 | Deeia, Inc. | Loop thermosyphon devices and systems, and related methods |
US20220316817A1 (en) * | 2021-03-30 | 2022-10-06 | Asia Vital Components Co., Ltd. | Liquid-cooling heat dissipation structure |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3746086A (en) * | 1971-08-27 | 1973-07-17 | Peerless Of America | Heat exchangers |
JPH0311759A (ja) * | 1989-06-09 | 1991-01-21 | Hitachi Ltd | 半導体装置の冷却装置 |
US4909315A (en) * | 1988-09-30 | 1990-03-20 | Microelectronics And Computer Technology Corporation | Fluid heat exchanger for an electronic component |
JP3067399B2 (ja) * | 1992-07-03 | 2000-07-17 | 株式会社日立製作所 | 半導体冷却装置 |
JP3260584B2 (ja) * | 1995-04-07 | 2002-02-25 | 株式会社日立製作所 | マルチチップモジュールの冷却機構 |
JP4493117B2 (ja) * | 1999-03-25 | 2010-06-30 | レノボ シンガポール プライヴェート リミテッド | ノートブック型パーソナルコンピューターの冷却方法及び冷却装置 |
US6578626B1 (en) * | 2000-11-21 | 2003-06-17 | Thermal Corp. | Liquid cooled heat exchanger with enhanced flow |
WO2004003453A2 (en) * | 2002-06-28 | 2004-01-08 | Roger Paulman | Fin array for heat transfer assemblies and method of making same |
US7000684B2 (en) * | 2002-11-01 | 2006-02-21 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US7017654B2 (en) * | 2003-03-17 | 2006-03-28 | Cooligy, Inc. | Apparatus and method of forming channels in a heat-exchanging device |
JP2005079483A (ja) * | 2003-09-03 | 2005-03-24 | Hitachi Ltd | 電子機器装置 |
JP4222171B2 (ja) * | 2003-09-24 | 2009-02-12 | 株式会社デンソー | 対向振動流型熱輸送装置 |
WO2005043620A1 (ja) * | 2003-10-30 | 2005-05-12 | Fujitsu Limited | 冷却装置及び電子装置 |
JP2005229047A (ja) * | 2004-02-16 | 2005-08-25 | Hitachi Ltd | 電子機器の冷却システム、及び、それを使用した電子機器 |
DE112004002811T5 (de) * | 2004-03-30 | 2008-03-13 | Purdue Research Foundation, Lafayette | Verbesserte Mikrokanal-Wärmesenke |
US7139172B2 (en) * | 2004-07-01 | 2006-11-21 | International Business Machines Corporation | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
US20060171801A1 (en) * | 2004-12-27 | 2006-08-03 | Matsushita Electric Industrial Co., Ltd. | Heatsink apparatus |
JP4551261B2 (ja) * | 2005-04-01 | 2010-09-22 | 株式会社日立製作所 | 冷却ジャケット |
JP4687541B2 (ja) * | 2005-04-21 | 2011-05-25 | 日本軽金属株式会社 | 液冷ジャケット |
JP2007003164A (ja) * | 2005-06-27 | 2007-01-11 | Nakamura Mfg Co Ltd | 平板状ヒートパイプまたはベーパーチャンバー、および、その形成方法 |
US7900692B2 (en) * | 2005-10-28 | 2011-03-08 | Nakamura Seisakusho Kabushikigaisha | Component package having heat exchanger |
JP4962836B2 (ja) * | 2006-01-10 | 2012-06-27 | 中村製作所株式会社 | 冷却部を備えた電子部品用パッケージ、およびその形成方法 |
US7537047B2 (en) * | 2006-03-23 | 2009-05-26 | Foxconn Technology Co., Ltd. | Liquid-cooling heat sink |
US7731079B2 (en) * | 2008-06-20 | 2010-06-08 | International Business Machines Corporation | Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled |
-
2007
- 2007-03-02 JP JP2007052169A patent/JP4876975B2/ja not_active Expired - Fee Related
-
2008
- 2008-02-29 US US12/039,962 patent/US20080216991A1/en not_active Abandoned
- 2008-02-29 CN CN200810080940.0A patent/CN101257784B/zh not_active Expired - Fee Related
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