JP2008166830A - 真空処理方法及び真空処理装置 - Google Patents

真空処理方法及び真空処理装置 Download PDF

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Publication number
JP2008166830A
JP2008166830A JP2008011466A JP2008011466A JP2008166830A JP 2008166830 A JP2008166830 A JP 2008166830A JP 2008011466 A JP2008011466 A JP 2008011466A JP 2008011466 A JP2008011466 A JP 2008011466A JP 2008166830 A JP2008166830 A JP 2008166830A
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JP
Japan
Prior art keywords
cassette
processing
wafer
wafers
vacuum processing
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Pending
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JP2008011466A
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English (en)
Japanese (ja)
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JP2008166830A5 (enExample
Inventor
Koji Nishihata
廣治 西畑
Kazuhiro Shiroo
和博 城尾
Shiyouji Ikuhara
祥二 幾原
Tetsuya Tawara
哲也 田原
Masashi Okiguchi
昌司 沖口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi Ltd
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Hitachi High Technologies Corp, Hitachi Ltd, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2008011466A priority Critical patent/JP2008166830A/ja
Publication of JP2008166830A publication Critical patent/JP2008166830A/ja
Publication of JP2008166830A5 publication Critical patent/JP2008166830A5/ja
Pending legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008011466A 2008-01-22 2008-01-22 真空処理方法及び真空処理装置 Pending JP2008166830A (ja)

Priority Applications (1)

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JP2008011466A JP2008166830A (ja) 2008-01-22 2008-01-22 真空処理方法及び真空処理装置

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JP2008011466A JP2008166830A (ja) 2008-01-22 2008-01-22 真空処理方法及び真空処理装置

Related Parent Applications (1)

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JP2004153482A Division JP4121480B2 (ja) 2004-05-24 2004-05-24 真空処理方法及び真空処理装置

Publications (2)

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JP2008166830A true JP2008166830A (ja) 2008-07-17
JP2008166830A5 JP2008166830A5 (enExample) 2009-04-30

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ID=39695744

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JP2008011466A Pending JP2008166830A (ja) 2008-01-22 2008-01-22 真空処理方法及び真空処理装置

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JP (1) JP2008166830A (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555148A (ja) * 1991-08-27 1993-03-05 Toshiba Mach Co Ltd マルチチヤンバ型枚葉処理方法およびその装置
JPH07106215A (ja) * 1993-10-08 1995-04-21 Kokusai Electric Co Ltd 半導体製造装置における障害処理方法
JPH0917838A (ja) * 1995-06-27 1997-01-17 Tokyo Electron Ltd 処理方法及び処理装置
JPH0950948A (ja) * 1995-08-08 1997-02-18 Kokusai Electric Co Ltd 半導体製造装置の障害対処システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555148A (ja) * 1991-08-27 1993-03-05 Toshiba Mach Co Ltd マルチチヤンバ型枚葉処理方法およびその装置
JPH07106215A (ja) * 1993-10-08 1995-04-21 Kokusai Electric Co Ltd 半導体製造装置における障害処理方法
JPH0917838A (ja) * 1995-06-27 1997-01-17 Tokyo Electron Ltd 処理方法及び処理装置
JPH0950948A (ja) * 1995-08-08 1997-02-18 Kokusai Electric Co Ltd 半導体製造装置の障害対処システム

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