JP2008163451A5 - - Google Patents
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- Publication number
- JP2008163451A5 JP2008163451A5 JP2007280772A JP2007280772A JP2008163451A5 JP 2008163451 A5 JP2008163451 A5 JP 2008163451A5 JP 2007280772 A JP2007280772 A JP 2007280772A JP 2007280772 A JP2007280772 A JP 2007280772A JP 2008163451 A5 JP2008163451 A5 JP 2008163451A5
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- magnetic pole
- magnetron
- total
- polarity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 230000000295 complement effect Effects 0.000 claims 1
- 238000002294 plasma sputter deposition Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/553,880 | 2006-10-27 | ||
| US11/553,880 US7767064B2 (en) | 2006-10-27 | 2006-10-27 | Position controlled dual magnetron |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008163451A JP2008163451A (ja) | 2008-07-17 |
| JP2008163451A5 true JP2008163451A5 (enExample) | 2010-10-07 |
| JP5221929B2 JP5221929B2 (ja) | 2013-06-26 |
Family
ID=39328815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007280772A Active JP5221929B2 (ja) | 2006-10-27 | 2007-10-29 | 位置制御型デュアルマグネトロン |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7767064B2 (enExample) |
| JP (1) | JP5221929B2 (enExample) |
| KR (1) | KR100912756B1 (enExample) |
| CN (1) | CN101195906B (enExample) |
| TW (1) | TWI367265B (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9771648B2 (en) | 2004-08-13 | 2017-09-26 | Zond, Inc. | Method of ionized physical vapor deposition sputter coating high aspect-ratio structures |
| US8021527B2 (en) * | 2005-09-14 | 2011-09-20 | Applied Materials, Inc. | Coaxial shafts for radial positioning of rotating magnetron |
| KR101841236B1 (ko) * | 2009-04-03 | 2018-03-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 고압 rf-dc 스퍼터링과 이 프로세스의 단차 도포성 및 막 균일성을 개선하기 위한 방법 |
| CN101994092B (zh) * | 2009-08-28 | 2012-10-31 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 磁控管装置 |
| US8624496B2 (en) | 2009-10-20 | 2014-01-07 | Muons, Inc. | Phase and frequency locked magnetron |
| US9249082B2 (en) | 2010-02-09 | 2016-02-02 | King Abdulaziz City for Science and Technology (KACST) | Synthesis of dimethyl carbonate from carbon dioxide and methanol |
| US20120024229A1 (en) * | 2010-08-02 | 2012-02-02 | Applied Materials, Inc. | Control of plasma profile using magnetic null arrangement by auxiliary magnets |
| CN102560387B (zh) * | 2010-12-10 | 2014-05-28 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 磁控源和磁控溅射设备、以及磁控溅射方法 |
| US20120181166A1 (en) * | 2011-01-14 | 2012-07-19 | Applied Materials, Inc. | Pvd process with synchronized process parameters and magnet position |
| US20130015055A1 (en) * | 2011-07-11 | 2013-01-17 | Hariharakeshava Sarpangala Hegde | Dual plasma source systems and methods for reactive plasma deposition |
| CN102994966B (zh) * | 2011-09-16 | 2015-02-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 扫描机构、磁控源和磁控溅射设备 |
| EP2938752A4 (en) * | 2012-12-28 | 2016-05-25 | Sputtering Components Inc | PLASMA ACTIVATED CHEMICAL VAPOR DEPOSITION SOURCE (PECVD) |
| US9281167B2 (en) * | 2013-02-26 | 2016-03-08 | Applied Materials, Inc. | Variable radius dual magnetron |
| EP2778253B1 (de) * | 2013-02-26 | 2018-10-24 | Oerlikon Surface Solutions AG, Pfäffikon | Zylinderförmige Verdampfungsquelle |
| US9812303B2 (en) * | 2013-03-01 | 2017-11-07 | Applied Materials, Inc. | Configurable variable position closed track magnetron |
| JP6480445B2 (ja) | 2013-08-14 | 2019-03-13 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | カプセル化されたマグネトロン |
| US9831075B2 (en) | 2013-09-17 | 2017-11-28 | Applied Materials, Inc. | Source magnet for improved resputtering uniformity in direct current (DC) physical vapor deposition (PVD) processes |
| JP6471000B2 (ja) * | 2015-02-24 | 2019-02-13 | 株式会社アルバック | マグネトロンスパッタリング装置用の磁石ユニット及びこの磁石ユニットを用いたスパッタリング方法 |
| CN107799375B (zh) * | 2016-08-30 | 2019-10-11 | 北京北方华创微电子装备有限公司 | 一种磁控元件和磁控溅射装置 |
| CN108950499B (zh) * | 2017-05-18 | 2023-10-13 | 北京北方华创微电子装备有限公司 | 磁控管旋转结构、磁控管组件及反应腔室 |
| US10513432B2 (en) * | 2017-07-31 | 2019-12-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Anti-stiction process for MEMS device |
| CN109841468B (zh) * | 2017-11-28 | 2021-06-08 | 北京北方华创微电子装备有限公司 | 磁控管组件、磁控溅射腔室及半导体加工设备 |
| TWI850717B (zh) * | 2018-06-19 | 2024-08-01 | 美商應用材料股份有限公司 | 具有多陰極的沉積系統 |
| US11462394B2 (en) * | 2018-09-28 | 2022-10-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Physical vapor deposition apparatus and method thereof |
| US11846013B2 (en) * | 2020-07-31 | 2023-12-19 | Applied Materials, Inc. | Methods and apparatus for extended chamber for through silicon via deposition |
| KR102240243B1 (ko) * | 2020-11-19 | 2021-04-14 | 주식회사 바코솔루션 | 스퍼터링 건 |
| KR102631073B1 (ko) * | 2021-01-13 | 2024-01-30 | 에이피시스템 주식회사 | 스퍼터링 장치 및 스퍼터링 방법 |
| JP7581953B2 (ja) * | 2021-02-24 | 2024-11-13 | 東京エレクトロン株式会社 | スパッタリング処理を行う装置、及び方法 |
| JP7550243B2 (ja) * | 2021-05-21 | 2024-09-12 | 株式会社アルバック | マグネトロンスパッタリング装置用のカソードユニット及びマグネトロンスパッタリング装置 |
| CN115679278B (zh) * | 2021-07-29 | 2025-01-14 | 北京北方华创微电子装备有限公司 | 一种双磁控管溅射装置及半导体工艺设备 |
| CN114774872B (zh) * | 2022-04-29 | 2023-09-08 | 北京北方华创微电子装备有限公司 | 磁控管装置及磁控溅射设备 |
| CN115305454B (zh) * | 2022-08-26 | 2023-09-08 | 北京北方华创微电子装备有限公司 | 磁控管装置及磁控溅射设备 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03229867A (ja) * | 1990-02-02 | 1991-10-11 | Nec Corp | マグネトロン型スパッタ装置 |
| JPH04154966A (ja) * | 1990-10-16 | 1992-05-27 | Hitachi Ltd | プラズマ処理方法および装置 |
| DE4128340C2 (de) * | 1991-08-27 | 1999-09-23 | Leybold Ag | Zerstäubungskathodenanordnung nach dem Magnetron-Prinzip für die Beschichtung einer kreisringförmigen Beschichtungsfläche |
| JPH11340165A (ja) * | 1998-05-20 | 1999-12-10 | Applied Materials Inc | スパッタリング装置及びマグネトロンユニット |
| KR20000002614A (ko) * | 1998-06-22 | 2000-01-15 | 김덕중 | 스퍼터링 장치 |
| US6228236B1 (en) | 1999-10-22 | 2001-05-08 | Applied Materials, Inc. | Sputter magnetron having two rotation diameters |
| KR100439474B1 (ko) * | 2001-09-12 | 2004-07-09 | 삼성전자주식회사 | 스퍼터링 장치 |
| US7018515B2 (en) | 2004-03-24 | 2006-03-28 | Applied Materials, Inc. | Selectable dual position magnetron |
| US7686928B2 (en) | 2004-09-23 | 2010-03-30 | Applied Materials, Inc. | Pressure switched dual magnetron |
-
2006
- 2006-10-27 US US11/553,880 patent/US7767064B2/en active Active
-
2007
- 2007-10-26 CN CN2007101653503A patent/CN101195906B/zh not_active Expired - Fee Related
- 2007-10-26 KR KR1020070108288A patent/KR100912756B1/ko active Active
- 2007-10-26 TW TW096140352A patent/TWI367265B/zh not_active IP Right Cessation
- 2007-10-29 JP JP2007280772A patent/JP5221929B2/ja active Active
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