JP2008160163A5 - - Google Patents

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Publication number
JP2008160163A5
JP2008160163A5 JP2008075930A JP2008075930A JP2008160163A5 JP 2008160163 A5 JP2008160163 A5 JP 2008160163A5 JP 2008075930 A JP2008075930 A JP 2008075930A JP 2008075930 A JP2008075930 A JP 2008075930A JP 2008160163 A5 JP2008160163 A5 JP 2008160163A5
Authority
JP
Japan
Prior art keywords
lead
electrode
sealing body
resin sealing
drain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008075930A
Other languages
English (en)
Japanese (ja)
Other versions
JP4804497B2 (ja
JP2008160163A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008075930A priority Critical patent/JP4804497B2/ja
Priority claimed from JP2008075930A external-priority patent/JP4804497B2/ja
Publication of JP2008160163A publication Critical patent/JP2008160163A/ja
Publication of JP2008160163A5 publication Critical patent/JP2008160163A5/ja
Application granted granted Critical
Publication of JP4804497B2 publication Critical patent/JP4804497B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2008075930A 2008-03-24 2008-03-24 半導体装置 Expired - Lifetime JP4804497B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008075930A JP4804497B2 (ja) 2008-03-24 2008-03-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008075930A JP4804497B2 (ja) 2008-03-24 2008-03-24 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003054638A Division JP4173751B2 (ja) 2003-02-28 2003-02-28 半導体装置

Publications (3)

Publication Number Publication Date
JP2008160163A JP2008160163A (ja) 2008-07-10
JP2008160163A5 true JP2008160163A5 (pt) 2008-09-04
JP4804497B2 JP4804497B2 (ja) 2011-11-02

Family

ID=39660648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008075930A Expired - Lifetime JP4804497B2 (ja) 2008-03-24 2008-03-24 半導体装置

Country Status (1)

Country Link
JP (1) JP4804497B2 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101752358B (zh) * 2008-12-08 2012-07-04 万国半导体有限公司 带有整合旁路电容器的紧密半导体封装及其方法
JP2010165923A (ja) * 2009-01-16 2010-07-29 Renesas Electronics Corp 半導体装置、及びその製造方法
JP5921072B2 (ja) * 2011-03-05 2016-05-24 新電元工業株式会社 樹脂封止型半導体装置
JP2017050489A (ja) * 2015-09-04 2017-03-09 株式会社東芝 半導体パッケージおよび半導体パッケージの製造方法
JP6967335B2 (ja) * 2016-03-15 2021-11-17 ローム株式会社 半導体装置
JP6884723B2 (ja) * 2018-03-23 2021-06-09 株式会社東芝 半導体装置
JP7150461B2 (ja) 2018-04-24 2022-10-11 ローム株式会社 半導体装置
JP7419781B2 (ja) 2019-12-10 2024-01-23 富士電機株式会社 半導体モジュール
JP7337034B2 (ja) * 2020-09-15 2023-09-01 三菱電機株式会社 半導体パッケージおよび半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6249041B1 (en) * 1998-06-02 2001-06-19 Siliconix Incorporated IC chip package with directly connected leads
JP4260263B2 (ja) * 1999-01-28 2009-04-30 株式会社ルネサステクノロジ 半導体装置
JP3650008B2 (ja) * 2000-09-04 2005-05-18 三洋電機株式会社 Ｍｏｓｆｅｔを用いた保護回路装置およびその製造方法
JP3639515B2 (ja) * 2000-09-04 2005-04-20 三洋電機株式会社 Ｍｏｓｆｅｔの実装構造の製造方法

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