JP2008156572A - 樹脂用可塑剤およびそれを含む樹脂組成物 - Google Patents

樹脂用可塑剤およびそれを含む樹脂組成物 Download PDF

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Publication number
JP2008156572A
JP2008156572A JP2006350044A JP2006350044A JP2008156572A JP 2008156572 A JP2008156572 A JP 2008156572A JP 2006350044 A JP2006350044 A JP 2006350044A JP 2006350044 A JP2006350044 A JP 2006350044A JP 2008156572 A JP2008156572 A JP 2008156572A
Authority
JP
Japan
Prior art keywords
resin
resin composition
plasticizer
sealing
sealant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2006350044A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008156572A5 (https=
Inventor
Yoshio Ikeda
佳生 池田
Takashi Kashiwamura
孝 柏村
Kunio Takeuchi
邦夫 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Kosan Co Ltd
Original Assignee
Idemitsu Kosan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Kosan Co Ltd filed Critical Idemitsu Kosan Co Ltd
Priority to JP2006350044A priority Critical patent/JP2008156572A/ja
Priority to PCT/JP2007/056619 priority patent/WO2008078417A1/ja
Priority to US12/520,991 priority patent/US8017677B2/en
Priority to EP07740057A priority patent/EP2098563B1/en
Priority to CN2007800483999A priority patent/CN101568579B/zh
Publication of JP2008156572A publication Critical patent/JP2008156572A/ja
Publication of JP2008156572A5 publication Critical patent/JP2008156572A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2006350044A 2006-12-26 2006-12-26 樹脂用可塑剤およびそれを含む樹脂組成物 Ceased JP2008156572A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006350044A JP2008156572A (ja) 2006-12-26 2006-12-26 樹脂用可塑剤およびそれを含む樹脂組成物
PCT/JP2007/056619 WO2008078417A1 (ja) 2006-12-26 2007-03-28 樹脂用可塑剤およびそれを含む樹脂組成物
US12/520,991 US8017677B2 (en) 2006-12-26 2007-03-28 Plasticizer for resin and resin composition containing the same
EP07740057A EP2098563B1 (en) 2006-12-26 2007-03-28 Plasticizer for resin and resin composition containing the same
CN2007800483999A CN101568579B (zh) 2006-12-26 2007-03-28 树脂用增塑剂及含有该增塑剂的树脂组合物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006350044A JP2008156572A (ja) 2006-12-26 2006-12-26 樹脂用可塑剤およびそれを含む樹脂組成物

Publications (2)

Publication Number Publication Date
JP2008156572A true JP2008156572A (ja) 2008-07-10
JP2008156572A5 JP2008156572A5 (https=) 2009-10-15

Family

ID=39562212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006350044A Ceased JP2008156572A (ja) 2006-12-26 2006-12-26 樹脂用可塑剤およびそれを含む樹脂組成物

Country Status (5)

Country Link
US (1) US8017677B2 (https=)
EP (1) EP2098563B1 (https=)
JP (1) JP2008156572A (https=)
CN (1) CN101568579B (https=)
WO (1) WO2008078417A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168568A (ja) * 2008-12-26 2010-08-05 Idemitsu Kosan Co Ltd 塩化ビニル系樹脂ペースト組成物
JP2011094001A (ja) * 2009-10-29 2011-05-12 Idemitsu Kosan Co Ltd ペースト状組成物
JP2012097220A (ja) * 2010-11-04 2012-05-24 Momentive Performance Materials Inc 室温硬化性ポリオルガノシロキサン組成物
JP2018510256A (ja) * 2015-02-03 2018-04-12 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 低表面エネルギーフィルムを接着するためのポリウレタン接着剤

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2444450A1 (de) * 2010-10-19 2012-04-25 Hinterwaldner Consulting & Partner (Gbr) Zusammensetzungen zur Herstellung abhäsiver Beschichtungen
WO2018012631A1 (ja) * 2016-07-14 2018-01-18 株式会社スリーボンド 硬化性樹脂組成物、硬化物、燃料電池およびシール方法
US10900242B2 (en) * 2019-04-23 2021-01-26 Jim Louis Valentine Coated baseboard for sports floor
CN115296692B (zh) * 2021-01-28 2024-09-03 维沃移动通信有限公司 终端的双卡通信方法、装置、设备及存储介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0953010A (ja) * 1995-08-10 1997-02-25 Kanegafuchi Chem Ind Co Ltd 硬化性樹脂組成物
WO2001042365A1 (en) * 1999-12-10 2001-06-14 General Electric Company Room temperature curable silicone sealant
WO2005080504A1 (ja) * 2004-02-20 2005-09-01 Idemitsu Kosan Co., Ltd. ポリウレタン組成物及びその成形品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5536241A (en) 1978-09-05 1980-03-13 Kanegafuchi Chem Ind Co Ltd Curable composition
JP2752070B2 (ja) 1987-12-05 1998-05-18 鐘淵化学工業株式会社 硬化性密封剤組成物
JP3062635B2 (ja) 1991-09-09 2000-07-12 鐘淵化学工業株式会社 硬化性組成物
CA2229048A1 (en) * 1995-08-10 1997-02-20 Kanegafuchi Chemical Industry Co., Ltd. Curable polymer composition
JP3890546B2 (ja) 1997-08-01 2007-03-07 コニシ株式会社 一液湿気硬化型シーラント
US6070004A (en) 1997-09-25 2000-05-30 Siemens Aktiengesellschaft Method of maximizing chip yield for semiconductor wafers
JP3325827B2 (ja) * 1998-03-09 2002-09-17 サンスター技研株式会社 建築用シーリング材
US6124419A (en) * 1998-08-14 2000-09-26 Dow Corning, Limited Release modifier compositions
JP3573983B2 (ja) * 1998-11-26 2004-10-06 サンスター技研株式会社 二液型シーリング材組成物
JP2001115129A (ja) 1999-10-20 2001-04-24 Sekisui Chem Co Ltd 一液湿気硬化型接着剤及びシーラント
JP2001329126A (ja) * 2000-05-22 2001-11-27 Bridgestone Corp 硬化性組成物
US6664323B2 (en) * 2001-02-02 2003-12-16 General Electric Company Moisture curable sealants
US20070265380A1 (en) * 2003-11-19 2007-11-15 Kaneka Corporation Hardening Resin Composition
JP2004182997A (ja) * 2004-01-23 2004-07-02 Sunstar Eng Inc 二液型硬化性組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0953010A (ja) * 1995-08-10 1997-02-25 Kanegafuchi Chem Ind Co Ltd 硬化性樹脂組成物
WO2001042365A1 (en) * 1999-12-10 2001-06-14 General Electric Company Room temperature curable silicone sealant
WO2005080504A1 (ja) * 2004-02-20 2005-09-01 Idemitsu Kosan Co., Ltd. ポリウレタン組成物及びその成形品

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168568A (ja) * 2008-12-26 2010-08-05 Idemitsu Kosan Co Ltd 塩化ビニル系樹脂ペースト組成物
JP2011094001A (ja) * 2009-10-29 2011-05-12 Idemitsu Kosan Co Ltd ペースト状組成物
JP2012097220A (ja) * 2010-11-04 2012-05-24 Momentive Performance Materials Inc 室温硬化性ポリオルガノシロキサン組成物
JP2018510256A (ja) * 2015-02-03 2018-04-12 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 低表面エネルギーフィルムを接着するためのポリウレタン接着剤
US11015094B2 (en) 2015-02-03 2021-05-25 Henkel IP & Holding GmbH Polyurethane adhesives for bonding low surface energy films

Also Published As

Publication number Publication date
US20100022692A1 (en) 2010-01-28
EP2098563A4 (en) 2009-12-30
EP2098563A1 (en) 2009-09-09
EP2098563B1 (en) 2013-01-16
US8017677B2 (en) 2011-09-13
CN101568579A (zh) 2009-10-28
CN101568579B (zh) 2012-07-18
WO2008078417A1 (ja) 2008-07-03

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