CN101568579B - 树脂用增塑剂及含有该增塑剂的树脂组合物 - Google Patents

树脂用增塑剂及含有该增塑剂的树脂组合物 Download PDF

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Publication number
CN101568579B
CN101568579B CN2007800483999A CN200780048399A CN101568579B CN 101568579 B CN101568579 B CN 101568579B CN 2007800483999 A CN2007800483999 A CN 2007800483999A CN 200780048399 A CN200780048399 A CN 200780048399A CN 101568579 B CN101568579 B CN 101568579B
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CN
China
Prior art keywords
resin
resin composition
silyl
plasticizer
sealing
Prior art date
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Expired - Fee Related
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CN2007800483999A
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English (en)
Chinese (zh)
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CN101568579A (zh
Inventor
池田佳生
柏村孝
竹内邦夫
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Idemitsu Kosan Co Ltd
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Idemitsu Kosan Co Ltd
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Publication of CN101568579A publication Critical patent/CN101568579A/zh
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Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN2007800483999A 2006-12-26 2007-03-28 树脂用增塑剂及含有该增塑剂的树脂组合物 Expired - Fee Related CN101568579B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP350044/2006 2006-12-26
JP2006350044A JP2008156572A (ja) 2006-12-26 2006-12-26 樹脂用可塑剤およびそれを含む樹脂組成物
PCT/JP2007/056619 WO2008078417A1 (ja) 2006-12-26 2007-03-28 樹脂用可塑剤およびそれを含む樹脂組成物

Publications (2)

Publication Number Publication Date
CN101568579A CN101568579A (zh) 2009-10-28
CN101568579B true CN101568579B (zh) 2012-07-18

Family

ID=39562212

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800483999A Expired - Fee Related CN101568579B (zh) 2006-12-26 2007-03-28 树脂用增塑剂及含有该增塑剂的树脂组合物

Country Status (5)

Country Link
US (1) US8017677B2 (https=)
EP (1) EP2098563B1 (https=)
JP (1) JP2008156572A (https=)
CN (1) CN101568579B (https=)
WO (1) WO2008078417A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168568A (ja) * 2008-12-26 2010-08-05 Idemitsu Kosan Co Ltd 塩化ビニル系樹脂ペースト組成物
JP2011094001A (ja) * 2009-10-29 2011-05-12 Idemitsu Kosan Co Ltd ペースト状組成物
EP2444450A1 (de) * 2010-10-19 2012-04-25 Hinterwaldner Consulting & Partner (Gbr) Zusammensetzungen zur Herstellung abhäsiver Beschichtungen
JP5547037B2 (ja) * 2010-11-04 2014-07-09 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
WO2016124499A1 (en) 2015-02-03 2016-08-11 Henkel Ag & Co. Kgaa Polyurethane adhesives for bonding low surface energy films
WO2018012631A1 (ja) * 2016-07-14 2018-01-18 株式会社スリーボンド 硬化性樹脂組成物、硬化物、燃料電池およびシール方法
US10900242B2 (en) * 2019-04-23 2021-01-26 Jim Louis Valentine Coated baseboard for sports floor
CN115296692B (zh) * 2021-01-28 2024-09-03 维沃移动通信有限公司 终端的双卡通信方法、装置、设备及存储介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0844282A1 (en) * 1995-08-10 1998-05-27 Kanegafuchi Chemical Industry Co., Ltd. Curable polymer composition
CN1408014A (zh) * 1999-12-10 2003-04-02 通用电气公司 室温固化的聚硅氧烷密封剂
EP1717272A1 (en) * 2004-02-20 2006-11-02 Idemitsu Kosan Co., Ltd. Polyurethane composition and molded article thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5536241A (en) 1978-09-05 1980-03-13 Kanegafuchi Chem Ind Co Ltd Curable composition
JP2752070B2 (ja) 1987-12-05 1998-05-18 鐘淵化学工業株式会社 硬化性密封剤組成物
JP3062635B2 (ja) 1991-09-09 2000-07-12 鐘淵化学工業株式会社 硬化性組成物
JP3637109B2 (ja) * 1995-08-10 2005-04-13 株式会社カネカ 硬化性樹脂組成物
JP3890546B2 (ja) 1997-08-01 2007-03-07 コニシ株式会社 一液湿気硬化型シーラント
US6070004A (en) 1997-09-25 2000-05-30 Siemens Aktiengesellschaft Method of maximizing chip yield for semiconductor wafers
JP3325827B2 (ja) * 1998-03-09 2002-09-17 サンスター技研株式会社 建築用シーリング材
US6124419A (en) * 1998-08-14 2000-09-26 Dow Corning, Limited Release modifier compositions
JP3573983B2 (ja) * 1998-11-26 2004-10-06 サンスター技研株式会社 二液型シーリング材組成物
JP2001115129A (ja) 1999-10-20 2001-04-24 Sekisui Chem Co Ltd 一液湿気硬化型接着剤及びシーラント
JP2001329126A (ja) * 2000-05-22 2001-11-27 Bridgestone Corp 硬化性組成物
US6664323B2 (en) * 2001-02-02 2003-12-16 General Electric Company Moisture curable sealants
US20070265380A1 (en) * 2003-11-19 2007-11-15 Kaneka Corporation Hardening Resin Composition
JP2004182997A (ja) * 2004-01-23 2004-07-02 Sunstar Eng Inc 二液型硬化性組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0844282A1 (en) * 1995-08-10 1998-05-27 Kanegafuchi Chemical Industry Co., Ltd. Curable polymer composition
CN1408014A (zh) * 1999-12-10 2003-04-02 通用电气公司 室温固化的聚硅氧烷密封剂
EP1717272A1 (en) * 2004-02-20 2006-11-02 Idemitsu Kosan Co., Ltd. Polyurethane composition and molded article thereof

Also Published As

Publication number Publication date
US20100022692A1 (en) 2010-01-28
EP2098563A4 (en) 2009-12-30
JP2008156572A (ja) 2008-07-10
EP2098563A1 (en) 2009-09-09
EP2098563B1 (en) 2013-01-16
US8017677B2 (en) 2011-09-13
CN101568579A (zh) 2009-10-28
WO2008078417A1 (ja) 2008-07-03

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SE01 Entry into force of request for substantive examination
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Granted publication date: 20120718

Termination date: 20140328