WO2008078417A1 - 樹脂用可塑剤およびそれを含む樹脂組成物 - Google Patents

樹脂用可塑剤およびそれを含む樹脂組成物 Download PDF

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Publication number
WO2008078417A1
WO2008078417A1 PCT/JP2007/056619 JP2007056619W WO2008078417A1 WO 2008078417 A1 WO2008078417 A1 WO 2008078417A1 JP 2007056619 W JP2007056619 W JP 2007056619W WO 2008078417 A1 WO2008078417 A1 WO 2008078417A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
resin
plasticizer
same
composition containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/056619
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Yoshio Ikeda
Takashi Kashiwamura
Kunio Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Kosan Co Ltd
Original Assignee
Idemitsu Kosan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Kosan Co Ltd filed Critical Idemitsu Kosan Co Ltd
Priority to US12/520,991 priority Critical patent/US8017677B2/en
Priority to EP07740057A priority patent/EP2098563B1/en
Priority to CN2007800483999A priority patent/CN101568579B/zh
Publication of WO2008078417A1 publication Critical patent/WO2008078417A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/01Hydrocarbons
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/15Heterocyclic compounds having oxygen in the ring
    • C08K5/151Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515Three-membered rings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00Compositions for sealing or packing joints
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/JP2007/056619 2006-12-26 2007-03-28 樹脂用可塑剤およびそれを含む樹脂組成物 Ceased WO2008078417A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/520,991 US8017677B2 (en) 2006-12-26 2007-03-28 Plasticizer for resin and resin composition containing the same
EP07740057A EP2098563B1 (en) 2006-12-26 2007-03-28 Plasticizer for resin and resin composition containing the same
CN2007800483999A CN101568579B (zh) 2006-12-26 2007-03-28 树脂用增塑剂及含有该增塑剂的树脂组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006350044A JP2008156572A (ja) 2006-12-26 2006-12-26 樹脂用可塑剤およびそれを含む樹脂組成物
JP2006-350044 2006-12-26

Publications (1)

Publication Number Publication Date
WO2008078417A1 true WO2008078417A1 (ja) 2008-07-03

Family

ID=39562212

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/056619 Ceased WO2008078417A1 (ja) 2006-12-26 2007-03-28 樹脂用可塑剤およびそれを含む樹脂組成物

Country Status (5)

Country Link
US (1) US8017677B2 (https=)
EP (1) EP2098563B1 (https=)
JP (1) JP2008156572A (https=)
CN (1) CN101568579B (https=)
WO (1) WO2008078417A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130266811A1 (en) * 2010-10-19 2013-10-10 Hinterwaldner Consulting & Partner Compositions for production of abhesive coatings

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168568A (ja) * 2008-12-26 2010-08-05 Idemitsu Kosan Co Ltd 塩化ビニル系樹脂ペースト組成物
JP2011094001A (ja) * 2009-10-29 2011-05-12 Idemitsu Kosan Co Ltd ペースト状組成物
JP5547037B2 (ja) * 2010-11-04 2014-07-09 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
WO2016124499A1 (en) 2015-02-03 2016-08-11 Henkel Ag & Co. Kgaa Polyurethane adhesives for bonding low surface energy films
WO2018012631A1 (ja) * 2016-07-14 2018-01-18 株式会社スリーボンド 硬化性樹脂組成物、硬化物、燃料電池およびシール方法
US10900242B2 (en) * 2019-04-23 2021-01-26 Jim Louis Valentine Coated baseboard for sports floor
CN115296692B (zh) * 2021-01-28 2024-09-03 维沃移动通信有限公司 终端的双卡通信方法、装置、设备及存储介质

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5536241A (en) 1978-09-05 1980-03-13 Kanegafuchi Chem Ind Co Ltd Curable composition
JPH01149851A (ja) 1987-12-05 1989-06-12 Kanegafuchi Chem Ind Co Ltd 硬化性密封剤組成物
JPH0565400A (ja) 1991-09-09 1993-03-19 Kanegafuchi Chem Ind Co Ltd 硬化性組成物
JPH0953010A (ja) * 1995-08-10 1997-02-25 Kanegafuchi Chem Ind Co Ltd 硬化性樹脂組成物
JPH1150045A (ja) 1997-08-01 1999-02-23 Konishi Kk 一液湿気硬化型シーラント
JPH11255986A (ja) * 1998-03-09 1999-09-21 Sunstar Eng Inc 建築用シーリング材
JP2000160133A (ja) * 1998-11-26 2000-06-13 Sunstar Eng Inc 二液型シーリング材組成物
JP2001115129A (ja) 1999-10-20 2001-04-24 Sekisui Chem Co Ltd 一液湿気硬化型接着剤及びシーラント
WO2001042365A1 (en) * 1999-12-10 2001-06-14 General Electric Company Room temperature curable silicone sealant
JP2001329126A (ja) * 2000-05-22 2001-11-27 Bridgestone Corp 硬化性組成物
JP2004182997A (ja) * 2004-01-23 2004-07-02 Sunstar Eng Inc 二液型硬化性組成物
WO2005080504A1 (ja) * 2004-02-20 2005-09-01 Idemitsu Kosan Co., Ltd. ポリウレタン組成物及びその成形品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2229048A1 (en) * 1995-08-10 1997-02-20 Kanegafuchi Chemical Industry Co., Ltd. Curable polymer composition
US6070004A (en) 1997-09-25 2000-05-30 Siemens Aktiengesellschaft Method of maximizing chip yield for semiconductor wafers
US6124419A (en) * 1998-08-14 2000-09-26 Dow Corning, Limited Release modifier compositions
US6664323B2 (en) * 2001-02-02 2003-12-16 General Electric Company Moisture curable sealants
US20070265380A1 (en) * 2003-11-19 2007-11-15 Kaneka Corporation Hardening Resin Composition

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5536241A (en) 1978-09-05 1980-03-13 Kanegafuchi Chem Ind Co Ltd Curable composition
JPH01149851A (ja) 1987-12-05 1989-06-12 Kanegafuchi Chem Ind Co Ltd 硬化性密封剤組成物
JPH0565400A (ja) 1991-09-09 1993-03-19 Kanegafuchi Chem Ind Co Ltd 硬化性組成物
JPH0953010A (ja) * 1995-08-10 1997-02-25 Kanegafuchi Chem Ind Co Ltd 硬化性樹脂組成物
JPH1150045A (ja) 1997-08-01 1999-02-23 Konishi Kk 一液湿気硬化型シーラント
JPH11255986A (ja) * 1998-03-09 1999-09-21 Sunstar Eng Inc 建築用シーリング材
JP2000160133A (ja) * 1998-11-26 2000-06-13 Sunstar Eng Inc 二液型シーリング材組成物
JP2001115129A (ja) 1999-10-20 2001-04-24 Sekisui Chem Co Ltd 一液湿気硬化型接着剤及びシーラント
WO2001042365A1 (en) * 1999-12-10 2001-06-14 General Electric Company Room temperature curable silicone sealant
JP2001329126A (ja) * 2000-05-22 2001-11-27 Bridgestone Corp 硬化性組成物
JP2004182997A (ja) * 2004-01-23 2004-07-02 Sunstar Eng Inc 二液型硬化性組成物
WO2005080504A1 (ja) * 2004-02-20 2005-09-01 Idemitsu Kosan Co., Ltd. ポリウレタン組成物及びその成形品

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2098563A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130266811A1 (en) * 2010-10-19 2013-10-10 Hinterwaldner Consulting & Partner Compositions for production of abhesive coatings

Also Published As

Publication number Publication date
US20100022692A1 (en) 2010-01-28
EP2098563A4 (en) 2009-12-30
JP2008156572A (ja) 2008-07-10
EP2098563A1 (en) 2009-09-09
EP2098563B1 (en) 2013-01-16
US8017677B2 (en) 2011-09-13
CN101568579A (zh) 2009-10-28
CN101568579B (zh) 2012-07-18

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