JP2008153690A - 真空処理方法及び真空処理装置 - Google Patents

真空処理方法及び真空処理装置 Download PDF

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Publication number
JP2008153690A
JP2008153690A JP2008040026A JP2008040026A JP2008153690A JP 2008153690 A JP2008153690 A JP 2008153690A JP 2008040026 A JP2008040026 A JP 2008040026A JP 2008040026 A JP2008040026 A JP 2008040026A JP 2008153690 A JP2008153690 A JP 2008153690A
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JP
Japan
Prior art keywords
processing
cassette
wafer
wafers
vacuum
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Pending
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JP2008040026A
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English (en)
Japanese (ja)
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JP2008153690A5 (enExample
Inventor
Koji Nishihata
廣治 西畑
Kazuhiro Shiroo
和博 城尾
Shiyouji Ikuhara
祥二 幾原
Tetsuya Tawara
哲也 田原
Masashi Okiguchi
昌司 沖口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi Ltd
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Hitachi High Technologies Corp, Hitachi Ltd, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2008040026A priority Critical patent/JP2008153690A/ja
Publication of JP2008153690A publication Critical patent/JP2008153690A/ja
Publication of JP2008153690A5 publication Critical patent/JP2008153690A5/ja
Pending legal-status Critical Current

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JP2008040026A 2008-02-21 2008-02-21 真空処理方法及び真空処理装置 Pending JP2008153690A (ja)

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JP2008040026A JP2008153690A (ja) 2008-02-21 2008-02-21 真空処理方法及び真空処理装置

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JP2008040026A JP2008153690A (ja) 2008-02-21 2008-02-21 真空処理方法及び真空処理装置

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JP2008011462A Division JP4252103B2 (ja) 2008-01-22 2008-01-22 真空処理方法及び真空処理装置

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JP2008153690A true JP2008153690A (ja) 2008-07-03
JP2008153690A5 JP2008153690A5 (enExample) 2009-04-30

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ID=39655460

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JP2008040026A Pending JP2008153690A (ja) 2008-02-21 2008-02-21 真空処理方法及び真空処理装置

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JP (1) JP2008153690A (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555148A (ja) * 1991-08-27 1993-03-05 Toshiba Mach Co Ltd マルチチヤンバ型枚葉処理方法およびその装置
JPH05226453A (ja) * 1992-02-17 1993-09-03 Hitachi Ltd 真空処理装置
JPH07254538A (ja) * 1994-03-15 1995-10-03 Toshiba Mach Co Ltd 加熱処理装置
JPH08181189A (ja) * 1994-06-30 1996-07-12 Diamond Semiconductor Group Inc 真空中処理における加工物の高速度移動

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555148A (ja) * 1991-08-27 1993-03-05 Toshiba Mach Co Ltd マルチチヤンバ型枚葉処理方法およびその装置
JPH05226453A (ja) * 1992-02-17 1993-09-03 Hitachi Ltd 真空処理装置
JPH07254538A (ja) * 1994-03-15 1995-10-03 Toshiba Mach Co Ltd 加熱処理装置
JPH08181189A (ja) * 1994-06-30 1996-07-12 Diamond Semiconductor Group Inc 真空中処理における加工物の高速度移動

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