JP2008124482A5

JP2008124482A5 -

Info

Publication number: JP2008124482A5
Application number: JP2007305683A
Authority: JP
Filing date: 2007-11-27
Publication date: 2010-04-02
Anticipated expiration: 2021-03-27

Claims

A processing apparatus for performing a series of processes including resist coating and development after exposure on a substrate to be processed,
A cleaning processing unit in which a cleaning process and a drying process are performed with the cleaning liquid while the substrate to be processed is transported substantially horizontally in the first direction;
A resist processing unit that performs resist processing including application of a resist solution while the substrate to be processed is transported substantially horizontally in the first direction ;
A developer coating, the developer is removed after development, and a development processing unit to perform the drying process, and
The cleaning processing unit, the resist processing unit, and the development processing unit are provided on both sides of an exposure apparatus ,
The resist processing unit is provided so as to face the cleaning processing unit across a space,
A first transfer device provided adjacent to one end of the cleaning processing unit and the resist processing unit, and carrying a substrate to be processed into the cleaning processing unit and the resist processing unit;
A second transfer device provided adjacent to the other end of the cleaning processing unit and the resist processing unit, and for carrying out a substrate to be processed from the cleaning processing unit and the resist processing unit;
A placement moving means that is movable in the space with the substrate to be processed placed thereon, and
The placing movement means receives the substrate to be processed that has been cleaned and dried from the second transport device, and moves in the space in a second direction opposite to the first direction,
The first transfer device is configured to receive the substrate to be processed that has been cleaned and dried from the placement moving means that has moved in the space, and carry the substrate into the resist processing unit. A processing device.

A cleaning processing unit in which a cleaning process and a drying process are performed with the cleaning liquid while the substrate to be processed is transported substantially horizontally in the first direction;
A resist processing unit that is provided so as to face the cleaning processing unit across a space, and performs a resist process including application of a resist solution while the substrate to be processed is transported substantially horizontally in the first direction;
A first transfer device provided adjacent to one end of the cleaning processing unit and the resist processing unit, and carrying a substrate to be processed into the cleaning processing unit and the resist processing unit;
A second transfer device provided adjacent to the other end of the cleaning processing unit and the resist processing unit, and for carrying out a substrate to be processed from the cleaning processing unit and the resist processing unit;
A placement moving means that is movable in the space with the substrate to be processed placed thereon, and
The placing movement means receives the substrate to be processed that has been cleaned and dried from the second transport device, and moves in the space in a second direction opposite to the first direction,
The first transfer device is configured to receive the substrate to be processed that has been cleaned and dried from the placement moving means that has moved in the space, and carry the substrate into the resist processing unit. A processing device.

A cleaning processing unit in which a cleaning process and a drying process are performed with the cleaning liquid while the substrate to be processed is transported substantially horizontally in the first direction;
A resist processing unit that is provided so as to face the cleaning processing unit across a space, and performs a resist process including application of a resist solution while the substrate to be processed is transported substantially horizontally in the first direction;
A first pass unit provided at one end of the cleaning processing unit and the resist processing unit, a first pass unit provided at the one end, and a second pass provided at the carry-in side of the resist processing unit A first thermal processing unit section containing the unit;
A third pass unit provided at the other end of the cleaning processing unit and the resist processing unit, provided on the carry-out side of the cleaning processing unit, and a fourth pass provided on the carry-out side of the resist processing unit. A second thermal processing unit section including a pass cooling unit provided at the other end of the pass unit;
A first transport device provided adjacent to the first thermal processing unit section;
A second transport device provided adjacent to the second thermal processing unit section;
A placement moving means that is movable in the space with the substrate to be processed placed thereon, and
The first transport device transports a substrate to be processed from the first pass unit to the cleaning processing unit,
The second transport device transports the substrate to be processed, which has been cleaned and dried, from the third pass unit to the placement moving means,
The placement moving means moves the substrate to be processed which has been cleaned and dried in the second direction opposite to the first direction in the space to a position adjacent to the first transfer device. Move
The first transport device transports the substrate to be processed, which has been cleaned and dried, from the placement moving means that has moved in the space to the second pass unit,
The processing apparatus, wherein the second transfer device is configured to transfer a substrate to be processed, which has been subjected to resist processing, from the fourth pass unit to the pass / cooling unit .

The first thermal processing unit section is a first cooling unit that is vertically stacked on the first pass unit and cools the substrate to be processed, and a first hydrophobic unit that performs a hydrophobic treatment on the substrate to be processed. 2 adhesion processing units, a second cooling unit that is vertically stacked on the second pass unit and that cools the substrate to be processed, and a second adhesion processing unit that performs hydrophobic treatment on the substrate to be processed Further comprising
The second thermal processing unit section includes a dehydration bake unit that vertically stacks on the third pass unit and performs a dehydration bake process on the substrate to be processed, and a vertical on the fourth pass unit. The processing apparatus according to claim 3, further comprising a pre-bake unit that performs a pre-bake process on the substrates stacked in a direction .

A development processing unit that performs developer coating, developer removal after development, and drying treatment, and an exposure apparatus are further provided.
The processing apparatus according to claim 3, wherein the cleaning processing unit, the resist processing unit, and the development processing unit are provided on both sides of the exposure apparatus.

A processing apparatus for performing a series of processing including cleaning, resist coating and development after exposure on a substrate to be processed,
A pre-processing unit provided on the upstream side of the exposure apparatus;
A post-processing unit provided on the downstream side of the exposure apparatus;
A first interface unit that delivers a substrate to be processed from the pre-processing unit to the exposure apparatus;
A second interface unit that delivers a substrate to be processed from the exposure apparatus to the subsequent processing unit;
The pre-processing unit is
A carry-in section into which the substrate to be treated is carried
A cleaning processing unit in which a cleaning process and a drying process are performed with the cleaning liquid while the substrate to be processed is transported substantially horizontally in the first direction ;
A resist process including application of a resist solution is performed while the substrate to be processed is conveyed substantially horizontally in the first direction, and a resist processing unit provided facing the cleaning processing unit through a space;
A first thermal processing unit section in which a plurality of thermal processing units for performing predetermined thermal processing on the target substrate unloaded from the cleaning processing unit are aggregated;
A second thermal processing unit section in which a plurality of thermal processing units for performing predetermined thermal processing on the target substrate unloaded from the resist processing unit are aggregated;
The space between the cleaning processing unit and the resist processing unit is movably provided, and the substrate is unloaded from the cleaning processing unit with the substrate to be processed placed on the space opposite to the first direction. And a placement moving means for moving the substrate to be processed to a position where the substrate can be loaded into the resist processing unit.
The post-processing unit is
A development processing unit that applies the developer, removes the developer after development, and performs a drying process while the substrate to be processed is conveyed substantially horizontally;
A third thermal processing unit section in which a plurality of thermal processing units for performing predetermined thermal processing on the substrate to be processed unloaded from the development processing unit are integrated;
A processing apparatus comprising: an unloading unit from which a substrate to be processed is unloaded.

The pre-processing unit is
Both the cleaning processing unit and the resist processing unit have a carry-in port on the carry-in unit side, and have a carry-out port on the first interface unit side,
The first thermal processing unit section is provided adjacent to the carry-in portion; the second thermal processing unit section is provided adjacent to the first interface portion;
The substrate to be processed in the carry-in portion is transferred to the cleaning processing unit, and the substrate to be processed placed on the placement moving means is transferred to the first thermal processing unit section and the first thermal processing is performed. A first transfer device for delivering a substrate to be processed from a unit section to the resist processing unit;
The substrate to be processed unloaded from the cleaning processing unit is transferred to the placement moving means, and the substrate to be processed unloaded from the resist processing unit is transferred to the second thermal processing unit section and the second The processing apparatus according to claim 6, further comprising a second transfer device that transfers a substrate to be processed from the thermal processing unit section of the second processing unit to the interface unit.

The post-processing unit is
Having the third thermal processing unit section adjacent to the unloading section;
A third transfer device for delivering the substrate to be processed of the second interface unit to the development processing unit;
A fourth transfer device that transfers the substrate unloaded from the development processing unit to the third thermal processing unit section and transfers the substrate to be processed from the third thermal processing unit section to the unloading unit; The processing apparatus according to claim 6 or 7, further comprising:

7. The first, second, and third thermal processing unit sections each include a thermal processing unit block configured by vertically stacking a plurality of thermal processing units. The processing apparatus according to claim 8.