JP3338343B2 - Substrate processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus in which a plurality of unit processing units for performing a predetermined processing on a substrate to be processed are stacked and arranged in a height direction.

[0002]

2. Description of the Related Art As is well known, in a manufacturing process of a precision electronic substrate such as a liquid crystal display substrate or a semiconductor substrate, for example, a rotary cleaning device (hereinafter referred to as "spin scrubber") and a rotary coating device (hereinafter referred to as "spin scrubber"). "Spin coater"), unit processing units such as a rotary developing device (hereinafter "spin developer"), an oven (heater), and an exposure machine are arranged, and these unit processing units are transported along the arrangement of the substrate to be processed. A substrate processing apparatus for performing a series of processing by moving in and out of the apparatus is used.

In the first prior art of such a substrate processing apparatus, each unit processing section is arranged in a line on a floor and integrated.

However, in such a substrate processing, since a large number of unit processing units must be provided, the first processing unit is required.
In the prior art, there is a problem that the total length of the device becomes long and the occupied floor area increases.

[0005] In the first prior art, the moving distance of the substrate transfer means also increases as the overall length of the apparatus increases. As a result, the transport time is lengthened, and the throughput is reduced.

In order to solve such a problem, Japanese Patent Laid-Open No.
In JP-132840 (second prior art),
A plurality of unit processing units are divided into two groups, each group is arranged in one row, and these two groups are arranged to face each other. A substrate transport mechanism is provided between the two groups, and the transport mechanism transports the substrate in each of the two groups and between the groups.

In the case of the second prior art, the overall length of the apparatus is reduced, and the processing order of each unit processing unit to each unit processing unit can be freely changed. There's a problem.

That is, even if the length of the apparatus is shortened, the occupied floor area is not so different from that of the first prior art. This is because the overall floor area cannot be reduced because only the arrangement position of each unit processing unit on the floor is changed.

On the other hand, as another prior art for solving the problem of the first prior art, there is a technique (third conventional technique) disclosed in Japanese Patent Application Laid-Open No. 63-5523. In the third related art, all the unit processing units are vertically stacked in the vertical direction, and the substrate to be processed is transported only in the vertical direction.

In the third technique, the effect of reducing the floor area is remarkable, but the height of the apparatus is increased instead. In particular, an apparatus that must perform a large number of processes has a large number of unit processing units, and if they are stacked vertically, the height of the apparatus becomes extremely high.

Further, in the third prior art, as the height of the apparatus increases, the moving distance of the substrate transfer means in the height direction becomes extremely long, and a decrease in throughput is inevitable.

[0012]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the prior art, and provides a substrate processing apparatus capable of improving the throughput while suppressing an increase in the occupied floor area of the entire apparatus. The purpose is to:

[0013]

In order to achieve the above object, a first aspect of the present invention is a substrate processing apparatus in which a plurality of unit processing units for performing a predetermined processing on a substrate to be processed are stacked and arranged in a height direction. An apparatus, provided on a transport path facing the plurality of unit processing units arranged in a stack, and capable of moving at least vertically in the transport path, and the first substrate transport means in the transport path. A second substrate transporting means provided at a height different from that of the first substrate transporting means, and a movable range in the vertical direction of the first substrate transporting means, and a second substrate transporting means in a vertical direction of the second substrate transporting means. A part overlapping with the moving range is included, and the first substrate transporting means and the second substrate transporting means are arranged in the vertical direction.
The transfer of the substrate is performed via a substrate transfer unit provided at the overlapping portion of each of the moving ranges .

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect of the present invention, each of the first and second substrate transporting units has a dedicated transport area except for the substrate transfer unit. Has been granted.

[0015]

In the substrate processing apparatus according to the first aspect, a plurality of unit processing units are stacked in the height direction. For this reason, the minimum occupied floor area required by the device is at least smaller than that of the first and second prior arts.

Therefore, in this device, an increase in the occupied floor area of the entire device can be suppressed.

Further, since the first and second substrate transfer means are provided at different heights, they can be positioned so as to overlap each other in the height direction, thereby increasing the occupied floor area of the entire apparatus. It can be further suppressed.

Further, the first and second substrate transfer means are upper and lower.
In the overlapping part of each moving range in
Since the substrates can be transferred to each other via the transferred substrate transfer unit, the substrates can be transported in cooperation with each other, and the throughput of the apparatus can be improved.

In the substrate processing apparatus according to the second aspect, the first and the second
Since each of the substrate transfer means has a dedicated transfer area, the moving range of each is narrower than at least the first and third prior arts, and the throughput of the apparatus can be further improved.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below. In the first embodiment and its modifications, only the former of horizontal and vertical transport of a substrate to be processed is transported facing a multistage processing row. The second embodiment and its modification are configured to execute both the horizontal conveyance and the vertical conveyance on the conveyance path facing the multi-stage processing line.

[0021]

[1. First Embodiment] <1-1. Overall Configuration of Apparatus> FIG. 1 is a plan layout view of a substrate processing apparatus 1a according to a first embodiment of the present invention. This substrate processing apparatus 1a is configured as an apparatus for forming a pattern such as an electrode on the surface of a substrate to be processed by using a substrate for liquid crystal display as a substrate to be processed.

In FIG. 1 and the following drawings, a horizontal plane parallel to the floor is defined as an XY plane, and a vertical direction is defined as Z.
A three-dimensional rectangular coordinate system XYZ as a direction is defined. When the (+ X) direction and the (−X) direction are not distinguished, they are simply referred to as “X direction” (the same applies to Y and Z).

In FIG. 1, the apparatus 1a has a substantially “U” shape, and a processing system 20 including a multi-stage arrangement of unit processing units, which will be described later, includes first processing units 20 arranged in parallel with each other back to back. And second subsystems A and B. A space 9 exists between these first and second subsystems A and B. The first subsystem A is for performing processing before exposure of the substrate 10 to which the resist has been applied, and the second subsystem B is for performing the processing after exposure of the substrate 10 to which the resist has been applied. , Each extending in the X direction.

At the (-X) side end of the first subsystem A, a substrate loading station 2 is provided. The substrate 10 subjected to the pure water rinsing process is accommodated in the cassette 3 and carried into the substrate carrying-in station 2.
Then, the substrate transfer robot 4a that can translate in the Y direction sequentially takes out the substrates 10 to be processed from the cassette 3, and transfers them one by one to the first substation A (broken line arrow).

The first substation A includes a processing section A1 for performing a series of processing on the substrate 10 to be processed, and a transport section A2 for transporting the substrate to be processed 10 and taking it in and out of each unit processing section. . And this transport part A2 is
A horizontal transport mechanism HA that transports the substrate 10 in the X direction along the processing unit A1 and moves the substrate into and out of each unit processing unit;
And a vertical transport mechanism VA that performs vertical transport in the Z direction of 0.

The horizontal transport mechanism HA includes a processing unit A
1 and extends in the horizontal X direction, and faces the multi-stage processing row. In addition, the vertical transport mechanism VA is incorporated in a part of the multi-stage processing row constituting the processing unit A1. And
The processing unit A1 is adjacent to the space 9, and the horizontal transport mechanism HA is provided on the opposite side of the space 9.

The first sub-station A has a detailed configuration described later, and performs a series of processes before exposure on the substrate 10 to be processed. The details of the processing will also be described later,
When these processes are completed, a resist film is formed on the surface of the substrate 10 to be processed.

The processed substrate 10 which has completed the processing in the first substation A is sent to the buffer 6. The buffer 6 extends in the Y direction and connects the first and second subsystems A and B. An exposure machine (stepper) 5 is adjacent to the buffer 6.

In the buffer 6, the robot 6a transfers the substrates to be processed 10 to the exposing machine 5 one by one. The exposing machine 5 performs exposure transfer of a pattern to a resist film using a predetermined mask. The substrate 10 after the completion of the exposure is returned to the buffer 6 by another robot 6b, and further provided to the additional exposure unit 7. The additional exposure unit 7 includes an edge exposure device and a character printing device for the substrate 10 to be processed, and performs edge exposure on the resist of the substrate 10 and printing of characters. After completing these processes, the substrate 10 to be processed is provided to the second subsystem B.

The second subsystem B has a processing section B1 and a transport section B2, like the first subsystem A. The processing unit B1 is back-to-back with the processing unit A1 of the first subsystem A sandwiching the space 9. The transport section B2 of the second subsystem B has a horizontal transport mechanism HB and a vertical transport mechanism VB, of which the horizontal transport mechanism HB is provided to face the processing section B. Together with the space 9. The vertical transport mechanism unit VB is incorporated in a part of the multi-stage processing line that forms the processing unit B1.

Although the detailed configuration and operation of the second subsystem B will be described later, the substrate 10 to be processed at the time when the processing in the second subsystem B is completed is in a state where the development of the resist is completed. Has become. The substrates 10 to be processed are transferred one by one to the unloading station 8, where the robot 4 b capable of translating in the Y direction stores the substrates 10 in the cassette 3.

The cassette 3 accommodating the processed substrate 10 after the completion of the processing is carried out from the carry-out station 8 to the next step.

<1-2. Configuration of First Subsystem A>
FIG. 2 is a schematic layout diagram of the first subsystem A, and FIG. 3 is a side view of the structure seen from the III-III position in FIG. 2 in the (-X) direction.

The subsystem A has a multistage configuration in which a plurality of unit processing units are arranged in multiple stages. First stage part A
In the processing section A1 of F1, a spin scrubber SS, a spin coater SC, an edge and a back rinse section ER are arranged in the X direction. In addition, as shown by a dashed double arrow, an elevator EL that can move up and down in the Z direction with the second-stage portion AF2
1, EL2 are provided in a part of these arrangements.

On the front side of the processing section A1, that is, on the (-Y) side, a horizontal transport mechanism HA extending in the X direction is provided as a part of the transport section A2. The horizontal transport mechanism HA has a transport floor 41 extending in the X direction.
On top of 1, a guide rail (transport path) 4 extending in the X direction
3 is fixed. On this guide rail 43, 2
Handlers 30a and 30b are on board and Handler 3
Oa and 30b are free to translate in the X direction while being guided by the guide rail 43. These handlers 3
Reference numerals 0a and 30b are for transporting the substrate to be processed 10 between the unit processing units, and the detailed configuration thereof will be described later.

On the other hand, a second-stage portion AF2 is provided on the first-stage portion AF1. The second-stage portion AF2 has a two-layer structure, and the first layer has an X-direction arrangement of hot plates (oven) HP1, HP4-HP5, and cool plates (cooling plates) CP1-CP3. The second layer is a hot plate HP2, HP3, HP6.
have. As shown in FIG. 3, the corresponding first layer and second layer (for example, the cool plate CP1 and the hot plate HP3) are vertically stacked. Windows D1 and D2 are formed in portions above the first-layer elevators EL1 and EL2.
When L2 rises upward, it can be exposed from the windows D1 and D2 to the second-stage portion AF2. The elevators EL1 and EL2 form a vertical transport mechanism VA.

In the second stage portion AF2, the processing section A1
A horizontal transport mechanism HA is attached to the front side of the printer. The horizontal transport mechanism HA has a transport floor 42 extending in the X direction, and a guide rail (transport path) 43 extending in the X direction is fixed on the transport floor 42. On this guide rail 43, two handlers 30c and 30d
, And the handlers 30c and 30d are free to translate in the X direction while being guided by the guide rails 43.

Each of the processing units SS, SC, ER,
HP1-HP6, CP1-CP3 correspond to the “unit processing unit” in the present invention. The column of the unit processing units SS, SC, and ER existing in the first-stage portion AF1 is the first-stage portion A
F1 is the “processing row”, and the row of the unit processing units HP1-HP6, CP1-CP3 existing in the second-stage portion AF2 is the second row.
The "processing rows" of the step portion AF2 constitute a "multi-step processing row" as a whole. Also, the first stage portion A
Since F1 has a one-layer structure with respect to the unit processing unit and the second-stage part AF2 has a two-layer structure, the first subsystem A has a two-stage three-layer structure with respect to the unit processing unit. The horizontal transport mechanism HA is opposed to the multi-stage processing row, and the vertical transport mechanism VA is incorporated in the multi-stage processing row.

Next, reference is made to FIG. First stage part AF1
A filter 42f is attached to the ceiling surface of the second stage portion AF2, that is, below the transfer floor surface 42 of the second-stage portion AF2. Then, the clean air flow F is discharged toward the transfer floor surface 41 of the first-stage portion AF1 via the filter 42f. Further, the filter 4 is also provided from the ceiling surface 44 of the second-stage portion AF2.
Through 4f, the clean air flow F is discharged toward the transfer floor surface 42 of the second-stage portion AF2. Therefore, a local downflow is formed in each of the first-stage portion AF1 and the second-stage portion AF2 by the clean air flow F. Further, the clean air flow F is also emitted downward from the ceiling surface 45 of the spin coater SC or the like via the filter 45f.

The downflow F is the downflow RF given to the entire apparatus, and the downflow F is the handler 30a-3.
While preventing being disturbed by the movement of 0d,
Even if particles are generated at each stage,
It has a function of keeping the particles away from the substrate to be processed and the unit processing unit. Further, the presence of the transfer floor surface 42 prevents particles generated in the second-stage portion AF2 from moving to the first-stage portion AF1. The down flow F may be formed obliquely downward toward the movement path of the handlers 30a to 30d.

<1-3. Configuration of Second Subsystem B>
FIG. 4 is a schematic layout diagram of the second subsystem B, and FIG. 5 is a side view of the configuration seen from the VV position in FIG. 4 in the (-X) direction.

Also in the second subsystem B, a plurality of unit processing units are arranged in two stages and three layers, and the processing unit B1 of the first stage part BF1 includes two spin developers SD.
1 and SD2 in a one-dimensional array in the X direction. In addition, elevators EL3 and EL4 are provided by these spin developers SD.
1 and SD2.

On the front side of the processing section B1, that is, on the (+ Y) side, a horizontal transport mechanism HB extending in the X direction is provided as a part of the transport section B2. The horizontal transport mechanism HB has a transport floor surface 51, and a handler 30e is provided on a guide rail (transport path) 53 fixed thereon. The handler 30e is capable of translating in the X direction, and is for carrying the substrate to be processed in the first-stage portion BF1.

The processing section of the second-stage portion B2 has a two-layer structure, and the first layer is provided with a one-dimensional array of hot plates HP7-HP9 and cool plates CP4. Windows D3 and D4 for receiving the elevators EL3 and EL4 when they are raised are also formed in the first layer.
On the second layer, a hot plate HP10 is provided. The elevators EL3 and EL4 form a vertical transport mechanism VB in the second subsystem B.

Also in the second stage portion BF2, a horizontal transport mechanism HB extending in the X direction is provided on the front side of the processing section B1, that is, on the (+ Y) side. Horizontal transport mechanism H
B has a transport floor surface 52, and a handler 30f is provided on a guide rail (transport path) 53 fixed thereon. This handler 30f is also translatable in the X direction, and carries the substrate to be processed in the second stage portion BF2.

Referring to FIG. Similarly to the first subsystem A shown in FIG. 3, filters 52f, 54f, and 55f are provided on the ceiling surfaces 52, 54, and 55 of the respective stages, and the downflow F of the clean air or the oblique A downward flow is formed.

In this second subsystem B, the processing units SD1, SD2, HP7-HP10, CP in FIG.
Reference numeral 4 corresponds to a “unit processing unit”. First stage part BF1
Are the "processing columns" of the first stage part BF1, and the columns of the unit processing units HP7-HP10 and CP4 which are present in the second stage part BF2 are those of the second stage part BF2. These are "processing sequences", which together constitute a "multi-stage processing sequence". The horizontal transport mechanism HB is opposed to the multi-stage processing row, and the vertical transport mechanism VB is incorporated in the multi-stage processing row.

<1-4. Configuration and Operation of Handler> FIG. 6 is a schematic perspective view of the handler 30a, and the other handlers 30b-30f shown in FIGS. 2 and 4 have the same structure.

The handler 30a has an arm 33. The arm 33 has fingers 34a, 34 at both ends thereof.
b is a bidirectional finger arm. The arm 33 is supported on the base 31 via a link 32. The arm 33 is moved in a horizontal plane by a motor (not shown).
The arm 33 can be moved in the horizontal direction by driving the link 32 as indicated by a broken line. Also, the arm 33 can be moved up and down. For this reason, the handler 30a is a so-called RθZ robot. Further, processing as a clean robot is performed for the purpose of preventing generation of particles. The handler 30a moves thereon while being guided by the guide rail 43 of FIG. A drive and controller (not shown) for the movement are provided in association with each handler. In the handler 30a shown in FIG. 6, fingers 34a and 34b are provided at both ends of a linear arm 33, and the fingers 34a and 34b are arranged at an angle of 180 ° apart from each other. By using a mold member or the like, the fingers 34a and 34b can be arranged at an angular position separated from each other by 90 ° or 60 °.

FIG. 7 shows a replacement operation in which one substrate 10a accommodated in the unit processing section 60 is taken out by using the handler 30a, and another substrate 10b is inserted into the unit processing section 60 instead. FIG. The unit processing unit 60 typically represents one of the unit processing units SS, SC,.

In the state shown in FIG.
b is held by the second finger 34b, and the substrate to be processed 10a is in the unit processing unit 60. In this state, the arm 33 is extended in the (+ Y) direction, and the first finger 34
The substrate 10a to be processed is taken out by a.

In FIG. 7B, the arm 33 is turned so that the second finger 34b faces the unit processing section 60. Then, the arm 7 is extended in the (+ Y) direction, and the processing target substrate 10b held by the second finger 34b is put into the unit processing unit 60 as shown in FIG.

In the state shown in FIG. 7C, the substrate to be processed 10b is held by the handler 30a, so that after such an operation is performed, the handler 30a is translated to the next unit processing unit. For example, the operation as shown in FIG. 7 can be executed for the next unit processing unit. Therefore, in the arrangement of the plurality of unit processing units, the plurality of substrates to be processed can be conveyed one after another to each unit processing unit in a ballistic manner.

A series of transfer operations described below is an operation in the case where attention is paid to one substrate to be processed.
By carrying out the configuration and operation of a-30f in this manner, the transport and processing of a series of substrates to be processed can be performed in a chain.

<1-5. Processing in First Subsystem A> Under the above preparation, details of the processing in the first subsystem A will be described. Table 1 shows a series of processing contents executed in the apparatus 1 of this embodiment. In the first subsystem A, a series of processing described in the column of “A” in Table 1 corresponds to “ This is executed in the unit processing unit added as “apparatus”.

[0056]

[Table 1]

FIG. 8 is a diagram showing the flow of the substrate 10 to be processed in the first subsystem A by arrows.
Hereinafter, FIGS. 2 and 8 and Table 1 will be referred to.

First, the substrate to be processed 10 is received by the handler 30a and is provided to the spin scrubber SS of the first-stage portion AF1. The substrate 10 to be processed after completing the spin scrub process in the spin scrubber SS is transferred to the elevator EL1 by the handler 30a. The elevator EL1 rises to the second-stage portion AF2 while holding the substrate 10 to be processed.

The handler 30c of the second-stage portion AF2 receives the substrate 10 to be processed from the elevator EL1, sequentially transports it to the hot plates HP1 and HP2, and performs a heating process thereon. This heat treatment is performed on the substrate 1 to be processed.
This is a dehydration bake for removing water remaining at zero.
After that, the handler 30c conveys the substrate to be processed 10 to the cool plate CP1, and cools the substrate to be processed 10.

The transfer of the substrate 10 to the next hot plate HP3 and cool plate CP2 is also performed by the handler 30.
c. The heat treatment in the hot plate HP3 is performed by HMDS (hexamethyl disilazane).
, Ie, a process of applying a resist adhesion reinforcing material.

When these processes are completed, the handler 30c
Transfers the substrate to be processed 10 to the elevator EL1, and the elevator EL1 holds the substrate to be processed 10 and the first-stage portion AF
Descends to 1.

The substrate to be processed 10 is received by the handler 30b and transferred to the spin coater SC, the edge and back rinse unit ER to perform the resist coating process and the edge and back rinse process in these unit processing units. After that, the handler 30b transfers the substrate to be processed 10 to the elevator EL2, and the elevator EL2 ascends to the second-stage portion AF2 while holding the substrate to be processed 10.

This time, the handler 30d receives the substrate 10 to be processed from the elevator EL2 and the hot plate HP4-
After being sequentially transferred to the HP 6 and pre-baked, a cooling process is performed on the cool plate CP3. Thereafter, the handler 30d transfers the substrate 10 to be processed to the elevator EL2, and the elevator EL2 descends to the first-stage portion AF1 while holding the substrate 10 to be processed. The substrate to be processed 10 is received by the handler 30b and discharged to the buffer unit 6 (FIG. 1).

<1-6. Processing in Second Subsystem B> FIG. 9 is a diagram showing the flow of the substrate 10 to be processed in the second subsystem B by arrows, and the processing contents in the second subsystem B are “B” in Table 1. Column. Hereinafter, FIGS. 4 and 9 and Table 1 will be referred to.

The processed substrate 10 which has completed the processing in the exposure machine 5 and the additional exposure section 7 in FIG. 1 is received by the handler 30e and transferred to the elevator EL3. The elevator EL3 rises to the second-stage portion BF2, and the handler 30f receives the substrate to be processed 10 and sequentially transfers it to the hot plates HP7 to HP9.

As shown in Table 1, the post-bake in the hot plate HP9 is 50 seconds. If it is desired to perform the bake for a longer time at this stage, the odd-numbered substrates are transferred to the hot plate HP9. The even-numbered substrates to be processed may be applied to the upper hot plate HP10, respectively.

After the completion of the baking, the substrate 10 is cooled on the cool plate CP4 and transferred to the elevator EL4 by the handler 30f. The elevator EL4 descends to the first-stage portion BF1, from which the handler 30e receives the substrate 10 to be processed. And
The handler 30e moves the substrate 10 to be processed by the spin developer S.
Transfer to D1 or SD2. Since it takes 100 seconds to develop the resist on the substrate 10 to be processed, the odd-numbered substrates are supplied to the first spin developer SD1, and the even-numbered substrates are supplied to the second spin developer SD2. By doing so, the tact time of the entire apparatus is unified.

The substrate 10 after the completion of the developing process is processed by the spin developer SD1 or SD1 by the handler 30e.
2 to the unloading station 8 of FIG.

Note that these series of operations are automatically performed by connecting a control circuit and a drive unit of each unit.

<1-7. Substrate processing apparatus 1 of first embodiment
Advantages of a> The substrate processing apparatus 1 having such a configuration and operation has the following advantages.

(A) Since the unit processing units are arranged in multiple stages, the total floor area and height are smaller than when the unit processing units are horizontally or vertically arranged in a straight line.
It has a configuration that is easy to install and operate.

(B) Since the handlers 30a-30f can be easily accessed from the outside, inspection and repair thereof are easy, and maintenance is high.

(C) Further, since the unit processing units are arranged vertically and horizontally, the processing order of each unit processing unit to each unit processing unit can be freely changed.

The first subsystem A in this embodiment
Taking (FIGS. 2 and 8) as an example, each of the handlers 30a-30
The translational movement range (stroke) required for d is: handler 30a: from the loading position of the substrate 10 to the elevator EL1 in the first stage portion AF1, and handler 30b: from the elevator EL1 to the elevator in the first stage portion AF1. Up to EL2, handler 30c: from the hot plate HP1 (HP2) to the cool plate CP3 in the second stage portion AF2, and handler 30d: from the hot plate HP6 (cool plate CP3) to the elevator EL2 in the second stage portion AF2; The strokes do not overlap each other (at the position of the elevator EL1, the handler 30
a and 30b overlap, but there is almost no overlap when viewed from the whole).

Thus, each of the handlers 30a-30d can be translated without substantially interfering with each other, and the movement of each of the handlers 30a-30d can be determined substantially independently of other handlers. Therefore, the substrate to be processed 10
It is easy to change the order of each process for the other than the above example. This is the same in the second subsystem B.

(D) As described above, since the transfer floor surfaces 42 and 52 are extended to the front of the processing row, particles generated in one stage can be prevented from moving to another stage.

(E) Further, since a downflow or a diagonally downward flow is generated for each stage, even if particles are generated by the operation of the transport mechanism, contamination by the particles is prevented.

(F) Further, in this apparatus 1a, a handler is arranged in each stage, and the transfer of the substrate 10 between the stages is controlled by an elevator. And throughput is also improved.

<1-8. Modifications> (1) The first and second subsystems may not be arranged back to back but may be arranged in a straight line.

(2) The unit processing units may be arranged not only in two stages but also in three or more stages.

(3) It is possible to arbitrarily determine whether each of the multi-stage processing rows has one layer, two layers or more, according to the processing content and the individual height of the unit processing unit. If the height is low, such as a hot plate or a cool plate, the effect of reducing the floor area is greater when a multilayer structure is used.

(4) The first stage portion and the second stage portion
It is preferable to determine the distribution of the unit processing units to each of the first step portion and the second step portion such that the lengths of the step portions in the X direction are substantially the same. This is because the size of the entire apparatus becomes the minimum. However, the present invention includes a case where the length of the second step portion in the X direction is shorter than the length of the first step portion, for example.

(5) When focusing on one substrate to be processed,
It is possible to arbitrarily determine which of the first stage portion and the second stage portion is to be processed first. Further, the number and arrangement position of the elevators can be modified. For example, in FIG. 9, the elevator EL4 may be omitted, and all the substrates to be processed may be moved up and down only by the elevator EL3.

(6) The substrate to be processed may be cooled in the elevator by also using the elevator and the cool plate.

(7) What is provided as a unit processing unit can be appropriately changed according to the type of the substrate to be processed and the processing content.

(8) The processing in each unit processing section shown in Table 1 is an example and can be arbitrarily changed. For example,
In the pre-bake, the heating time in the hot plates HP4 to HP6 may be different. Further, even if each substrate to be processed is not sequentially moved to the hot plates HP4 to HP6, but is put into any one of the hot plates that are empty at that time, all the necessary heating is performed by the hot plates. Good.

(9) This embodiment is applicable not only to a processing apparatus for a liquid crystal display substrate, but also to a processing apparatus for a semiconductor substrate or other substrates.

[0088]

[2. Second Embodiment><2-1. Outline of Differences from Apparatus of First Embodiment> FIG.
0 denotes a substrate processing apparatus 1b according to a second embodiment of the present invention.
FIG. The main difference between this substrate processing apparatus 1b and the apparatus 1a of the first embodiment (FIG. 1) is that in the transport sections A2 and B2 of the first embodiment, only the horizontal transport mechanism sections HA and HB are provided with the processing sections A1 and A1. On the other hand, in the second embodiment, transport units A20 and B20 that perform both horizontal transport and vertical transport by one type of mechanism are processing units A10 and B2.
The point is that it is provided to face B10. Accordingly, there is a characteristic in the internal configuration of these transport units A20 and B20. The remaining points are the same as those of the first embodiment, and the same or corresponding components are denoted by the same reference characters, and the description thereof will not be repeated.

<2-2. Configuration of First Subsystem A>
FIG. 11 is a schematic layout diagram of the first subsystem A in the second embodiment, and FIG. 12 is a side view of the structure seen from the XII-XII position in FIG. 11 in the (-X) direction.

As shown in FIG.
Among them, the processing unit A10 is a multi-stage processing sequence in which a plurality of unit processing units are arranged in multiple stages, as in the first embodiment. However, in the first embodiment (FIGS. 1 and 2), the vertical transport mechanism VA (elevators EL1, EL2) and the windows D1,
D2 does not exist in the multi-stage processing line, but instead has an interface unit I on which the substrate 10 to be processed can be temporarily placed.
F1 and IF2 are provided.

Next, reference is made to FIG. The configuration for preventing contamination by particles is almost the same as in the first embodiment. That is, the filter 45f is attached below the ceiling surface of the first-stage portion AF1, that is, below the floor surface of the second-stage portion AF2. Then, through this filter 45f,
The clean air flow F1 from the blower 45 is discharged toward the spin coater SC. The clean air flow F2 is also discharged downward from the ceiling surface 44 of the second-stage portion AF2 via the filter 44f. Therefore, a local downflow is formed by these clean air flows F1 and F2.

The downflows F1 and F2 prevent the downflow RF given to the entire apparatus from being disturbed by the movement of the substrate transport mechanisms 101 to 103, and also prevent the occurrence of particles in each part. Also has a function of keeping the particles away from the substrate to be processed and other unit processing units.

On the other hand, the configuration of the transport section A20 is different from that of the first embodiment. A frame 20 extending in the X direction is provided on the front side of the processing unit A10, that is, on the (-Y) side.
0a is provided. This frame 200a is shown in FIG.
In the transport section A20 of the subsystem A of No. 0, it extends from the loading station 2 to the buffer 6 in the X direction. The installation height is set to the substrate 10 to be processed in the spin coater SC.
, Ie, approximately the middle position between the pass line PS1 and the higher one (ie, PL2 in the illustrated example) of the higher one of the loading / unloading heights PL1 and PL2 in the upper unit processing units CP3 and HP6.

Two parallel guide rails (transport paths) 201 and 202 extending in the X direction are fixed to the frame 200a at intervals in the Z direction. One substrate transport mechanism 101 is attached to the upper guide rail 201, and the substrate transport mechanism 101 is free to translate in the X direction while being guided by the guide rail 201 (in FIG. 11, the substrate transport mechanism 101). The connection between the guide rails 201 and the guide rails 201 is not shown). The lower guide rail 202 has two substrate transport mechanisms 102 and 103.
The substrate transport mechanisms 102 and 103 are free to translate in the X direction while being guided by the guide rails 202. These substrate transport mechanisms 101 to 103
Is for transporting the substrate to be processed 10 between the unit processing units and for putting the substrate 10 into and out of each unit processing unit, and the detailed configuration thereof will be described later.

<2-3. Configuration of Second Subsystem B>
FIG. 13 is a schematic layout diagram of the second subsystem B,
FIG. 14 is a side structural view as viewed in the (-X) direction from the position XIV-XIV in FIG.

Also in the second subsystem B, a plurality of unit processing sections are configured as a multi-layer processing sequence arranged in two stages and three layers, and the vertical processing in the first embodiment (FIGS. 4 and 5) is performed. The transport mechanism VB (elevators EL3, EL4) and the windows D3, D4 do not exist in the multi-stage processing line, but an interface unit IF3 capable of temporarily mounting the substrate to be processed 10 is provided instead. .

Next, reference is made to FIG. Similarly to the first subsystem A, also in the second subsystem B, the clean air flow F3 from the blower 55 is discharged toward the spin devoloper SD1 via the filter 55f. Also, from the ceiling surface 54 of the second step portion BF2,
The clean air flow F4 is discharged downward through the filter 54f, and a local downflow is formed by the clean air flows F3 and F4.

A frame 200b extending in the X direction is provided on the front side of the processing section B1, that is, on the (+ Y) side. This frame 200b corresponds to the subsystem B in FIG.
At the transfer section B20 from the loading station 2 to the buffer 6 in the X direction. The installation height is the height of the substrate 10 to be processed in and out of the spin developer SD1, that is, the pass line PS2, and the upper unit processing unit HP.
9, the height PL3 in and out of each of the HP10.
Higher PL4 (that is, PL4 in the illustrated example)
It is a position almost in between.

Two parallel guide rails 203 and 204 extending in the X direction are fixed to the frame 200b at intervals in the Z direction. Upper guide rail 203
Is provided with a substrate transport mechanism 104, which can be translated in the X direction while being guided by the guide rail 203. A substrate transport mechanism 105 is also attached to the lower guide rail 202, and the substrate transport mechanism 105 is free to translate in the X direction while being guided by the guide rail 204. These substrate transport mechanisms 104 and 105 are provided in the first subsystem B
The substrate transport mechanism 101 transports the substrate 10 between the unit processing units and transfers the substrate 10 into and out of the unit processing units in the same manner as the substrate transport mechanisms 101 to 103 in FIG. It has a structure similar to that of to 103.

<2-4. Configuration and Operation of Substrate Transport Mechanism> FIG. 15 is a perspective view of the substrate transport mechanism 101 of FIG. FIG. 16 is a side view of the substrate transfer mechanism 101 as viewed from the direction of arrow XVI in FIG. 15, and FIG. 17 is a plan view of the substrate transfer mechanism 101 as viewed from the direction of arrow XVII in FIG. FIG. 18 is a front view of the substrate transport mechanism 101 as viewed from the direction of arrow XVIII in FIG.

In the apparatus 1 of this embodiment, five substrate transport mechanisms 101 to 105 are used. However, since their basic configurations are the same, the following description will focus on the substrate transport mechanism 101.

<2-4-1. Overall Configuration> First, FIG. 16 is referred to. Of the guide rails 201 and 202 fixed to the frame 200a, the first guide rail 201 is attached to the upper guide rail 201. The substrate transport mechanism 101 has an X moving mechanism 110 for translating the entire substrate transport mechanism 101 in the horizontal X direction.

A vertical arm mechanism 120a that bends and extends in the vertical X direction is connected to the X moving mechanism 110, and a housing 131 is supported by the vertical arm mechanism 120a. Referring to FIG.
31 is a hollow box having both ends opened in the Y direction,
Two sets of horizontal arm mechanisms 140a and 140b capable of bending and extending in the horizontal Y direction are accommodated therein. At each end, a hand 1 as a substrate holding mechanism is provided.
50a and 150b are connected.

<2-4-2. X moving mechanism 110> FIG.
Return to The X moving mechanism 110 has wheels 111 and 112 arranged so as to sandwich the guide rail 201 from above and below. A drive wheel 113 is connected to a motor 114 supported by a support member 115, and by rotating the drive wheel 113 by the motor 114, the X moving mechanism 110 (therefore, the substrate transport mechanism 101).
Are translated in the X direction while being guided by the guide rail 201.

<2-4-3. Vertical arm mechanism 120a>
A motor 116 is fixed below the support member 115. The vertical arm mechanism 120a includes two arms 121a and 122a having substantially the same length.
The end of the arm 121a is connected to the motor 116. The end 123a of the second arm 122a is connected to the housing 131.

The vertical arm mechanism 120a is a so-called SCARA robot mechanism. Therefore, when the motor 116 rotates, the respective arms 121a and 122a rotate as shown by arrows θ1 and θ2, respectively, and the housing 1
31 translates in the Z direction while maintaining the posture (arrow E1). By switching the rotation direction of the motor 116, the translation direction of the housing 131 in the Z direction is reversed from the (+ Z) direction to the (−Z) direction or from the (−Z) direction to the (+ Z) direction.

As shown in FIG. 17, another vertical arm mechanism 1 having the same structure as the vertical arm mechanism 120a
20b is provided on the opposite side of the housing 131.

The vertical arm mechanisms 120a, 120a,
120b are connected to each other by a connecting member 124 extending in the horizontal X direction. Therefore, the driving force of the motor 116 is also transmitted to the vertical arm mechanism 120b via the connecting member 124. That is, when each arm of the first vertical arm mechanism 120a rotates, each arm of the second vertical arm mechanism 120b also rotates by a corresponding amount via the connecting member 124. Accordingly, the housing 131 is displaced in the Z direction without changing its posture while being supported at both ends.

In the second vertical arm mechanism 120b, a torque spring 117 is provided to balance with the motor 116 in the first vertical arm mechanism 120a.

FIG. 16 also shows the substrate transport mechanism 102, but the configuration of the substrate transport mechanism 102 is almost the same. Although the X moving mechanism and the vertical arm mechanism are vertically symmetrical in the first and second substrate transport mechanisms 101 and 102, the housings 131 and 132 and the internal configuration (described later) of the housings 131 and 132 are mutually reciprocal including the direction. Are identical.

The range in which the housing 131 of the substrate transfer mechanisms 101 to 103 belonging to the first subsystem A can be displaced in the Z direction is from the pass line PS1 in FIG. 12 to the loading / unloading height PL2 of the substrate to be processed in the hot plate HP6. Range. The range in which the housings of the substrate transport mechanisms 104 and 105 belonging to the second subsystem B can be displaced in the Z direction is the path line PS in FIG.
2 to the height PL4 of the substrate to be processed in and out of the hot plate HP10.

<2-4-4. Horizontal arm mechanism 120a>
Please refer to FIG. FIG. 17 is a plan view showing the housing 131 with the ceiling surface removed. Housing 13
One end of each of a pair of horizontal arm mechanisms 140a and 140b is divided into left and right and connected to each other.

One horizontal arm mechanism 140a includes two arms 141a and 142a having substantially the same length.
The first arm 141a is connected to a motor 133a (see FIGS. 15 and 16) at a connection position 143a.
The tip of the second arm 142a is connected to the hand 150a.

The horizontal arm mechanism 140a is also configured as a SCARA robot mechanism, and the motor 133a
Are rotated, the arms 141a, 142a
The hand 150a turns in the α2 direction, and translates in the Y direction while maintaining its posture (arrow E2).

Therefore, when the hand 150a is translated in the (+ Y) direction by driving the motor 133a, the hand 150a is exposed to the outside from the housing 131 and reaches the inside of the unit processing section. When the hand 150 a is translated in the (−Y) direction, the hand 150 a is accommodated in the housing 131.

The structure and operation of the other horizontal arm mechanism 140b are the same. The first hand 150a and the second hand 150b are aligned in the Y direction. This is the horizontal X
This is so that a substrate to be processed can be loaded into and unloaded from the unit processing unit without changing the relative position between the substrate transport mechanism and the unit processing unit in the direction.

By the way, the hands 150a and 150b
Due to the arrangement in the direction, if the heights of the hands 150a and 150b with respect to the housing 131 are the same, they will interfere with each other.

For this reason, as shown in FIG.
The heights of 0a and 150b are different. FIG.
, Both fulcrums (connection points to the housing 131) of the horizontal arm mechanisms 140a and 140b
b in the X direction is determined by the horizontal arm mechanisms 140a, 140
b so that both elbows do not interfere with each other.
a, 142a.

<2-4-5. Hands 150a, 150b
As shown in FIGS. 15 and 17, the hands 150a and 150b in this embodiment are flat plates having two fingers. The substrate to be processed is placed on the hand 150a or 150b and accommodated in the housing 131, and is transported to another unit processing unit in that state.

FIG. 19 is a diagram schematically showing the loading and unloading of a substrate to be processed into and out of the unit processing section by the substrate transport mechanism. 1
As an example, the processing target substrate 10b has been processed in the unit processing unit 300, and the processing target substrate 10b is processed in the unit processing unit 30.
The process of taking a new substrate to be processed 10a into the unit processing unit 300 while taking it out from 0 will be described.

First, the substrate to be processed 10a is held by the first hand 150a and stored in the housing 131 (FIG. 19A). Next, the second hand 150b is extended using the horizontal arm mechanism, and the substrate to be processed 10b is taken out of the unit processing section 300 (FIG. 19B). By moving the horizontal arm mechanism in the reverse direction, the second hand 150b moves the housing 131 together with the substrate 10b.
(FIG. 19 (c)).

On the other hand, the processing target substrate 10a held by the first hand 150a is moved out of the housing 131 by the unit hand 300a.
(FIG. 19 (c)). Then, the substrate to be processed 10a is transferred from the first hand 150a to the unit processing section 300, and the first hand 150a exits from the unit processing section 300 to complete the process of exchanging the substrates to be processed 10a and 10b (FIG. 19D). ).

The above is the principle of the process of exchanging a substrate to be processed using each of the substrate transport mechanisms 101 to 105.

<2-5. Processing in First Subsystem A> Under the above preparation, details of the processing in the first subsystem A will be described.

<2-5-1. Processing Contents and Range of Responsibility of Each Substrate Transport Mechanism> A series of processing contents executed in the apparatus 1b of the second embodiment is described in the apparatus 1a of the first embodiment.
Are the same as the processing contents (Table 1).

As can be seen from Table 1, the tact time T in these series of processes is 50 seconds. For this reason,
Each of the substrate transport mechanisms 101 to 105 takes out a substrate to be processed from one unit processing unit and transports it to another unit processing unit, where the average time required for loading and unloading the substrate to be processed is ΔT, Assuming that the number of unit processing units that can be handled by the substrate transport mechanism is N, the following Expression 1 needs to be established.

[0127]

ΔT × (N + 1) ≦ T Here, (N + 1) means that (N−1) times of transport / in / out is required while moving the N unit processing units. This is because it is necessary to carry out and carry out once each of the N unit processing units before and after the unit processing units.

When the average time ΔT is 10 seconds,
The following Equation 2 is obtained from Equation 1.

[0129]

10 sec × (N + 1) ≦ 50 sec Therefore, in this case, N ≦ 4 (the maximum value is N = 4).
Becomes

Therefore, the series of processing shown in Table 1 is divided into four unit processing units starting from the first processing unit, and the first substrate transfer mechanism 101 performs the processing from the spin scrubber SS to the cool plate CP1 and the hot plate CP1. Second from dehydration bake of HP3 to edge and back rinse part ER
Of the substrate transport mechanism 102. Further, the third substrate transport mechanism 103 is in charge of from the pre-bake of the hot plate HP4 to the cool plate CP3.

The range in charge of such a substrate transfer mechanism is expressed by using a symbol such as “101” in the “charge” column of Table 2.

[0132]

[Table 2]

That is, the substrate transfer mechanisms 101 to 103 in this embodiment are used as a “zone defense type” substrate transfer mechanism having respective assigned ranges.

On the other hand, from the first substrate transport mechanism 101 to the second
The transfer of the substrate to be processed to the substrate transfer mechanism 102 is performed via the interface IF1 (see FIG. 11). That is, the substrate to be processed, which has completed the processing in the cool plate CP1, is transported to the interface IF1 by the first substrate transport mechanism 101, and the interface IF1
1 and transports the substrate to be processed to a second substrate transport mechanism 1.
02 is picked up.

Symbols such as "IF1" described in the "Use IF" column of Table 2 indicate interfaces used for delivery of the substrate to be processed before and after the horizontal ruled line immediately below the symbol.

<2-5-2. Transport and In / Out Order>
FIG. 20 is a diagram showing the flow of the substrate to be processed in the first subsystem A by arrows, and FIG. 20 and Table 2 will be referred to below.

First, the substrate to be processed is the first substrate transport mechanism 1
01 (“a” in FIG. 20) and is provided to the spin scrubber SS of the first-stage portion AF1. The substrate to be processed (which has completed the spin scrubbing process) exchanged and taken out by the spin scrubber SS is received by the substrate transfer mechanism 101 and transferred to the hot plate HP1, where the processing of the substrate to be processed is performed. Done. The transfer and unloading of the substrate to be processed to and from the hot plate HP1 are performed by driving the X-direction moving mechanism 110, the vertical arm mechanisms 120a and 120b, and the horizontal arm mechanisms 140a (or 140b) of the substrate transfer mechanism 101 to translate the hand 150a. This is done by letting

Such an operation is performed along the arrow in FIG. 20, and the substrate to be processed after the completion of the processing in the cool plate CP1 is transported to the interface IF1 by the substrate transport mechanism 101 and placed thereon. (“B” in FIG. 20). When this mounting process is completed, the substrate transport mechanism 1
01 returns to the position of “a”, receives a new substrate to be processed, and repeats the same processing as described above.

On the other hand, the second substrate transport mechanism 102 receives the substrate to be processed on the interface IF1, sequentially transports and removes the substrate to be processed from the hot plate HP3 to the end face rinse ER, and performs edge and back rinsing. The target substrate for which ER has been completed is transferred to another interface I.
Place on F2 ("c" in FIG. 20). When the mounting process is completed, the substrate transport mechanism 102 returns to the position “b”, receives a new substrate to be processed, and repeats the same processing as described above.

The third substrate transport mechanism 103 receives the substrate to be processed on the interface IF2, transports and unloads the substrate to be processed in the order from the hot plate HP4 to the cool plate CP3, and performs processing in the cool plate CP3. The completed substrate is discharged to the buffer 6 (FIG. 10) ("d" in FIG. 20). When the discharging process is completed, the substrate transport mechanism 103 returns to the position “c”, receives a new substrate to be processed, and repeats the same processing as described above.

Note that these series of operations are automatically performed by the controller CT shown in FIG. 10 supplying command signals to the drive units of each unit.

<2-6. Processing in Second Subsystem B> FIG. 21 is a diagram showing the flow of a substrate to be processed in the second subsystem B by arrows, and the processing contents in the second subsystem B are shown in “B” in Table 1. Column. Also, Table 2 shows the assigned range of each substrate transport mechanism 104 and 105 and the interface used in the same format as the first subsystem A.

B Hereinafter, reference will be made to FIG. 21 and Table 2.

The substrate to be processed, which has been processed by the exposure unit 5 and the additional exposure unit 7 in FIG. 10, is received by the substrate transport mechanism 104 as shown by “e” in FIG. Thereafter, the substrate to be processed is transported and unloaded in the order indicated by the arrows in FIG.

As shown in Table 1, the post-bake in the hot plate HP9 is 50 seconds. If it is desired to perform the bake for a longer time at this stage, the odd-numbered substrates are transferred to the hot plate HP9. The even-numbered substrates to be processed may be applied to the upper hot plate HP10, respectively.

After the completion of the baking, the substrate to be processed is placed on the interface IF3, and the next substrate transport mechanism 105 takes it out as shown at “f” in FIG. 21 and gives it to the cool plate CP4. The substrate to be processed after completing the processing in the cool plate CP4 is transferred to the spin developer SD1 or SD2. Since it takes 100 seconds to develop the resist on the substrate to be processed, the odd-numbered substrates are given to the first spin developer SD1, and the even-numbered substrates are given to the second spin developer SD2. Thereby, the tact time of the entire apparatus is unified.

The substrate to be processed which has been subjected to the development processing is transferred to the spin developer SD1 or SD1 by the substrate transport mechanism 105.
2 to the unloading station 8 of FIG.
1 "g").

<2-7. When a part of the board transfer mechanisms is stopped> Among the board transfer mechanisms 101 to 105, for example, when the board transfer mechanism 101 on the guide rail 201 is stopped for failure or inspection and maintenance, the subsystem A still remains. The substrate transfer mechanisms 102 and 103 can be driven so as to cover the range of the substrate transfer mechanism 101. For example, each unit processing unit in FIG. 20 is divided into two groups in the processing order, and the first half is handled by the substrate transport mechanism 102 and the second half is handled by the substrate transport mechanism 103, respectively. The transfer of the substrate to be processed between the substrate transport mechanisms 102 and 103 may be performed using any of the interfaces IF1 and IF2.

As described above, by providing a plurality of substrate transfer mechanisms, even if some of the substrate transfer mechanisms fail, the processing to be performed can be performed by another substrate transfer mechanism. In particular, it is a great advantage that, even when a failed board transfer mechanism remains on the guide rails, another board transfer mechanism can take its place.

That is, while one substrate transfer mechanism is stopped on the transfer path, the transfer path on which the substrate transfer mechanism is mounted is in a "traffic stop" state. However, by providing different transport paths and performing “double track”, a substrate transport mechanism on another transport path can substitute for it.

Since the number of operating substrate transfer mechanisms decreases, the tact time of the entire apparatus increases, but processing of the substrate to be processed can be continued without stopping the operation of the entire apparatus.

When the failed substrate transport mechanism is removed from the transport path, the transport path becomes "passable". Therefore, even if the transport path is a "single line", it is attached to the transport path. The transfer can be restarted by another substrate transfer mechanism. However, in this case, the apparatus must be stopped until the failed substrate transport mechanism is removed from the transport path.

<2-8. Substrate processing apparatus 1 of second embodiment
Advantages of b> The substrate processing apparatus 1b having the above configuration and operation has the following advantages.

(A) Since the unit processing units are arranged in multiple stages, the entire floor area and height are smaller than in the case where the unit processing units are horizontally or vertically arranged in a straight line. And easy operation.

Further, since the unit processing units are arranged vertically and horizontally, the processing order of each unit processing unit to each unit processing unit can be freely changed.

Since the substrate transport mechanisms 101 to 105 can be easily accessed, the inspection and repair thereof are easy, and the maintainability is high.

Furthermore, the substrate transport mechanism 101 and the substrate transport mechanism 103 or the substrate transport mechanism 104 and the substrate transport mechanism 10
5 are provided at different heights, they can be positioned so as to overlap in the height direction, and the floor area occupied by the entire apparatus can be further reduced.

(B) The board transfer mechanisms 101 to 105 cooperate to transfer the board while transferring the board via the interfaces IF1 to IF3. For this reason, the throughput of the entire apparatus also becomes shorter.

Further, since each of the substrate transport mechanisms 101 to 105 can move vertically and horizontally, the number of times of transferring the substrate 10 between the substrate transport mechanisms can be reduced.
This also shortens the throughput of the entire apparatus.

(C) The movement in the X and Z directions in the substrate transfer mechanisms 101 to 105 is performed using an arm mechanism, and there is no need to use a guide, so that dust generation is significantly reduced.

Further, since the unit processing units are arranged vertically and horizontally, there are not many unit processing units below the substrate transport mechanisms 101 to 105. Therefore, even if particles are generated by the movement of the substrate transfer mechanism, many unit processing units are not contaminated.

Further, in this embodiment, since the housing of the substrate transfer mechanism (for example, 131 in FIG. 17) is open in two directions of (+ Y) and (-Y), FIG.
Even if the clean air flow F1 enters the housing, it can pass through the housing as it is. Therefore, the turbulence of the air flow is small, and the effect of preventing dust generation is further enhanced.

(D) A plurality of guide rails are provided for each of the subsystems A and B, and the substrate transport mechanisms on different guide rails can move without interfering with each other. This is advantageous for cooperation of the plurality of substrate transport mechanisms, and further reduces the throughput.

Further, since the plurality of substrate transfer mechanisms are of the "zone defense system", each of which is provided with a coverage area, the respective movement ranges are narrowed, and the throughput of the apparatus is further improved. Becomes possible.

(E) Since a plurality of substrate transport mechanisms are provided, even if some of the substrate transport mechanisms are removed from the transport path for failure or inspection and maintenance, they are assigned to the substrate transport mechanisms. The processing can be performed by another substrate transport mechanism. This has already been described.

<2-9. Another Embodiment> FIG. 22 is a side view showing a substrate processing apparatus 1c according to another embodiment of the present invention. The planar arrangement of the processing section of the apparatus 1c is substantially the same as that of the apparatus 1b of FIG. 10, and the main difference lies in the configuration of the transport path and the substrate transport mechanism.

That is, in this device 1c, X
Two pairs of rails 211 and 212 extending in the horizontal direction are provided adjacent to each other in the horizontal Y direction, and substrate transport mechanisms 411 and 412 are provided on each of them.

In the first substrate transfer mechanism 411, a column 451 is erected in a vertical Z direction on a base 450 movable on the rail pair 211 in the horizontal X direction. Near the top of the column 451, arm mechanisms 452 and 453 corresponding to a SCARA robot mechanism are provided, and the tip is connected to a horizontal beam 454. This horizontal beam 454 is fixed to the housing 455.

For this reason, the housing 455 can be moved up and down as indicated by an arrow K in the figure. This housing 455
Accommodates a horizontal arm mechanism and a hand mechanism similar to those shown in FIGS. 15 to 18, whereby the hot plates HPa and HPb and the lower unit processing unit PP are processed. The substrate can be taken in and out.

The same applies to the second substrate transport mechanism 412, but its column 461 is shorter than the column 451 of the first substrate transport mechanism 411. The substrate transport mechanisms 411 and 412 can pass each other in the movement in the Y direction.

As shown by the broken lines in FIG. 22, in this embodiment, the hot plates HPa and HPb can be put in and taken out from the rear side (+ Y side) of the apparatus 1a, thereby improving the maintainability. I have.

<2-10. Modifications> (1) A combination of a linear motor and a rotating wheel or a magnetic levitation transport mechanism may be used as the moving means in the X direction in the substrate transport mechanism.

(2) The number of arms in the arm mechanism is not limited. Further, unlike the embodiment, a vertical arm mechanism may be provided on the horizontal arm mechanism. However, in this case, since the connecting portion between the vertical arm mechanism and the hand must be lengthened, the embodiment is more advantageous.

(3) In addition, with respect to items common to the first and second embodiments, various modifications described for the first embodiment are also possible for the second embodiment. is there.

[0175]

As described above, according to the first aspect of the present invention, since a plurality of unit processing units are arranged in a stacked manner in the height direction, an increase in the occupied floor area of the entire apparatus is suppressed. be able to.

Further, since the first and second substrate transfer means are provided at different heights, they can be positioned so as to overlap in the height direction, thereby increasing the occupied floor area of the entire apparatus. It can be further suppressed.

Further, the vertical movement ranges of the first and second substrate transfer means have overlapping portions, and the two substrate transfer means have their respective vertical movements.
Since the substrate can be transferred via the substrate transfer portion provided at the portion where the moving range overlaps, the substrate can be transferred in cooperation, and the throughput of the apparatus can be improved.

According to the second aspect of the present invention, since the first and second substrate transfer means each have a dedicated transfer area, the respective moving ranges are narrowed, and the throughput of the apparatus is further improved. Becomes possible.

[Brief description of the drawings]

FIG. 1 is a plan layout view of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic layout diagram of a first subsystem A in the first embodiment.

FIG. 3 is a side structural view as viewed in a (−X) direction from a position III-III in FIG. 2;

FIG. 4 is a schematic layout diagram of a second subsystem B in the first embodiment.

FIG. 5 is a side structural view as viewed in a (−X) direction from a VV position in FIG. 4;

FIG. 6 is a schematic perspective view of a handler according to the first embodiment.

FIG. 7 is a schematic plan view illustrating an operation of replacing a substrate to be processed by the handler according to the first embodiment.

FIG. 8 is a diagram showing the flow of the substrate to be processed in the first subsystem A of the first embodiment by arrows.

FIG. 9 is a diagram showing the flow of the substrate to be processed in the second subsystem B of the first embodiment by arrows.

FIG. 10 is a plan layout view of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 11 shows a first subsystem A in the second embodiment.
FIG.

FIG. 12 is a side view of the structure viewed from a position XII-XII in FIG. 11 in a (-X) direction.

FIG. 13 shows a second subsystem B in the second embodiment.
FIG.

FIG. 14 is a side structural view as viewed in a (−X) direction from a position XIV-XIV in FIG. 13;

FIG. 15 is a schematic perspective view of a substrate transfer mechanism according to a second embodiment.

FIG. 16 is a side view of the substrate transfer mechanism according to the second embodiment.

FIG. 17 is a plan view of a substrate transfer mechanism according to a second embodiment.

FIG. 18 is a front view of the substrate transfer mechanism according to the second embodiment.

FIG. 19 is an explanatory diagram of the operation of the substrate transfer mechanism according to the second embodiment.

FIG. 20 is a diagram showing, by arrows, a flow of a substrate to be processed in a first subsystem A of the second embodiment.

FIG. 21 is a diagram showing, by arrows, the flow of a substrate to be processed in a second subsystem B of the second embodiment.

FIG. 22 is a side view showing another embodiment of the present invention.

[Explanation of symbols]

 1a, 1b, 1c Substrate processing apparatus 2 Loading station 3 Cassette 8 Loading station 9 Space 10 Substrate to be processed 20 Processing system 30a-30f Handler (horizontal transport means) 41, 42, 52, 54 Transport floor surface 43 Guide rail (transport path) ) 101-105 Substrate transfer mechanism 110 X movement mechanism (horizontal movement mechanism) 120a, 120b Vertical arm mechanism 140a, 140b Horizontal arm mechanism 150a, 150b Hand (substrate to be processed holding means) 131 Housing 201, 202 Guide rail (transport path) X First horizontal direction Y Second horizontal direction Z Vertical direction F Downflow at each stage A First subsystem B Second subsystem A1, A10, B1, B10 Processing units A2, A20, B2, B20 Transport Section HA, HB Horizontal transport mechanism VA, VB Vertical transport Mechanism AF1, BF1 first stage portion AF2, BF2 second stage portion EL1-EL4 elevator D1-D4 window HP1-HP10 hot plate CP1-CP4 cool plate SS spin scrubber SC spin coater ER edge and back rinse unit SD1, SD2 spin developer

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Yoshio Matsumura 1 at 480 Takamiya-cho, Hikone City, Shiga Prefecture Dainippon Screen Mfg. Co., Ltd. Hikone District Office (56) References JP-A-1-241840 (JP, A) JP-A-2-126648 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/68 B65G 49/07 H01L 21/027

Claims (2)

(57) [Claims] 1. A substrate processing apparatus in which a plurality of unit processing units for performing a predetermined process on a substrate to be processed are stacked and arranged in a height direction, wherein the plurality of unit processing units are opposed to the plurality of unit processing units stacked and arranged. A first path that is provided in
A substrate transporting means, and a second substrate transporting means provided at a different height from the first substrate transporting means in the transporting path and movable at least vertically. And the moving range of the second substrate transfer means in the vertical direction has an overlapping portion, and the first substrate transfer means and the second substrate transfer means have their respective moving ranges in the vertical direction.
A substrate processing apparatus , wherein the substrate is transferred via a substrate transfer unit provided in the overlapping portion of the enclosure . 2. The substrate processing apparatus according to claim 1, wherein each of the first and second substrate transfer units has a dedicated transfer area except for the substrate transfer unit.