JPH0786371A - Substrate transfer equipment - Google Patents

Abstract

PURPOSE:To enable hands to be efficiently controlled in temperature without deteriorating a substrate transfer equipment in treatment efficiency. CONSTITUTION:Hands 150a and 150b are changed in a space between them by a hand gap drive unit 160 at a position where they back from a unit treatment station so as to bring the undersides of the hands 150a and 150b into contact with cooling plates 171 and 172 respectively to cool down. By this setup, the hands of a substrate transfer equipment are brought into direct contact with cooling plates at a receding position to be cooled down in a short time, that the hands can be cooled down while the substrate transfer equipment is in movement, and consequently the equipment is prevented from deteriorating in substrate treatment efficiency.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus such as a semiconductor manufacturing apparatus or a liquid crystal substrate manufacturing apparatus in which a plurality of substrates such as semiconductor wafers and liquid crystal glass rectangular substrates (hereinafter simply referred to as "substrates") are used. The present invention relates to a substrate transfer device that transfers between unit processing units.

[0002]

2. Description of the Related Art As is well known in the art, in the manufacturing process of precision electronic substrates such as liquid crystal display substrates and semiconductor wafers, for example, a plurality of unit processing units such as a cleaning processing unit, a heat treatment unit, a resist coating unit, etc. are uniformly operated. A substrate transfer apparatus such as a substrate transfer robot is used to transfer a substrate between the processing units in a predetermined transfer order, and to put the substrates in and out of the processing units to perform a series of processes.

As a substrate transfer device for carrying out such a substrate transfer, a substrate is mounted on a hand (substrate mounting means),
The hand is moved by another driving means to move into and out of a predetermined unit processing unit to set the substrate in the unit processing unit, and after the processing is finished, the hand is moved in and out again to move the unit processing unit in question. It is configured to be taken out from and transported to another unit processing unit.

However, some of these unit processing units have different processing temperatures from each other. Therefore, the temperature of the hand itself inserted into the unit processing unit also changes, and the heat of this hand is placed on it. It has heretofore been a problem that a substrate to be placed is adversely affected. In particular, when the resist is applied to the substrate surface in the resist coating section such as a spin coater and then conveyed to the heat treatment section for drying, the hand itself has already been inserted into the heat treatment section many times, and thus the temperature is high. This causes a temperature difference between the resist of the substrate and the other resist in the portion in contact with the hand, which causes unevenness in drying, which is a factor of deteriorating the quality of the substrate.

In order to deal with this problem, the following two methods have been conventionally considered. First, in the conventional first method, two types of hands are prepared, and a first hand dedicated to installing / removing a substrate to / from a unit processing unit having a heating device and another unit processing unit at room temperature are used. A second hand dedicated to the installation and removal of the substrate is selected for use. For example, the first hand is used for loading / unloading the substrate to / from the heat treatment section, and the other hand is used for loading / unloading the substrate to / from the unit treatment section at room temperature so that adverse effects on the substrate are eliminated. ing.

Further, in the second conventional method, only one type of hand is used, but a cooling station dedicated to cooling the hand is installed separately from the plurality of unit processing units, and the hand is moved to the cooling station. The hand is then inserted into the inside, and the hand is cooled to a predetermined temperature by a non-contact type cooling device, and then the substrate is taken out to a target unit processing section.

[0007]

However, in the above-mentioned first conventional method, since two types of hands are selectively used, a drive mechanism for hand switching is separately required and its control is complicated. There is a problem that
In addition, for example, when the substrate after resist coating is transported by the second hand for normal temperature and transported to the heat treatment section for post-baking, the second hand is also heated to a high temperature in the heat treatment section. For exposure to high temperatures, for high temperatures,
The meaning of having two types of hands for normal temperature is lost, and the degree of freedom of use is low.

On the other hand, in the above second prior art, it is necessary to move the hand to the cooling station to cool the substrate and then take the substrate to the target unit processing unit, which requires one step. The extra cooling is required, and the cooling time is longer due to non-contact cooling, which is against the efficiency of substrate processing.

The present invention has been made in order to solve the above-mentioned problems. With a simple structure, the hand is adjusted to a predetermined temperature without hindering the efficiency of substrate processing, and the accuracy of substrate processing is improved. An object is to provide a substrate transfer device that can be improved.

[0010]

In order to achieve the above-mentioned object, the present invention is a substrate transfer apparatus for transferring a substrate between a plurality of unit processing parts, and a substrate mounting means on which the substrate is mounted. Drive means for moving the substrate mounting means between a first position advanced in the direction of the unit processing section and a second position retracted from the unit processing section; and at the second position, And a temperature adjusting means which is in contact with the substrate placing means and adjusts the substrate placing means to a predetermined temperature.

In this specification, "unit processing unit"
Means a unit unit for processing a substrate, such as a cleaning processing unit, a heat treatment unit, or a resist coating unit.

[0012]

According to the present invention, at the position (second position) where the substrate placing means is retracted from the unit processing section, the temperature adjusting means comes into contact with the substrate placing means and adjusts the temperature to a predetermined temperature. Thereby, when the substrate mounting means is moved to another unit processing section, the temperature of the substrate mounting means can be adjusted at the same time.

[0013]

EXAMPLES A. Structure of substrate processing apparatus having substrate transfer device

FIG. 1 is a side view showing an example of a substrate processing apparatus in which an embodiment of the substrate transfer apparatus according to the present invention is incorporated, and FIG. 2 is a plan layout view of FIG. 1 seen from above. . The substrate processing apparatus 1 is an apparatus for performing a series of processing on a substrate.

In FIG. 1 and the following drawings, the horizontal plane parallel to the floor is the XY plane, and the vertical direction is Z.
A three-dimensional rectangular coordinate system X-Y-Z is defined as a direction. Further, when the (+ X) direction and the (−X) direction are not distinguished, they are simply referred to as “X direction” (the same applies to Y and Z).

The apparatus 1 is provided with a processing unit section A1 for performing a series of processing on a substrate, and a substrate transfer apparatus 100 according to the embodiment is provided in a transfer section A2, and X is provided along the processing unit section A1. It is configured to convey the substrate in the direction (see FIG. 2).

The processing unit section A1 is divided into two stages, upper and lower, and arranged in parallel (FIG. 1). The lower section C1 is composed of an ultraviolet irradiation section 30 composed of an ultraviolet irradiation unit UV and two spin scrubbers SS1 and SS2. While the cleaning processing unit 40 is arranged in the X direction, the heating processing unit 5 is provided in the upper stage C2.
0, one adhesion strengthening unit AP1, which constitutes the adhesion strengthening processing unit 70, the cooling processing units 60 and 80, and the other adhesion strengthening unit AP2 are arranged in the X direction. In the heat treatment unit 50, two hot plates HP1,
HP2 is stacked. Further, two cool plates CP1 and CP2 are laminated and arranged, and the upper cool plate CP1 functions as the first cooling processing unit 60, while the lower cool plate CP2 is the second cooling processing unit 8
Functions as 0.

A substrate loading / unloading processing unit 90 for loading and unloading substrates is provided at a side end portion (left-hand side in FIG. 2) of the transportation unit A2, and has a configuration described in detail below. According to 100, the substrate is processed by each processing unit 30, 40, 5
It is sequentially transported to 0, 60, 70, 80 and is subjected to a series of processing.

B. Substrate transfer device configuration

Next, the structure and operation of the substrate transfer apparatus 100 will be described. The substrate transfer apparatus 100 includes two moving mechanisms 101 and 102, hands 150a and 150b on which a substrate is placed, and a hand cooling device.

B-1. Moving mechanism and hand

FIG. 3 is a side view of the structure seen from the I-I position in FIG. 1 in the (-X) direction. As shown in the figure, a frame 200 extending in the X direction is provided on the front surface side of the processing unit portion A1, that is, on the (−Y) side. Two parallel guide rails (conveyance paths) 201 and 202 extending in the X direction are fixed to the frame 200 at intervals in the Z direction. A moving mechanism 101 is attached to the upper guide rail 201, and the moving mechanism 101 can be translated in the X direction while being guided by the guide rail 201 (in FIG. 1, the moving mechanism 101 and the frame 200 are connected to each other. The relationship is not shown). A moving mechanism 102 is attached to the lower guide rail 202, and the moving mechanism 102 can be translated in the X direction while being guided by the guide rail 202. In this substrate transfer apparatus 100, the two moving mechanisms 101, 10
Although the two are provided, the basic configurations thereof are the same, and hence the moving mechanism 101 will be mainly described below.

FIG. 4 is an enlarged side view of the moving mechanism. As shown in the figure, of the guide rails 201 and 202 fixed to the frame 200, the upper guide rail 201
A first moving mechanism 101 is attached to the. The moving mechanism 101 has an X moving mechanism 110 for translating the entire moving mechanism 101 in the horizontal X direction, and a horizontal arm mechanism 140 (see FIG. 5) for moving in the horizontal Y direction.

A vertical arm mechanism 120a that bends and extends in the vertical Z direction is connected to the X moving mechanism 110, and a housing 131 is supported by the vertical arm mechanism 120a. The housing 131 is a hollow box (see FIG. 5) that is open at both ends in the Y direction, and has a set of horizontal arm mechanisms 1 that can bend and extend in the horizontal Y direction inside.
40 are accommodated. Then, hands 150a and 150b are connected to the tip thereof in upper and lower two stages as a substrate mounting means.

Further, the X moving mechanism 110 includes the guide rail 2
01 is arranged so as to sandwich 01 from above and below,
It has 112. The drive wheel 113 is connected to the motor 114 supported by the support member 115. By rotating the drive wheel 113 by the motor 114, the X moving mechanism 110 (and hence the moving mechanism 10) is driven.
(1 whole) is translated in the X direction while being guided by the guide rail 201.

A motor 116 is fixed to the lower part of the support member 115. The vertical arm mechanism 120a is provided with two arms 121a and 122a having substantially the same length, and an end portion of the first arm 121a among them is connected to the motor 116. In addition, the end portion 1 of the second arm 122a
32a is connected to the housing 131.

The vertical arm mechanism 120a is a so-called SCARA robot mechanism. Therefore, when the motor 116 rotates, the arms 121a and 122b rotate as indicated by arrows θ1 and θ2, respectively, and the housing 1
31 translates in the Z direction while maintaining its posture (arrow E1). By switching the rotation direction of the motor 116, the direction of translation of the housing 131 in the Z direction is reversed from the (+ Z) direction to the (-Z) direction or from the (-Z) direction to the (+ Z) direction.

Although not shown, another vertical arm mechanism having the same structure as the vertical arm mechanism 120a is provided on the opposite side of the housing 131 and is vertically connected by a connecting member (not shown) extending in the horizontal X direction. Arm mechanism 12
It is connected to 0a. Therefore, the driving force of the motor 116 is also transmitted to the vertical arm mechanism on the opposite side via the connecting member, and the housing 131 is displaced in the Z direction without changing its posture while being supported at both ends.

Although the moving mechanism 102 is also shown in FIG. 4, the structure of the moving mechanism 102 is substantially the same. The X movement mechanism and the vertical arm mechanism are vertically symmetrical in the first and second movement mechanisms 101 and 102, but the housings 131 and 132 and the internal configuration (described later) are the same in both directions. Is.

FIG. 5 is a partial perspective view of the moving mechanism 101. Further, FIG. 6 is a plan view when FIG. 5 is viewed from the (−Z) direction. As shown in both figures, a pair of horizontal arm mechanisms 140 is provided in the housing 131. The horizontal arm mechanism 140 includes two arms 141 and 142 having substantially the same length, and the first arm 1
41 is connected to the motor 133a at the connecting position 143. Further, the tip of the second arm 142 is connected to the hands 150 a, 150 via the hand interval drive unit 160.
connected to b.

The horizontal arm mechanism 140 is also constructed as a SCARA robot mechanism. When the motor 133a is rotated, the arms 141 and 142 pivot in the directions of arrows α1 and α2, respectively, and the hands 150a and 150b maintain their postures. While translating, it translates in the Y direction (arrow E2).

Therefore, when the hands 150a and 150b are translated in the (+ Y) direction by driving the motor 133a, the hands 150a and 150b are moved to the housing 131.
It is exposed to the outside and reaches the inside of the unit processing unit. Also,
When translated in the (-Y) direction, the hands 150a and 150b are housed in the housing 131.

The hand interval drive unit 160 is composed of a known actuator mechanism, cam mechanism, etc.,
It has a function of adjusting the horizontal distance between the hands 150a and 150b. In this embodiment, two hands 15 with adjustable intervals are provided for one horizontal arm mechanism 140 as described above.
By having 0a and 150b (hereinafter referred to as "one-arm two-hand mechanism"), rational substrate exchange is possible.

This will be described with reference to the schematic view of FIG. In the figure, the substrate 10 is transferred to the substrate processing apparatus 300 such as a hot plate HP using the substrate transfer apparatus 101.
It is a schematic diagram which shows the point which exchanges. Substrate processing apparatus 30
0 is a shelf (substrate holding member) 31 having a two-tier structure for transferring the substrate 10 to and from the substrate transfer device 101.
0a and 310b are provided. Shelves 310a, 310
b is provided with a structure capable of delivering the substrate 10 to and from a predetermined position where the substrate 10 should be installed when processing is performed.
A pair of hands 150a, 1 of the substrate transfer apparatus 101
The interval of 50b is the same as the above-mentioned hand interval drive unit 160.
By operating the pair of shelves 310a, 310b
The distance can be adjusted narrower or wider than the interval.

When the substrate transfer apparatus 101 having the unprocessed substrate 10b mounted on the lower hand 150b stands still in front of the substrate processing apparatus 300 (FIG. 7A), the hands 150a, 1
The horizontal arm mechanism 140 is extended in the (+ Y) direction with the space of 50b narrowed (space d1), and the hand 15
0a and 150b are inserted into the substrate processing apparatus 300. At this time, the heights of the hands 150a and 150b are located between the shelves 310a and 310b, the upper hand 150a is below the processed substrate 10a, and the shelf 310b is below the unprocessed substrate 10b. (Fig. 7 (b)).

Then, the hand interval drive unit 160 is driven so that the space between the hands 150a and 150b is adjusted to the shelf 31.
It is expanded to have a distance d2 larger than the distance between 0a and 310b (FIG. 7C). In the process of expansion, the processed substrate 10a is scooped from below by the upper hand 150a, and the unprocessed substrate 10b is placed on the shelf 310b. That is, the processed substrate 10a moves from the shelf 310a to the upper hand 150a, and the unprocessed substrate 10b moves to the lower hand 150a.
Move from b to shelf 310b.

Next, while the horizontal arm mechanism 140 is contracted in the -Y direction, the hand spacing drive unit 160 sets the spacing between the hands 150a and 150b to a spacing d3 (d1 <d3 <d2) intermediate between the spacing d1 and the spacing d2. ), While retracting (FIG. 7 (d)), the hands 150a, 150b.
Are housed in the housing 131.

By having such a one-arm / two-hand mechanism structure, the exchange operation of the substrates in the unit processing section can be simultaneously performed by one expansion / contraction operation of the horizontal arm mechanism 140, which improves the efficiency of the substrate processing. To contribute.

B-2. Hand cooling device (temperature control means)

Inside the housing 131, the hand 150
a, 150b as a temperature adjusting means, cooling plates 171, 1
72 are horizontally arranged at intervals substantially equal to the interval d3 with the front ((+ Y) direction) of the housing 131 and the horizontal arm mechanism 140 side ((+ X) direction) as free ends (FIG. 5). FIG. 8 is a front view when FIG. 5 is viewed from the (−Y) direction. As shown in the figure, when the horizontal arm mechanism 140 is retracted and the hands 150a and 150b are housed in the honing 131, the hand 150a is located close to the upper surface of the cooling plate 171, and the hand 150b is located close to the upper surface of the cooling plate 172. Is coming.

FIG. 10 is a schematic view showing the structure of the hand cooling device 170 including the cooling plate 171. In the cooling plate 171, a flow path 171a is formed, and the flow path 17 is formed.
A cooling gas supply device 173 is connected to the inflow port 171b of 1a to blow a gas having a predetermined temperature. The cooling gas cools the cooling plate 171 while passing through the flow passage 171a, and is discharged to the outside from the outlet 171c.

A temperature detector 174 is attached to the cooling plate 171, and a temperature control device 175 controls the gas supply operation of the cooling gas supply device 173 on the basis of an output signal from the temperature detector 174, so that the cooling plate 171 is operated. It is configured to set the desired temperature.

Although it is possible to use a cooling liquid such as water instead of the cooling gas, if liquid should leak from the flow passage 171a, the inlet 171b, the outlet 171c, etc., the substrate placed below will be used. It may fall on the surface and significantly deteriorate its quality. Therefore, it is desirable to use the gas as the cooling solvent as described above, and it is particularly desirable to use the inert gas. Such temperature control is similarly performed on the cooling plate 172, and the temperatures of these cooling plates 171 and 172 are controlled to be substantially room temperature.

B-3. Cooling operation

As described above, the hand 150 housed in the housing 131 due to the contraction of the horizontal arm mechanism 140.
The distances a and 150b have already been adjusted to the distance d3 by the hand distance drive unit 160, and the lower surface of each of them has the cooling plate 17
It is in a state of being close to the upper surfaces of Nos. 1 and 172 and is not in contact (Fig. 8). This is to prevent generation of particles due to friction between the hands 150a and 150b and the cooling plates 171 and 172.

Thereafter, while the substrate 10 is moved to the next unit processing section for replacement, the spaces between the hands 150a and 150b are widened or narrowed, respectively, to cool plates 171 and 172, respectively.
The substrate 10 is cooled to room temperature by contact with
go to hold a. FIG. 9 shows the hand 150 at this time.
It is a figure which shows the positional relationship of a, 150b and the cooling plates 171, 172, and when the board | substrate 10a is mounted on the hand 150a of the upper side, the space | interval of the hand 150a, 150b is expanded by the hand interval drive unit 160. The hand 1 on which no substrate is placed by expanding the distance to the distance d2.
The lower surface of 50b is brought into contact with the upper surface of the cooling plate 172, and the temperature of the hand 150b is adjusted to prepare for holding the next substrate (FIG. 9A). At this time, the hand 150a
Is in a state of being separated from the cooling plate 171, but there is no problem because it has already been cooled to room temperature before going to pick up the mounted substrate 10a.

When the substrate 10b is placed on the lower hand 150b, the hand spacing drive unit 160 narrows the spacing between the hands 150a and 150b to the spacing d1 so that the hand 150a on which no substrate is placed.
The lower surface of the hand is brought into contact with the upper surface of the cooling plate 171, and the hand 1
The temperature of 50a is adjusted to prepare for holding the next substrate (FIG. 9B).

Since these operations are performed inside the housing 131, which is the storage position of the hands 150a and 150b, while moving to the next unit processing section, the hand 15
It is not necessary to provide a special cooling station for cooling 0a and 150b separately from the unit processing section, and a process of moving to the cooling station is not necessary. In addition, since the cooling plate is brought into direct contact to cool the hand effectively,
The hand can be cooled within a short moving time, improving the substrate processing efficiency as a whole.

Further, in the present embodiment, in order to efficiently exchange the substrates, the opening / closing operation of the hand interval by the hand interval drive unit 160 in the one-arm two-hand mechanism is utilized, and no special drive mechanism is required. It is rational because it can move to and from the cooling plate. Further, even in the case of one hand, a robot mechanism for moving the hand up and down may be used to perform the contact / separation operation with the cooling plate.

B-4. Modified embodiment of hand cooling device

FIG. 11 shows a second embodiment of the hand cooling device, in which the cooling members installed in the housing 131 and contacting the hand are vertically integrated. That is, the finger width of the lower hand 150c is configured to be narrower than that of the upper hand 150a, and the upper and lower hands 150c are provided by the cooling blocks 176 and 177 arranged on both sides thereof.
A and 150b are cooled. The cooling blocks 176 and 177 are also configured to be cooled to a predetermined temperature by circulating the cooling gas by the cooling gas supply device 173 through the flow passages formed inside.
Since the heat capacity can be made larger than those of Nos. 1 and 172, stable cooling can be performed. However, when the hand 150c is stored in the housing 131,
Since the horizontal portion extending for connection with the hand interval drive unit 160 engages with the cooling block 176, a mechanism for retracting the cooling block 176 downward is required.

FIG. 12 shows a third embodiment of the hand cooling device. In this embodiment, the hand 150
d has a U-shaped cross section with an open lower surface, and the shape of each of the two fingers is a substantially isosceles triangle, and has a tapered shape that becomes thinner toward the front.

On the other hand, the cooling plates 178 are the cooling plates 171, 1
It is an air-cooled type similar to 72, but its shape is formed to be substantially similar to the above-mentioned hand 150d, and is fitted to the back side of the U-shaped portion of the hand 150d. However, the side surface 178 of the cooling plate 178 is in contact with the hand 150d.
Cooling plate 1 so that only the outer peripheral part of a does not contact the upper surface.
A height of 78 is set. This is to prevent particles from being generated due to friction due to contact between the upper surface of the cooling plate 178 and the back surface of the hand 150d when the hand moves.

The cooling plate 178 is held in the housing 131 by a holding member (not shown) so as to be slidable within a predetermined range in the Y direction, and the compression spring 178 is also provided.
It is biased in the (+ Y) direction by b and 178c.

The horizontal arm mechanism 140 operates to operate the hand 1
When the 50d retracts and is housed in the housing 131, the fingers 178d and 178e of the cooling plate 178 come into contact with the hand 1.
The outer periphery of the side surface 178a of the cooling plate 178 comes into contact with the inner peripheral side surface of the hand 150d in such a manner that it is inserted into the finger portions 150e and 150f of the 50d, and as a unit as it is without sliding on the contact surface. It resists the bias of the compression spring 178 and stops at a position slightly retracted in the (-Y) direction.
Therefore, friction does not occur between the cooling plate 178 and the inner peripheral side surface of the hand 150d, and particles are not generated.

According to the third embodiment as described above, even if the hand interval drive unit 160 is not provided unlike the above-described embodiment of the one-arm two-hand mechanism, there is no risk of sliding with the cooling member, Moreover, the cooling member and the hand can be easily brought into and out of contact with each other only by the contracting / expanding operation of the horizontal arm mechanism 140 without using another extra drive mechanism.

In the embodiment of FIG. 12, one arm and one hand are used, but of course the hand interval drive unit 1
It is also possible to add another hand similar to the hand 150d through 60 to make two hands. In this case, two cooling plates 178 may be prepared and their intervals may be the same as the first interval or the second interval of the hand.
The hand interval control by the hand interval drive unit 160 may be only two-position control.

In this embodiment, a plurality of pins 150g are provided on the upper surface of the hand 150d to hold the substrate at a predetermined distance from the body of the hand 150d, and the temperature of the body of the hand 150d is changed as much as possible. The influence of is not given to the substrate. Also, the hand 150d
A plurality of holes 150h are provided in the hand 150
The mass of d is reduced to reduce the heat capacity.
This allows the temperature of the hand 150d to be adjusted quickly.

In the above-mentioned embodiment, the temperature adjusting means provided in the housing, that is, at the position where the horizontal arm mechanism 140 is retracted is only the cooling device, but it may be a heating device in some cases. In this case, the cooling plate (cooling member) may also be used to allow the high temperature gas to flow into the internal flow path.

The housing 131 is provided to prevent particles from adhering to the surface of the substrate when the flow of clean air downflow is disturbed and the particles are rewound during the transportation of the substrate. Is not an essential requirement of.

[0061]

As described above, according to the present invention, at the position where the substrate placing means is retracted from the unit processing section, the substrate placing means is brought into contact with the temperature adjusting means to adjust the substrate placing means to a predetermined temperature. Therefore, the temperature can be adjusted quickly. Moreover, since the temperature adjustment is performed at the retracted position from the unit processing unit, the temperature of the substrate mounting unit can be adjusted at the same time when the substrate mounting unit is moved to another unit processing unit, so that the temperature is adjusted. No special station or process is required. As a result, the heat of the hand does not adversely affect the substrate while maintaining the substrate processing efficiency in the substrate processing apparatus, and high-quality substrate manufacturing becomes possible.

[Brief description of drawings]

FIG. 1 is a side view showing an example of a substrate processing apparatus in which a substrate transfer apparatus according to the present invention is incorporated.

FIG. 2 is a plan layout view of FIG. 1 seen from above.

FIG. 3 is a side view of the structure seen from the position I-I in FIG. 1 in the (−X) direction.

FIG. 4 is an enlarged side view of the moving mechanism.

FIG. 5 is a partial perspective view of a moving mechanism.

FIG. 6 is a plan view of FIG. 5 seen from above.

FIG. 7 is a schematic view showing a substrate exchange operation in the unit processing unit.

FIG. 8 is a front view of FIG. 5 when viewed from the (−Y) direction.

FIG. 9 is a diagram showing a positional relationship between a hand and a cooling plate.

FIG. 10 is a block diagram showing an overall configuration of a hand cooling device.

FIG. 11 is a diagram showing a second embodiment of the hand cooling device.

FIG. 12 is a diagram showing a third embodiment of the hand cooling device.

[Explanation of symbols]

101, 102 moving mechanism 140 horizontal arm mechanism 150a, 150b, 150c, 150d hand (substrate mounting means) 160 hand interval drive unit 171, 172, 178 cooling plate 176, 177 cooling block

Claims (1)

[Claims] 1. A substrate transfer device for transferring a substrate between a plurality of unit processing parts, wherein the substrate mounting means mounts the substrate, and a first position in which the substrate is advanced toward the unit processing part. A driving means for moving the substrate placing means between a second position retracted from the unit processing section and the substrate placing means at the second position to bring the substrate placing means into a predetermined position. A substrate transfer apparatus comprising: a temperature adjusting unit that adjusts the temperature.