JP2008124267A - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP2008124267A
JP2008124267A JP2006306896A JP2006306896A JP2008124267A JP 2008124267 A JP2008124267 A JP 2008124267A JP 2006306896 A JP2006306896 A JP 2006306896A JP 2006306896 A JP2006306896 A JP 2006306896A JP 2008124267 A JP2008124267 A JP 2008124267A
Authority
JP
Japan
Prior art keywords
light emitting
electrode
glass
emitting element
led element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006306896A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008124267A5 (enExample
Inventor
Seiji Yamaguchi
誠治 山口
Yoshinobu Suehiro
好伸 末広
Jitsuki Moriyama
実希 守山
Shigeo Takatani
繁雄 高谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2006306896A priority Critical patent/JP2008124267A/ja
Publication of JP2008124267A publication Critical patent/JP2008124267A/ja
Publication of JP2008124267A5 publication Critical patent/JP2008124267A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2006306896A 2006-11-13 2006-11-13 発光装置 Pending JP2008124267A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006306896A JP2008124267A (ja) 2006-11-13 2006-11-13 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006306896A JP2008124267A (ja) 2006-11-13 2006-11-13 発光装置

Publications (2)

Publication Number Publication Date
JP2008124267A true JP2008124267A (ja) 2008-05-29
JP2008124267A5 JP2008124267A5 (enExample) 2009-01-29

Family

ID=39508696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006306896A Pending JP2008124267A (ja) 2006-11-13 2006-11-13 発光装置

Country Status (1)

Country Link
JP (1) JP2008124267A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027792A (ja) * 2008-07-17 2010-02-04 Toyoda Gosei Co Ltd 発光装置の製造方法
JP2011181597A (ja) * 2010-02-26 2011-09-15 Toyoda Gosei Co Ltd 半導体発光素子
JP2014064021A (ja) * 2008-05-30 2014-04-10 Sharp Corp 発光装置、面光源および液晶表示装置
WO2016063501A1 (ja) * 2014-10-22 2016-04-28 パナソニックＩｐマネジメント株式会社 半導体デバイス及び紫外線発光素子
WO2017169289A1 (ja) * 2016-03-31 2017-10-05 セントラル硝子株式会社 光学デバイスの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014064021A (ja) * 2008-05-30 2014-04-10 Sharp Corp 発光装置、面光源および液晶表示装置
US9634203B2 (en) 2008-05-30 2017-04-25 Sharp Kabushiki Kaisha Light emitting device, surface light source, liquid crystal display device, and method for manufacturing light emitting device
JP2010027792A (ja) * 2008-07-17 2010-02-04 Toyoda Gosei Co Ltd 発光装置の製造方法
JP2011181597A (ja) * 2010-02-26 2011-09-15 Toyoda Gosei Co Ltd 半導体発光素子
WO2016063501A1 (ja) * 2014-10-22 2016-04-28 パナソニックＩｐマネジメント株式会社 半導体デバイス及び紫外線発光素子
JPWO2016063501A1 (ja) * 2014-10-22 2017-07-06 パナソニックＩｐマネジメント株式会社 半導体デバイス及び紫外線発光素子
WO2017169289A1 (ja) * 2016-03-31 2017-10-05 セントラル硝子株式会社 光学デバイスの製造方法

Similar Documents

Publication Publication Date Title
JP4961887B2 (ja) 固体素子デバイス
JP5251038B2 (ja) 発光装置
KR100693969B1 (ko) 고체 소자 디바이스 및 그 제조 방법
US6614058B2 (en) Light emitting semiconductor device with a surface-mounted and flip-chip package structure
JP4142080B2 (ja) 発光素子デバイス
JP5426124B2 (ja) 半導体発光装置の製造方法及び半導体発光装置
JP6056150B2 (ja) 半導体発光素子
JP2006066868A (ja) 固体素子および固体素子デバイス
JP2008041844A (ja) 光学装置及びその製造方法
JP4637160B2 (ja) 固体素子デバイスの製造方法
JP4492378B2 (ja) 発光装置およびその製造方法
JP5407116B2 (ja) 発光装置
JP2007012993A (ja) チップ型半導体発光素子
JP4008943B2 (ja) 固体素子デバイスの製造方法
JP4923711B2 (ja) 発光装置
JP2006086138A (ja) 光デバイス
JP5141608B2 (ja) 固体素子デバイスの製造方法
JPH11121797A (ja) チップ型半導体発光装置
JP4485310B2 (ja) 半導体発光装置
KR101114126B1 (ko) 발광 장치 및 그 제조방법
JP2010238866A (ja) 発光装置の製造方法
JP2003031852A (ja) 半導体発光素子、およびその製造方法
JP2006080316A (ja) 固体素子デバイス
JP5457325B6 (ja) 固体素子デバイス
KR20120019116A (ko) 발광 소자

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081210

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090128

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110713

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111129

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120111

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121120

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130118

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20131022