JP2008109059A5 - - Google Patents

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Publication number
JP2008109059A5
JP2008109059A5 JP2006292971A JP2006292971A JP2008109059A5 JP 2008109059 A5 JP2008109059 A5 JP 2008109059A5 JP 2006292971 A JP2006292971 A JP 2006292971A JP 2006292971 A JP2006292971 A JP 2006292971A JP 2008109059 A5 JP2008109059 A5 JP 2008109059A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006292971A
Other versions
JP5004549B2 (ja
JP2008109059A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2006292971A external-priority patent/JP5004549B2/ja
Priority to JP2006292971A priority Critical patent/JP5004549B2/ja
Priority to KR1020070107631A priority patent/KR20080038028A/ko
Priority to US11/924,013 priority patent/US8046911B2/en
Priority to TW096140205A priority patent/TW200820360A/zh
Priority to EP07021133A priority patent/EP1916712A2/en
Publication of JP2008109059A publication Critical patent/JP2008109059A/ja
Publication of JP2008109059A5 publication Critical patent/JP2008109059A5/ja
Publication of JP5004549B2 publication Critical patent/JP5004549B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006292971A 2006-10-27 2006-10-27 電子部品の基板への搭載方法及びはんだ面の形成方法 Active JP5004549B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006292971A JP5004549B2 (ja) 2006-10-27 2006-10-27 電子部品の基板への搭載方法及びはんだ面の形成方法
KR1020070107631A KR20080038028A (ko) 2006-10-27 2007-10-25 기판에 전자 부품을 탑재하는 방법 및 솔더면을 형성하는방법
US11/924,013 US8046911B2 (en) 2006-10-27 2007-10-25 Method for mounting electronic component on substrate and method for forming solder surface
TW096140205A TW200820360A (en) 2006-10-27 2007-10-26 Method for mounting electronic component on substrate and method for forming solder surface
EP07021133A EP1916712A2 (en) 2006-10-27 2007-10-29 Method for mounting electronic component on substrate and method for forming solder surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006292971A JP5004549B2 (ja) 2006-10-27 2006-10-27 電子部品の基板への搭載方法及びはんだ面の形成方法

Publications (3)

Publication Number Publication Date
JP2008109059A JP2008109059A (ja) 2008-05-08
JP2008109059A5 true JP2008109059A5 (ja) 2009-09-17
JP5004549B2 JP5004549B2 (ja) 2012-08-22

Family

ID=39103781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006292971A Active JP5004549B2 (ja) 2006-10-27 2006-10-27 電子部品の基板への搭載方法及びはんだ面の形成方法

Country Status (5)

Country Link
US (1) US8046911B2 (ja)
EP (1) EP1916712A2 (ja)
JP (1) JP5004549B2 (ja)
KR (1) KR20080038028A (ja)
TW (1) TW200820360A (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5307471B2 (ja) 2008-08-11 2013-10-02 ルネサスエレクトロニクス株式会社 基板の製造方法、基板、基板を備えた装置、判別方法、半導体装置の製造方法
US20130044448A1 (en) * 2011-08-18 2013-02-21 Biotronik Se & Co. Kg Method for Mounting a Component to an Electric Circuit Board, Electric Circuit Board and Electric Circuit Board Arrangement
US8531040B1 (en) * 2012-03-14 2013-09-10 Honeywell International Inc. Controlled area solder bonding for dies
EP3675190B1 (en) 2018-12-25 2023-05-03 Nichia Corporation Method of manufacturing light source device and light source device
JP7366337B2 (ja) * 2018-12-25 2023-10-23 日亜化学工業株式会社 光源装置の製造方法および光源装置
JP6644921B1 (ja) * 2019-01-15 2020-02-12 キヤノンマシナリー株式会社 半田平坦化装置、ダイボンダ、半田平坦化方法、及びボンディング方法
DE102019103140A1 (de) 2019-02-08 2020-08-13 Jenoptik Optical Systems Gmbh Verfahren zum Löten eines oder mehrerer Bauteile
KR20210007217A (ko) * 2019-07-10 2021-01-20 삼성전자주식회사 인터포저를 포함하는 전자 장치
JP7258437B2 (ja) * 2019-07-10 2023-04-17 株式会社ディスコ ウェーハの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224334A (ja) * 1987-03-13 1988-09-19 Nec Corp 半導体装置
JPH04370958A (ja) * 1991-06-20 1992-12-24 Hitachi Ltd 半導体基板、これを用いた半導体集積回路装置および半導体基板の製造方法
JPH05267359A (ja) * 1992-03-18 1993-10-15 Toshiba Corp 半導体取付装置
DE19524739A1 (de) * 1994-11-17 1996-05-23 Fraunhofer Ges Forschung Kernmetall-Lothöcker für die Flip-Chip-Technik
JPH11330108A (ja) * 1998-05-15 1999-11-30 Nippon Mining & Metals Co Ltd 電子部品の接合方法及び接合材
JP2000106373A (ja) * 1998-09-28 2000-04-11 Hitachi Ltd 半導体装置の製造方法およびダイボンディング装置
US6281041B1 (en) * 1999-11-30 2001-08-28 Aptos Corporation Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball
TWI248384B (en) * 2000-06-12 2006-02-01 Hitachi Ltd Electronic device
US6902098B2 (en) * 2001-04-23 2005-06-07 Shipley Company, L.L.C. Solder pads and method of making a solder pad
JP4339723B2 (ja) * 2004-03-04 2009-10-07 株式会社ルネサステクノロジ 半導体装置およびその製造方法、電子装置ならびに実装構造体
JP4453612B2 (ja) 2004-06-24 2010-04-21 住友金属鉱山株式会社 無鉛はんだ合金

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