JP2008109059A5 - - Google Patents
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- Publication number
- JP2008109059A5 JP2008109059A5 JP2006292971A JP2006292971A JP2008109059A5 JP 2008109059 A5 JP2008109059 A5 JP 2008109059A5 JP 2006292971 A JP2006292971 A JP 2006292971A JP 2006292971 A JP2006292971 A JP 2006292971A JP 2008109059 A5 JP2008109059 A5 JP 2008109059A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006292971A JP5004549B2 (ja) | 2006-10-27 | 2006-10-27 | 電子部品の基板への搭載方法及びはんだ面の形成方法 |
KR1020070107631A KR20080038028A (ko) | 2006-10-27 | 2007-10-25 | 기판에 전자 부품을 탑재하는 방법 및 솔더면을 형성하는방법 |
US11/924,013 US8046911B2 (en) | 2006-10-27 | 2007-10-25 | Method for mounting electronic component on substrate and method for forming solder surface |
TW096140205A TW200820360A (en) | 2006-10-27 | 2007-10-26 | Method for mounting electronic component on substrate and method for forming solder surface |
EP07021133A EP1916712A2 (en) | 2006-10-27 | 2007-10-29 | Method for mounting electronic component on substrate and method for forming solder surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006292971A JP5004549B2 (ja) | 2006-10-27 | 2006-10-27 | 電子部品の基板への搭載方法及びはんだ面の形成方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008109059A JP2008109059A (ja) | 2008-05-08 |
JP2008109059A5 true JP2008109059A5 (ja) | 2009-09-17 |
JP5004549B2 JP5004549B2 (ja) | 2012-08-22 |
Family
ID=39103781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006292971A Active JP5004549B2 (ja) | 2006-10-27 | 2006-10-27 | 電子部品の基板への搭載方法及びはんだ面の形成方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8046911B2 (ja) |
EP (1) | EP1916712A2 (ja) |
JP (1) | JP5004549B2 (ja) |
KR (1) | KR20080038028A (ja) |
TW (1) | TW200820360A (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5307471B2 (ja) | 2008-08-11 | 2013-10-02 | ルネサスエレクトロニクス株式会社 | 基板の製造方法、基板、基板を備えた装置、判別方法、半導体装置の製造方法 |
US20130044448A1 (en) * | 2011-08-18 | 2013-02-21 | Biotronik Se & Co. Kg | Method for Mounting a Component to an Electric Circuit Board, Electric Circuit Board and Electric Circuit Board Arrangement |
US8531040B1 (en) * | 2012-03-14 | 2013-09-10 | Honeywell International Inc. | Controlled area solder bonding for dies |
EP3675190B1 (en) * | 2018-12-25 | 2023-05-03 | Nichia Corporation | Method of manufacturing light source device and light source device |
JP7366337B2 (ja) * | 2018-12-25 | 2023-10-23 | 日亜化学工業株式会社 | 光源装置の製造方法および光源装置 |
JP6644921B1 (ja) * | 2019-01-15 | 2020-02-12 | キヤノンマシナリー株式会社 | 半田平坦化装置、ダイボンダ、半田平坦化方法、及びボンディング方法 |
DE102019103140A1 (de) * | 2019-02-08 | 2020-08-13 | Jenoptik Optical Systems Gmbh | Verfahren zum Löten eines oder mehrerer Bauteile |
JP7258437B2 (ja) * | 2019-07-10 | 2023-04-17 | 株式会社ディスコ | ウェーハの製造方法 |
KR20210007217A (ko) * | 2019-07-10 | 2021-01-20 | 삼성전자주식회사 | 인터포저를 포함하는 전자 장치 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63224334A (ja) * | 1987-03-13 | 1988-09-19 | Nec Corp | 半導体装置 |
JPH04370958A (ja) * | 1991-06-20 | 1992-12-24 | Hitachi Ltd | 半導体基板、これを用いた半導体集積回路装置および半導体基板の製造方法 |
JPH05267359A (ja) * | 1992-03-18 | 1993-10-15 | Toshiba Corp | 半導体取付装置 |
DE19524739A1 (de) * | 1994-11-17 | 1996-05-23 | Fraunhofer Ges Forschung | Kernmetall-Lothöcker für die Flip-Chip-Technik |
JPH11330108A (ja) * | 1998-05-15 | 1999-11-30 | Nippon Mining & Metals Co Ltd | 電子部品の接合方法及び接合材 |
JP2000106373A (ja) * | 1998-09-28 | 2000-04-11 | Hitachi Ltd | 半導体装置の製造方法およびダイボンディング装置 |
US6281041B1 (en) * | 1999-11-30 | 2001-08-28 | Aptos Corporation | Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball |
JP3414388B2 (ja) * | 2000-06-12 | 2003-06-09 | 株式会社日立製作所 | 電子機器 |
US6902098B2 (en) * | 2001-04-23 | 2005-06-07 | Shipley Company, L.L.C. | Solder pads and method of making a solder pad |
JP4339723B2 (ja) * | 2004-03-04 | 2009-10-07 | 株式会社ルネサステクノロジ | 半導体装置およびその製造方法、電子装置ならびに実装構造体 |
JP4453612B2 (ja) | 2004-06-24 | 2010-04-21 | 住友金属鉱山株式会社 | 無鉛はんだ合金 |
-
2006
- 2006-10-27 JP JP2006292971A patent/JP5004549B2/ja active Active
-
2007
- 2007-10-25 KR KR1020070107631A patent/KR20080038028A/ko not_active Application Discontinuation
- 2007-10-25 US US11/924,013 patent/US8046911B2/en not_active Expired - Fee Related
- 2007-10-26 TW TW096140205A patent/TW200820360A/zh unknown
- 2007-10-29 EP EP07021133A patent/EP1916712A2/en not_active Withdrawn
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