JP2008103711A - 半導体発光素子 - Google Patents

半導体発光素子 Download PDF

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Publication number
JP2008103711A
JP2008103711A JP2007259068A JP2007259068A JP2008103711A JP 2008103711 A JP2008103711 A JP 2008103711A JP 2007259068 A JP2007259068 A JP 2007259068A JP 2007259068 A JP2007259068 A JP 2007259068A JP 2008103711 A JP2008103711 A JP 2008103711A
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Japan
Prior art keywords
layer
quantum well
type contact
light emitting
semiconductor light
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JP2007259068A
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Japanese (ja)
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JP2008103711A5 (OSRAM
Inventor
Han-Youl Ryu
漢 烈 柳
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2008103711A publication Critical patent/JP2008103711A/ja
Publication of JP2008103711A5 publication Critical patent/JP2008103711A5/ja
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
JP2007259068A 2006-10-20 2007-10-02 半導体発光素子 Pending JP2008103711A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060102465A KR20080035865A (ko) 2006-10-20 2006-10-20 반도체 발광 소자

Publications (2)

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JP2008103711A true JP2008103711A (ja) 2008-05-01
JP2008103711A5 JP2008103711A5 (OSRAM) 2011-01-13

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ID=39317060

Family Applications (1)

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JP2007259068A Pending JP2008103711A (ja) 2006-10-20 2007-10-02 半導体発光素子

Country Status (3)

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US (1) US7812338B2 (OSRAM)
JP (1) JP2008103711A (OSRAM)
KR (1) KR20080035865A (OSRAM)

Cited By (24)

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WO2009139239A1 (ja) * 2008-05-14 2009-11-19 日本電気株式会社 窒化物半導体レーザ及びその製造方法
JP2010103429A (ja) * 2008-10-27 2010-05-06 Nitride Semiconductor Co Ltd 窒化ガリウム系発光装置の製造方法
JP2011054834A (ja) * 2009-09-03 2011-03-17 Sharp Corp 窒化物半導体レーザ素子
JP2012216751A (ja) * 2011-03-30 2012-11-08 Toyoda Gosei Co Ltd Iii族窒化物半導体発光素子
WO2013015035A1 (ja) * 2011-07-26 2013-01-31 日亜化学工業株式会社 半導体発光素子
JP2013084818A (ja) * 2011-10-11 2013-05-09 Toshiba Corp 半導体発光素子
JP2013149890A (ja) * 2012-01-23 2013-08-01 Stanley Electric Co Ltd GaN系半導体発光素子
JP2013214700A (ja) * 2012-03-07 2013-10-17 Toshiba Corp 半導体発光素子
US8686398B2 (en) 2012-03-02 2014-04-01 Kabushiki Kaisha Toshiba Semiconductor light emitting device
JP2015506592A (ja) * 2012-01-31 2015-03-02 ソイテックSoitec 電荷キャリアの分布が改善された光活性デバイス及びその形成方法
JP2015053531A (ja) * 2014-12-17 2015-03-19 株式会社東芝 半導体発光素子
JP2015509669A (ja) * 2012-03-06 2015-03-30 ソラア インコーポレーテッドSoraa Inc. 導波光効果を低減させる低屈折率材料層を有する発光ダイオード
US9318645B2 (en) 2012-10-19 2016-04-19 Sharp Kabushiki Kaisha Nitride semiconductor light-emitting element
JP2016219547A (ja) * 2015-05-18 2016-12-22 ローム株式会社 半導体発光素子
JP2017143152A (ja) * 2016-02-09 2017-08-17 日亜化学工業株式会社 窒化物半導体発光素子
JP2018500762A (ja) * 2015-01-05 2018-01-11 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH オプトエレクトロニクス部品
JP2019004160A (ja) * 2018-08-08 2019-01-10 日亜化学工業株式会社 窒化物半導体発光素子
JP2019041102A (ja) * 2017-08-22 2019-03-14 シャープ株式会社 レーザダイオード
WO2020036080A1 (ja) * 2018-08-16 2020-02-20 ソニー株式会社 発光デバイス
WO2021106928A1 (ja) * 2019-11-26 2021-06-03 日亜化学工業株式会社 窒化物半導体素子
JP2021090043A (ja) * 2019-12-03 2021-06-10 シャープ福山レーザー株式会社 3族窒化物ベースレーザダイオード
JP2022071179A (ja) * 2015-10-08 2022-05-13 オステンド・テクノロジーズ・インコーポレーテッド 琥珀色~赤色の発光を有するiii族窒化物半導体発光led
JP2022100211A (ja) * 2020-12-23 2022-07-05 日亜化学工業株式会社 窒化物半導体発光素子
WO2024105723A1 (ja) * 2022-11-14 2024-05-23 日本電信電話株式会社 多重量子井戸構造、半導体レーザおよび多重量子井戸構造の製造方法

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KR101018217B1 (ko) 2008-10-01 2011-02-28 삼성엘이디 주식회사 질화물 반도체 소자
KR20110057541A (ko) * 2009-11-24 2011-06-01 삼성엘이디 주식회사 질화물 반도체 발광소자
US8575592B2 (en) * 2010-02-03 2013-11-05 Cree, Inc. Group III nitride based light emitting diode structures with multiple quantum well structures having varying well thicknesses
JP4960465B2 (ja) * 2010-02-16 2012-06-27 株式会社東芝 半導体発光素子
KR101659359B1 (ko) * 2010-07-14 2016-09-23 엘지이노텍 주식회사 발광 소자
WO2012078849A2 (en) * 2010-12-08 2012-06-14 Sensor Electronic Technology, Inc. Light emitting device with varying barriers
KR101136882B1 (ko) * 2011-03-15 2012-04-20 광주과학기술원 질화물 반도체 기반의 태양전지 및 그 제조방법
JP6081709B2 (ja) * 2011-03-25 2017-02-15 エルジー イノテック カンパニー リミテッド 発光素子
CN102820395B (zh) * 2011-06-07 2015-02-18 山东华光光电子有限公司 一种采用势垒高度渐变量子垒的led结构及其制备方法
KR101916020B1 (ko) * 2011-07-11 2018-11-07 엘지이노텍 주식회사 발광소자, 발광 소자 제조방법 및 발광 소자 패키지
US9385271B2 (en) 2011-08-11 2016-07-05 Sensor Electronic Technology, Inc. Device with transparent and higher conductive regions in lateral cross section of semiconductor layer
US8787418B2 (en) * 2011-08-11 2014-07-22 Sensor Electronic Technology, Inc. Emitting device with compositional and doping inhomogeneities in semiconductor layers
US8879598B2 (en) 2011-08-11 2014-11-04 Sensor Electronic Technology, Inc. Emitting device with compositional and doping inhomogeneities in semiconductor layers
US10411156B2 (en) 2011-08-11 2019-09-10 Sensor Electronic Technology, Inc. Device with transparent and higher conductive regions in lateral cross section of semiconductor layer
US9595634B2 (en) 2011-08-11 2017-03-14 Sensor Electronic Technology, Inc. Device with transparent and higher conductive regions in lateral cross section of semiconductor layer
FR2986661B1 (fr) * 2012-02-08 2014-09-05 Soitec Silicon On Insulator Dispositifs photoactifs avec une repartition amelioree des porteurs de charge, et procedes de formation de ces dispositifs
US8471243B1 (en) 2012-01-31 2013-06-25 Soitec Photoactive devices with improved distribution of charge carriers, and methods of forming same
TWI549317B (zh) * 2012-03-01 2016-09-11 財團法人工業技術研究院 發光二極體
KR101945808B1 (ko) * 2012-08-06 2019-02-08 엘지이노텍 주식회사 발광 소자 및 발광 소자 패키지
KR101992152B1 (ko) * 2012-11-16 2019-06-25 엘지이노텍 주식회사 발광 소자 및 발광 소자 패키지
FR3004005B1 (fr) * 2013-03-28 2016-11-25 Commissariat Energie Atomique Diode electroluminescente a multiples puits quantiques et jonction p-n asymetrique
DE102013107969B4 (de) * 2013-07-25 2020-04-09 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
FR3012675B1 (fr) * 2013-10-25 2015-12-25 Commissariat Energie Atomique Dispositif emissif lumineux, dispositif et procede d'ajustement d'une emission lumineuse d'une diode electroluminescente
JP2015126024A (ja) * 2013-12-25 2015-07-06 株式会社豊田自動織機 半導体基板および半導体基板の製造方法
TWI689109B (zh) * 2014-09-04 2020-03-21 南韓商首爾偉傲世有限公司 垂直式紫外線發光裝置及其製造方法
KR102342713B1 (ko) * 2015-06-23 2021-12-23 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자
TWI577042B (zh) * 2015-07-15 2017-04-01 南臺科技大學 發光二極體晶片及數據發射及接收裝置
KR102477094B1 (ko) 2016-01-08 2022-12-13 삼성전자주식회사 비대칭 다준위 에너지를 갖는 3중 연결 양자우물 구조를 포함하는 광학 소자
CN105932126A (zh) * 2016-05-26 2016-09-07 湘能华磊光电股份有限公司 基于有源层提高发光二极管亮度的外延生长方法
CN107086258B (zh) * 2017-04-18 2019-05-14 安徽三安光电有限公司 一种多量子阱结构及其发光二极管
KR20190019539A (ko) 2017-08-18 2019-02-27 삼성전자주식회사 발광 소자 및 발광소자 패키지
KR101959141B1 (ko) * 2017-11-30 2019-03-15 주식회사 우리로 애벌란치 포토 다이오드
DE102019126506A1 (de) 2019-10-01 2021-04-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optoelektronischen halbleiterchips und optoelektronischer halbleiterchip
CN111641109B (zh) * 2020-06-09 2021-06-01 苏州长光华芯光电技术股份有限公司 一种多有源区级联的半导体激光器
KR20240071494A (ko) * 2022-11-15 2024-05-23 삼성디스플레이 주식회사 발광 소자, 이를 포함하는 표시 장치, 및 발광 소자의 제조 방법

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Cited By (32)

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Publication number Priority date Publication date Assignee Title
WO2009139239A1 (ja) * 2008-05-14 2009-11-19 日本電気株式会社 窒化物半導体レーザ及びその製造方法
JP2010103429A (ja) * 2008-10-27 2010-05-06 Nitride Semiconductor Co Ltd 窒化ガリウム系発光装置の製造方法
JP2011054834A (ja) * 2009-09-03 2011-03-17 Sharp Corp 窒化物半導体レーザ素子
US8586965B2 (en) 2011-03-30 2013-11-19 Toyoda Gosei Co., Ltd. Group III nitride semiconductor light-emitting device
JP2012216751A (ja) * 2011-03-30 2012-11-08 Toyoda Gosei Co Ltd Iii族窒化物半導体発光素子
WO2013015035A1 (ja) * 2011-07-26 2013-01-31 日亜化学工業株式会社 半導体発光素子
US9123851B2 (en) 2011-07-26 2015-09-01 Nichia Corporation Semiconductor light emitting element
JP2013084818A (ja) * 2011-10-11 2013-05-09 Toshiba Corp 半導体発光素子
JP2013149890A (ja) * 2012-01-23 2013-08-01 Stanley Electric Co Ltd GaN系半導体発光素子
JP2015506592A (ja) * 2012-01-31 2015-03-02 ソイテックSoitec 電荷キャリアの分布が改善された光活性デバイス及びその形成方法
US8686398B2 (en) 2012-03-02 2014-04-01 Kabushiki Kaisha Toshiba Semiconductor light emitting device
JP2015509669A (ja) * 2012-03-06 2015-03-30 ソラア インコーポレーテッドSoraa Inc. 導波光効果を低減させる低屈折率材料層を有する発光ダイオード
US9269876B2 (en) 2012-03-06 2016-02-23 Soraa, Inc. Light emitting diodes with low refractive index material layers to reduce light guiding effects
JP2013214700A (ja) * 2012-03-07 2013-10-17 Toshiba Corp 半導体発光素子
US9318645B2 (en) 2012-10-19 2016-04-19 Sharp Kabushiki Kaisha Nitride semiconductor light-emitting element
JP2015053531A (ja) * 2014-12-17 2015-03-19 株式会社東芝 半導体発光素子
JP2018500762A (ja) * 2015-01-05 2018-01-11 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH オプトエレクトロニクス部品
JP2016219547A (ja) * 2015-05-18 2016-12-22 ローム株式会社 半導体発光素子
JP2022071179A (ja) * 2015-10-08 2022-05-13 オステンド・テクノロジーズ・インコーポレーテッド 琥珀色~赤色の発光を有するiii族窒化物半導体発光led
JP2017143152A (ja) * 2016-02-09 2017-08-17 日亜化学工業株式会社 窒化物半導体発光素子
JP2019041102A (ja) * 2017-08-22 2019-03-14 シャープ株式会社 レーザダイオード
JP2019004160A (ja) * 2018-08-08 2019-01-10 日亜化学工業株式会社 窒化物半導体発光素子
WO2020036080A1 (ja) * 2018-08-16 2020-02-20 ソニー株式会社 発光デバイス
JP2024042006A (ja) * 2019-11-26 2024-03-27 日亜化学工業株式会社 窒化物半導体素子
WO2021106928A1 (ja) * 2019-11-26 2021-06-03 日亜化学工業株式会社 窒化物半導体素子
JPWO2021106928A1 (OSRAM) * 2019-11-26 2021-06-03
JP7659213B2 (ja) 2019-11-26 2025-04-09 日亜化学工業株式会社 窒化物半導体素子
JP7469677B2 (ja) 2019-11-26 2024-04-17 日亜化学工業株式会社 窒化物半導体素子
JP2021090043A (ja) * 2019-12-03 2021-06-10 シャープ福山レーザー株式会社 3族窒化物ベースレーザダイオード
JP7319559B2 (ja) 2020-12-23 2023-08-02 日亜化学工業株式会社 窒化物半導体発光素子
JP2022100211A (ja) * 2020-12-23 2022-07-05 日亜化学工業株式会社 窒化物半導体発光素子
WO2024105723A1 (ja) * 2022-11-14 2024-05-23 日本電信電話株式会社 多重量子井戸構造、半導体レーザおよび多重量子井戸構造の製造方法

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US7812338B2 (en) 2010-10-12
KR20080035865A (ko) 2008-04-24

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