JP2008100333A - 粘着テープ切断方法およびこれを用いた装置 - Google Patents
粘着テープ切断方法およびこれを用いた装置 Download PDFInfo
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- JP2008100333A JP2008100333A JP2006286533A JP2006286533A JP2008100333A JP 2008100333 A JP2008100333 A JP 2008100333A JP 2006286533 A JP2006286533 A JP 2006286533A JP 2006286533 A JP2006286533 A JP 2006286533A JP 2008100333 A JP2008100333 A JP 2008100333A
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- adhesive tape
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- tape
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 116
- 238000005520 cutting process Methods 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 10
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 61
- 230000001681 protective effect Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000011084 recovery Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/3846—Cutting-out; Stamping-out cutting out discs or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2628—Means for adjusting the position of the cutting member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1313—Cutting element simultaneously bonds [e.g., cut seaming]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
- Y10T156/1343—Cutting indefinite length web after assembly with discrete article
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1348—Work traversing type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1348—Work traversing type
- Y10T156/1352—Work traversing type with liquid applying means
- Y10T156/1361—Cutting after bonding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1378—Cutter actuated by or secured to bonding element
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T82/00—Turning
- Y10T82/16—Severing or cut-off
- Y10T82/16032—Automatic and/or triggered control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
- Y10T83/145—Including means to monitor product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
- Y10T83/148—Including means to correct the sensed operation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/162—With control means responsive to replaceable or selectable information program
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/465—Cutting motion of tool has component in direction of moving work
- Y10T83/4653—With means to initiate intermittent tool action
- Y10T83/4656—Tool moved in response to work-sensing means
- Y10T83/4667—With trip-switch work-sensing means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/869—Means to drive or to guide tool
- Y10T83/8691—Unicyclic
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】リングフレームfに帯状の支持用粘着テープDTを貼り付け、この支持用の粘着テープDTにカッタ刃を突き刺して貫通させ、リングフレームfのテープ貼付け面に先端を接触させた状態でカッタ刃27とリングフレームfとに電流を流して導通をとりながら、カッタ刃27をリングフレームfの形状に沿って切断する。この切断過程で、センサSにより導通状態をリアルタイムにモニタリングする。
【選択図】図2
Description
電流を流して導通のとれる材質からなる前記リングフレームと切断部材とに電流を流し、リングフレームに貼り付けた粘着テープに切断部材を貫通させ、その先端をリングフレームに接触させて導通をとりながらリングフレームの形状に沿って粘着テープを切断する
ことを特徴とする。
リングフレームを保持するフレーム保持手段と、
前記リングフレームに向けて帯状の支持用の粘着テープを供給するテープ供給手段と、
前記粘着テープの非粘着面に貼付け部材を押圧し、前記保持手段と貼付け部材とを相対的に移動させて前記リングフレームに粘着テープを貼り付ける貼付け手段と、
先端が先鋭な切断部材を備え、この切断部材を前記粘着テープに突き刺して前記リングフレームに接触させながらリングフレームの形状に沿って粘着テープを切断する切断機構と、
前記粘着テープを切断するときに前記リングフレームと切断部材とに電流を流して導通をとる電流供給手段と、
前記粘着テープを切断する過程で導通不良を検出する検出手段と
切断後の不要な粘着テープを剥離する剥離手段と、
を備えたことを特徴とする特徴とする。
18 … 電極
19 … 電源ユニット
22 … テープ貼付けユニット
23 … テープ切断機構
26 … カッタユニット
27 … カッタ刃
29 … モータ
31 … リンク機構
33 … モータ
44 … 制御部
DT … 支持用粘着テープ
f … リングフレーム
F … マウントフレーム
W … 半導体ウエハ
S … センサ
Claims (4)
- リングフレームに半導体ウエハを貼付け保持する支持用の粘着テープを切断する粘着テープ切断方法であって、
電流を流して導通のとれる材質からなる前記リングフレームと切断部材とに電流を流し、リングフレームに貼り付けた粘着テープに切断部材を貫通させ、その先端をリングフレームに接触させて導通をとりながらリングフレームの形状に沿って粘着テープを切断する
ことを特徴とする粘着テープ切断方法。 - 請求項1に記載の粘着テープ切断方法において、
前記粘着テープを切断する過程で電圧を検出して電圧の変化が生じた場合には、粘着テープへの前記切断部材の押圧力を調整して検出電圧が一定となるように制御する
ことを特徴とする粘着テープ切断方法。 - 支持用の粘着テープを介して半導体ウエハをリングフレームに貼付け保持する、この支持用粘着テープを切断する粘着テープ切断装置であって、
リングフレームを保持するフレーム保持手段と、
前記リングフレームに向けて帯状の支持用の粘着テープを供給するテープ供給手段と、
前記粘着テープの非粘着面に貼付け部材を押圧し、前記保持手段と貼付け部材とを相対的に移動させて前記リングフレームに粘着テープを貼り付ける貼付け手段と、
先端が先鋭な切断部材を備え、この切断部材を前記粘着テープに突き刺して前記リングフレームに接触させながらリングフレームの形状に沿って粘着テープを切断する切断機構と、
前記粘着テープを切断するときに前記リングフレームと切断部材とに電流を流して導通をとる電流供給手段と、
前記粘着テープを切断する過程で導通不良を検出する検出手段と
切断後の不要な粘着テープを剥離する剥離手段と、
を備えたことを特徴とする粘着テープ切断装置。 - 請求項3に記載の粘着テープ切断装置において、
前記検出手段は、電圧の変化を検出し、
さらに、前記検出手段により検出した電圧に変化が生じた場合、前記粘着テープへの前記切断部材の押圧力を調整して検出電圧が一定となるように制御する制御手段を備えた
ことを特徴とする粘着テープ切断装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006286533A JP4974639B2 (ja) | 2006-10-20 | 2006-10-20 | 粘着テープ切断方法およびこれを用いた装置 |
US11/907,429 US7833367B2 (en) | 2006-10-20 | 2007-10-12 | Adhesive tape cutting method and apparatus using the same |
KR1020070105302A KR101377855B1 (ko) | 2006-10-20 | 2007-10-19 | 점착 테이프 절단 방법 및 이를 이용한 장치 |
CN2007101632738A CN101165853B (zh) | 2006-10-20 | 2007-10-19 | 粘合带切断方法及采用该方法的装置 |
TW96139095A TWI433220B (zh) | 2006-10-20 | 2007-10-19 | 黏著帶切斷方法及利用此方法之裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006286533A JP4974639B2 (ja) | 2006-10-20 | 2006-10-20 | 粘着テープ切断方法およびこれを用いた装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008100333A true JP2008100333A (ja) | 2008-05-01 |
JP4974639B2 JP4974639B2 (ja) | 2012-07-11 |
Family
ID=39316797
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Application Number | Title | Priority Date | Filing Date |
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JP2006286533A Expired - Fee Related JP4974639B2 (ja) | 2006-10-20 | 2006-10-20 | 粘着テープ切断方法およびこれを用いた装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7833367B2 (ja) |
JP (1) | JP4974639B2 (ja) |
KR (1) | KR101377855B1 (ja) |
CN (1) | CN101165853B (ja) |
TW (1) | TWI433220B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011110681A (ja) * | 2009-11-30 | 2011-06-09 | Lintec Corp | シート切断装置及び切断方法 |
JP2013074105A (ja) * | 2011-09-28 | 2013-04-22 | Lintec Corp | シート貼付装置及び貼付方法、並びに、シート製造装置及び製造方法 |
JP2019186355A (ja) * | 2018-04-09 | 2019-10-24 | 株式会社ディスコ | 保護シート配設方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR101140074B1 (ko) * | 2004-03-18 | 2012-04-30 | 브이엠아이 홀랜드 비.브이. | 컷팅 장치 |
TWI330123B (en) * | 2007-11-23 | 2010-09-11 | Primax Electronics Ltd | Method for detecting whether object is completely cut off and paper cutter therewith |
DE102007061427B4 (de) * | 2007-12-20 | 2009-11-12 | Airbus Deutschland Gmbh | Vorrichtung zum Zuschneiden und Handhaben eines im Wesentlichen flächenhaften Zuschnittes aus einem CFK-Halbzeug und Verfahren |
JP4995796B2 (ja) * | 2008-09-30 | 2012-08-08 | 日東電工株式会社 | 粘着テープ貼付け方法および粘着テープ貼付け装置 |
JP5314057B2 (ja) * | 2011-01-07 | 2013-10-16 | 東京エレクトロン株式会社 | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
FI20115057L (fi) * | 2011-01-21 | 2012-07-22 | Wallac Oy | Menetelmä ja laite yhden tai useamman näytealueen leikkaamiseksi näytteen kantajasta |
US8834662B2 (en) * | 2012-03-22 | 2014-09-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method of separating wafer from carrier |
JP6122311B2 (ja) * | 2013-02-28 | 2017-04-26 | 日東電工株式会社 | 粘着テープ切断方法および粘着テープ片切断装置 |
TR201807612T4 (tr) * | 2015-10-06 | 2018-06-21 | Sandvik Intellectual Property | Gömme bir izleme birimi bulunan döner kesme aparatı. |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6198513A (ja) * | 1984-10-19 | 1986-05-16 | 日立金属株式会社 | 切断装置 |
JPH01141730A (ja) * | 1987-11-30 | 1989-06-02 | Mitsubishi Heavy Ind Ltd | タイヤ用スチールコード入り部材の切断方法及び装置 |
JPH06278129A (ja) * | 1993-03-26 | 1994-10-04 | Nippon Steel Corp | スライシングマシン |
JPH10209251A (ja) * | 1997-01-23 | 1998-08-07 | Disco Eng Service:Kk | テープ貼り方法及び装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2788070A (en) * | 1954-02-11 | 1957-04-09 | United Shoe Machinery Corp | Presses for cutting blanks from sheet material |
US2792883A (en) * | 1955-07-26 | 1957-05-21 | United Shoe Machinery Corp | Die cutting presse and cutting surfaces |
EP0166064B1 (de) * | 1984-06-27 | 1988-03-02 | Maschinenfabrik Meyer & Burger AG | Trennschleifmaschine mit einer Messanordnung und Verwendung dieser Messanordnung |
JPS62174940A (ja) | 1986-01-28 | 1987-07-31 | Nitto Electric Ind Co Ltd | ウエハとリングの自動貼合せ装置 |
JP4201564B2 (ja) * | 2001-12-03 | 2008-12-24 | 日東電工株式会社 | 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置 |
JP4136890B2 (ja) * | 2003-10-17 | 2008-08-20 | 日東電工株式会社 | 保護テープの切断方法及び切断装置 |
-
2006
- 2006-10-20 JP JP2006286533A patent/JP4974639B2/ja not_active Expired - Fee Related
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2007
- 2007-10-12 US US11/907,429 patent/US7833367B2/en not_active Expired - Fee Related
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- 2007-10-19 TW TW96139095A patent/TWI433220B/zh not_active IP Right Cessation
- 2007-10-19 CN CN2007101632738A patent/CN101165853B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6198513A (ja) * | 1984-10-19 | 1986-05-16 | 日立金属株式会社 | 切断装置 |
JPH01141730A (ja) * | 1987-11-30 | 1989-06-02 | Mitsubishi Heavy Ind Ltd | タイヤ用スチールコード入り部材の切断方法及び装置 |
JPH06278129A (ja) * | 1993-03-26 | 1994-10-04 | Nippon Steel Corp | スライシングマシン |
JPH10209251A (ja) * | 1997-01-23 | 1998-08-07 | Disco Eng Service:Kk | テープ貼り方法及び装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011110681A (ja) * | 2009-11-30 | 2011-06-09 | Lintec Corp | シート切断装置及び切断方法 |
JP2013074105A (ja) * | 2011-09-28 | 2013-04-22 | Lintec Corp | シート貼付装置及び貼付方法、並びに、シート製造装置及び製造方法 |
JP2019186355A (ja) * | 2018-04-09 | 2019-10-24 | 株式会社ディスコ | 保護シート配設方法 |
JP7034809B2 (ja) | 2018-04-09 | 2022-03-14 | 株式会社ディスコ | 保護シート配設方法 |
Also Published As
Publication number | Publication date |
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KR20080035979A (ko) | 2008-04-24 |
TWI433220B (zh) | 2014-04-01 |
JP4974639B2 (ja) | 2012-07-11 |
CN101165853B (zh) | 2011-01-26 |
US20080093025A1 (en) | 2008-04-24 |
CN101165853A (zh) | 2008-04-23 |
KR101377855B1 (ko) | 2014-03-25 |
US7833367B2 (en) | 2010-11-16 |
TW200830396A (en) | 2008-07-16 |
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