JP2008085302A - 照明装置 - Google Patents
照明装置 Download PDFInfo
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- JP2008085302A JP2008085302A JP2007184808A JP2007184808A JP2008085302A JP 2008085302 A JP2008085302 A JP 2008085302A JP 2007184808 A JP2007184808 A JP 2007184808A JP 2007184808 A JP2007184808 A JP 2007184808A JP 2008085302 A JP2008085302 A JP 2008085302A
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- light emitting
- semiconductor light
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- emitting element
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- 239000012790 adhesive layer Substances 0.000 claims abstract description 26
- 238000007747 plating Methods 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
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- 229910052594 sapphire Inorganic materials 0.000 description 8
- 239000010980 sapphire Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
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- 238000000034 method Methods 0.000 description 6
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- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
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- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000001579 optical reflectometry Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
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- 239000013078 crystal Substances 0.000 description 1
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- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
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- 229910003465 moissanite Inorganic materials 0.000 description 1
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- 238000007639 printing Methods 0.000 description 1
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- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
【解決手段】照明装置(1)は、複数の半導体発光素子(5)、反射層(3, 23)、複数の導体部(4c, 25a)および透光性の接着層(6)を備えている。半導体発光素子(5)は、透光性の基板(11)と、基板(11)に形成された半導体発光層(12)とを有する。反射層(3, 23)は、半導体発光素子(5)が互いに間隔を存して並べられる大きさを有する。導体部(4c, 25a)は、反射層(3, 23)の上に形成されて、半導体発光素子(5)に電気的に接続されている。接着層(6)は、半導体発光素子(5)の基板(11)を反射層(3, 23)に接着することで、半導体発光素子(5)を反射層(3, 23)の上に保持している。
【選択図】 図1
Description
Tj=Tc/W (W:投入電力)
で評価することができる。
Claims (6)
- 透光性の基板と、この基板に形成された半導体発光層とを有する複数の半導体発光素子と;
上記半導体発光素子が互いに間隔を存して並べられる大きさを有する白色の反射層と;
上記反射層の上に設けられ、上記半導体発光素子が電気的に接続される複数の導体部と;
上記各半導体発光素子の基板を上記反射層に接着することで、上記半導体発光素子を上記反射層の上に保持する透光性の接着層と;を具備することを特徴とする照明装置。 - 請求項1の記載において、上記導体部は、上記半導体発光素子と隣り合うように上記反射層の上に配置され、上記半導体発光素子の基板の厚みは、上記導体部の厚みよりも大きいことを特徴とする照明装置。
- 請求項1又は請求項2の記載において、上記半導体発光素子から放射された光を拡散させる光拡散部材をさらに備えており、この光拡散部材は、上記反射層と向かい合うことを特徴とする照明装置。
- 請求項1又は請求項2の記載において、上記反射層は絶縁層を兼ねており、この絶縁層の厚みは、30μmから90μmの範囲内にあることを特徴とする照明装置。
- 請求項1の記載において、上記反射層は、銀めっきで構成されていることを特徴とする照明装置。
- 請求項5の記載において、上記半導体発光素子の基板および上記導体部は、上記反射層に熱的に接続されているとともに、上記各半導体素子の半導体発光層は、ボンディングワイヤを介して上記各導体部に電気的かつ熱的に接続されていることを特徴とする照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007184808A JP4678391B2 (ja) | 2006-08-29 | 2007-07-13 | 照明装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006232634 | 2006-08-29 | ||
JP2007184808A JP4678391B2 (ja) | 2006-08-29 | 2007-07-13 | 照明装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010145090A Division JP5273486B2 (ja) | 2006-08-29 | 2010-06-25 | 照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008085302A true JP2008085302A (ja) | 2008-04-10 |
JP4678391B2 JP4678391B2 (ja) | 2011-04-27 |
Family
ID=39355777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007184808A Expired - Fee Related JP4678391B2 (ja) | 2006-08-29 | 2007-07-13 | 照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4678391B2 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010192606A (ja) * | 2009-02-17 | 2010-09-02 | Toshiba Lighting & Technology Corp | 発光装置 |
JP2010205776A (ja) * | 2009-02-27 | 2010-09-16 | Toshiba Lighting & Technology Corp | 発光モジュール |
JP2011035431A (ja) * | 2010-11-16 | 2011-02-17 | Toshiba Lighting & Technology Corp | 発光モジュール |
JP2011205106A (ja) * | 2010-03-05 | 2011-10-13 | Sharp Corp | 発光装置、照明装置およびバックライト |
EP2403017A1 (en) * | 2009-02-27 | 2012-01-04 | Toshiba Lighting & Technology Corporation | Light-emitting module and illumination apparatus |
US8343616B2 (en) | 2008-09-30 | 2013-01-01 | Hitachi Chemical Company, Ltd. | Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device |
JP2013070001A (ja) * | 2011-09-26 | 2013-04-18 | Toshiba Lighting & Technology Corp | 発光装置及びこれを備えた照明器具 |
US8616732B2 (en) | 2010-02-12 | 2013-12-31 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
US8632212B2 (en) | 2010-02-12 | 2014-01-21 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
US8872198B2 (en) | 2010-04-20 | 2014-10-28 | Toshiba Lighting & Technology Corporation | Luminaire and light-emitting apparatus with light-emitting device |
US9287242B2 (en) | 2010-03-05 | 2016-03-15 | Sharp Kabushiki Kaisha | Light emitting device, method for manufacturing light emitting device, illuminating device, and backlight |
JP2019212658A (ja) * | 2018-05-31 | 2019-12-12 | シチズン電子株式会社 | 発光装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0467360U (ja) * | 1990-10-24 | 1992-06-15 | ||
JPH08264840A (ja) * | 1995-03-27 | 1996-10-11 | Sanyo Electric Co Ltd | 発光ダイオード表示器 |
WO2003030274A1 (fr) * | 2001-09-27 | 2003-04-10 | Nichia Corporation | Dispositif emetteur de lumiere et procede de fabrication associe |
JP2005235779A (ja) * | 2001-08-09 | 2005-09-02 | Matsushita Electric Ind Co Ltd | Led照明装置およびカード型led照明光源 |
JP2006041380A (ja) * | 2004-07-29 | 2006-02-09 | Nippon Leiz Co Ltd | 光源装置 |
JP2006093399A (ja) * | 2004-09-24 | 2006-04-06 | Kyocera Corp | 発光装置およびその製造方法ならびに照明装置 |
JP2006140207A (ja) * | 2004-11-10 | 2006-06-01 | Hitachi Chem Co Ltd | 光反射用熱硬化性樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。 |
-
2007
- 2007-07-13 JP JP2007184808A patent/JP4678391B2/ja not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0467360U (ja) * | 1990-10-24 | 1992-06-15 | ||
JPH08264840A (ja) * | 1995-03-27 | 1996-10-11 | Sanyo Electric Co Ltd | 発光ダイオード表示器 |
JP2005235779A (ja) * | 2001-08-09 | 2005-09-02 | Matsushita Electric Ind Co Ltd | Led照明装置およびカード型led照明光源 |
WO2003030274A1 (fr) * | 2001-09-27 | 2003-04-10 | Nichia Corporation | Dispositif emetteur de lumiere et procede de fabrication associe |
JP2006041380A (ja) * | 2004-07-29 | 2006-02-09 | Nippon Leiz Co Ltd | 光源装置 |
JP2006093399A (ja) * | 2004-09-24 | 2006-04-06 | Kyocera Corp | 発光装置およびその製造方法ならびに照明装置 |
JP2006140207A (ja) * | 2004-11-10 | 2006-06-01 | Hitachi Chem Co Ltd | 光反射用熱硬化性樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101268725B1 (ko) | 2008-09-30 | 2013-05-28 | 히타치가세이가부시끼가이샤 | 코트제, 이것을 사용한 광반도체 소자 탑재용 기판 및 광반도체 장치 |
KR101372616B1 (ko) * | 2008-09-30 | 2014-03-11 | 히타치가세이가부시끼가이샤 | 코트제, 이것을 사용한 광반도체 소자 탑재용 기판 및 광반도체 장치 |
US8343616B2 (en) | 2008-09-30 | 2013-01-01 | Hitachi Chemical Company, Ltd. | Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device |
US8367153B2 (en) | 2008-09-30 | 2013-02-05 | Hitachi Chemical Company, Ltd. | Method of using white resin in an electronic device |
US8421113B2 (en) | 2008-09-30 | 2013-04-16 | Hitachi Chemical Company, Ltd. | Electronic device incorporating the white resin |
JP2010192606A (ja) * | 2009-02-17 | 2010-09-02 | Toshiba Lighting & Technology Corp | 発光装置 |
JP2010205776A (ja) * | 2009-02-27 | 2010-09-16 | Toshiba Lighting & Technology Corp | 発光モジュール |
EP2403017A4 (en) * | 2009-02-27 | 2014-07-02 | Toshiba Lighting & Technology | LIGHT-EMITTING MODULE AND LIGHTING DEVICE |
JP4640514B2 (ja) * | 2009-02-27 | 2011-03-02 | 東芝ライテック株式会社 | 発光モジュール |
EP2403017A1 (en) * | 2009-02-27 | 2012-01-04 | Toshiba Lighting & Technology Corporation | Light-emitting module and illumination apparatus |
US8632212B2 (en) | 2010-02-12 | 2014-01-21 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
US8616732B2 (en) | 2010-02-12 | 2013-12-31 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
JP2011205106A (ja) * | 2010-03-05 | 2011-10-13 | Sharp Corp | 発光装置、照明装置およびバックライト |
US9287242B2 (en) | 2010-03-05 | 2016-03-15 | Sharp Kabushiki Kaisha | Light emitting device, method for manufacturing light emitting device, illuminating device, and backlight |
US8872198B2 (en) | 2010-04-20 | 2014-10-28 | Toshiba Lighting & Technology Corporation | Luminaire and light-emitting apparatus with light-emitting device |
JP2011035431A (ja) * | 2010-11-16 | 2011-02-17 | Toshiba Lighting & Technology Corp | 発光モジュール |
JP2013070001A (ja) * | 2011-09-26 | 2013-04-18 | Toshiba Lighting & Technology Corp | 発光装置及びこれを備えた照明器具 |
JP2019212658A (ja) * | 2018-05-31 | 2019-12-12 | シチズン電子株式会社 | 発光装置 |
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