JP2008084895A - 電子部品の吸着ノズル部材 - Google Patents

電子部品の吸着ノズル部材 Download PDF

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Publication number
JP2008084895A
JP2008084895A JP2006259825A JP2006259825A JP2008084895A JP 2008084895 A JP2008084895 A JP 2008084895A JP 2006259825 A JP2006259825 A JP 2006259825A JP 2006259825 A JP2006259825 A JP 2006259825A JP 2008084895 A JP2008084895 A JP 2008084895A
Authority
JP
Japan
Prior art keywords
suction
electronic component
nozzle member
recess
suction nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006259825A
Other languages
English (en)
Japanese (ja)
Inventor
Takamasa Ishiwatari
隆政 石渡
Wataru Tokukura
渉 徳倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanto Precision Co Ltd
Original Assignee
Nanto Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanto Precision Co Ltd filed Critical Nanto Precision Co Ltd
Priority to JP2006259825A priority Critical patent/JP2008084895A/ja
Priority to PCT/JP2007/001034 priority patent/WO2008038415A1/fr
Publication of JP2008084895A publication Critical patent/JP2008084895A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
JP2006259825A 2006-09-25 2006-09-25 電子部品の吸着ノズル部材 Pending JP2008084895A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006259825A JP2008084895A (ja) 2006-09-25 2006-09-25 電子部品の吸着ノズル部材
PCT/JP2007/001034 WO2008038415A1 (fr) 2006-09-25 2007-09-23 Élément de buse d'aspiration pour un composant électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006259825A JP2008084895A (ja) 2006-09-25 2006-09-25 電子部品の吸着ノズル部材

Publications (1)

Publication Number Publication Date
JP2008084895A true JP2008084895A (ja) 2008-04-10

Family

ID=39229860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006259825A Pending JP2008084895A (ja) 2006-09-25 2006-09-25 電子部品の吸着ノズル部材

Country Status (2)

Country Link
JP (1) JP2008084895A (fr)
WO (1) WO2008038415A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102711433A (zh) * 2011-03-28 2012-10-03 索尼公司 吸嘴、安装装置、安装电子部件及制造部件安装基板方法
JP2013193182A (ja) * 2012-03-21 2013-09-30 Seiko Instruments Inc 吸引ヘッドおよび吸引搬送装置
CN104411109A (zh) * 2014-11-03 2015-03-11 华中科技大学 一种适应多规格芯片的表面贴装机拾取装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH083038Y2 (ja) * 1989-07-21 1996-01-29 ソニー株式会社 電子部品吸着保持装置
JPH04365579A (ja) * 1991-06-14 1992-12-17 Toshiba Corp 吸着ノズル
JPH0994788A (ja) * 1995-07-25 1997-04-08 Taiyo Yuden Co Ltd チップ状回路部品吸着ノズル
JP3607445B2 (ja) * 1997-01-31 2005-01-05 株式会社日立ハイテクインスツルメンツ 電子部品の吸着ノズル
JP3427297B2 (ja) * 1998-09-21 2003-07-14 ティーディーケイ株式会社 電子部品の実装方法
JP2001310286A (ja) * 2000-04-25 2001-11-06 Nagamine Seisakusho:Kk チップ部品吸着ノズルおよびチップ部品吸着装置
JP4369344B2 (ja) * 2004-10-28 2009-11-18 Ｔｄｋ株式会社 電子部品のピックアップ装置及びピックアップ方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102711433A (zh) * 2011-03-28 2012-10-03 索尼公司 吸嘴、安装装置、安装电子部件及制造部件安装基板方法
JP2013193182A (ja) * 2012-03-21 2013-09-30 Seiko Instruments Inc 吸引ヘッドおよび吸引搬送装置
CN104411109A (zh) * 2014-11-03 2015-03-11 华中科技大学 一种适应多规格芯片的表面贴装机拾取装置
CN104411109B (zh) * 2014-11-03 2017-05-10 华中科技大学 一种适应多规格芯片的表面贴装机拾取装置

Also Published As

Publication number Publication date
WO2008038415A1 (fr) 2008-04-03

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