JP2008066504A - 接続端子 - Google Patents
接続端子 Download PDFInfo
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- JP2008066504A JP2008066504A JP2006242480A JP2006242480A JP2008066504A JP 2008066504 A JP2008066504 A JP 2008066504A JP 2006242480 A JP2006242480 A JP 2006242480A JP 2006242480 A JP2006242480 A JP 2006242480A JP 2008066504 A JP2008066504 A JP 2008066504A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/4005—Shape
- H01L2224/4009—Loop shape
- H01L2224/40095—Kinked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/40247—Connecting the strap to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/8434—Bonding interfaces of the connector
- H01L2224/84345—Shape, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/84801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Abstract
【解決手段】 本発明はリードフレーム30に配置された半導体チップ31と、他のフレーム又は他の半導体チップとの接続を行なうべく、半導体チップとの接続に半田を用いて接続するための接続端子10であり、半田の吸い上がりを誘因するために半導体チップ31の接続面より狭い接続面を有する接続面部12を備えた接続端子であって、半導体チップよりも大きな保護部13と、保護部により接続面部を所定の間隔を有して覆うべく、接続面部および前記保護部の接続を行なう接続部14とを備えることを特徴とする。
【選択図】 図1
Description
更に、板部材にプレスによる打ち抜き加工が施され、所定形状に突出する被突出側を環囲するように打ち残った板部材において、被突出側を接続面部位、該接続面部位を環囲する保護部位および突出側において接続面部位と保護部位との間を接続部位として有しており、接続面部位および保護部位が平行な離間間隔有するように各部位の境において折り曲げ加工が施され、保護部位に保護部、接続面部位に接続面部および接続部位に接続部が形成されることを特徴とする。
尚、電気回路としてブリッジ回路が構成された半導体装置100が図2に示されている。
本発明の接続端子10は、図1に示すように、連結部11の一方端に半導体チップ31と接続するための構造として、接続面部12と、半導体チップを保護するための保護部13と、該保護部13および前記接続面部12を所定の離間間隔を有して接続するための接続部14とを備えており、更に連結部2の他方端にリードフレーム30と接続するためのフレーム接続面部15を備えている。
また、連結部11自体も、各リードフレーム30と電気的に短絡することの無いように、所定形状の段差を有している。
保護部13は、例えば0.3mmの板厚寸法を有する方形の環状形状であり、当該環状形状の例えば縦2.8mmおよび横3.4mmの外形を有し、例えば外形が縦横2.6mmおよび高さ0.3mmの半導体チップ31よりも大きく形成されている。これにより、保護部13下に配置された半導体チップ31は、図3に示すように、保護部13によって保護することができる。
具体的には、所定の板厚寸法として例えば0.3mmを有する板部材に所定形状の抜き打ちプレスを施し、その後段差のためのプレスを施す。
11、21 連結部
12、22 接続面部
13、23 保護部
14、24 接続部
15、25 フレーム接続面部
30 リードフレーム
31 半導体チップ
32 樹脂封止部
100 半導体装置
Claims (4)
- フレームに配置された半導体チップと、他のフレーム又は他の半導体チップとの接続を行なうべく、半導体チップとの接続に半田を用いて接続するための接続端子であり、半田の吸い上がりを誘因するために半導体チップの接続面より狭い接続面を有する接続面部を備えた接続端子であって、
前記半導体チップよりも大きな保護部と、
前記保護部により前記接続面部を所定の間隔を有して覆うべく、前記接続面部および前記保護部の接続を行なう接続部と、を備えることを特徴とする接続端子。 - 前記接続面部、前記保護部および前記接続部は、所定形状の板状部材に加工が施されて一体的に形成されることを特徴とする請求項1記載の接続端子。
- 前記板部材にプレスによる打ち抜き加工が施され、所定形状に突出する被突出側を環囲するように打ち残った板部材において、前記被突出側を接続面部位、該接続面部位を環囲する保護部位および突出側において前記接続面部位と前記保護部位との間を接続部位として有しており、前記接続面部位および前記保護部位が平行な離間間隔有するように前記各部位の境において折り曲げ加工が施され、前記保護部位に前記保護部、前記接続面部位に前記接続面部および前記接続部位に前記接続部が形成されることを特徴とする請求項2記載の接続端子。
- 前記板部材に所定形状のプレスによる打ち抜き加工が施され、打ち残った板部材においてその端から順に接続面部位、接続部位および保護部位を有しており、該各部位の境において屈曲するコの字形状の折り曲げ加工が施され、前記保護部位に前記保護部、前記接続面部位に前記接続面部および前記接続部位に前記接続部が形成されることを特徴とする請求項2記載の接続端子。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006242480A JP4890161B2 (ja) | 2006-09-07 | 2006-09-07 | 接続端子 |
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JP2006242480A JP4890161B2 (ja) | 2006-09-07 | 2006-09-07 | 接続端子 |
Publications (2)
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JP2008066504A true JP2008066504A (ja) | 2008-03-21 |
JP4890161B2 JP4890161B2 (ja) | 2012-03-07 |
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JP2006242480A Expired - Fee Related JP4890161B2 (ja) | 2006-09-07 | 2006-09-07 | 接続端子 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089563A (ja) * | 2010-10-15 | 2012-05-10 | Sanken Electric Co Ltd | 半導体モジュール |
JP2015053425A (ja) * | 2013-09-09 | 2015-03-19 | 三菱電機株式会社 | 半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001203312A (ja) * | 2000-01-18 | 2001-07-27 | Sanken Electric Co Ltd | リード端子及び半導体装置 |
JP2004047800A (ja) * | 2002-07-12 | 2004-02-12 | Toyota Industries Corp | 接続部材及び接続構造 |
-
2006
- 2006-09-07 JP JP2006242480A patent/JP4890161B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001203312A (ja) * | 2000-01-18 | 2001-07-27 | Sanken Electric Co Ltd | リード端子及び半導体装置 |
JP2004047800A (ja) * | 2002-07-12 | 2004-02-12 | Toyota Industries Corp | 接続部材及び接続構造 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089563A (ja) * | 2010-10-15 | 2012-05-10 | Sanken Electric Co Ltd | 半導体モジュール |
JP2015053425A (ja) * | 2013-09-09 | 2015-03-19 | 三菱電機株式会社 | 半導体装置 |
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Publication number | Publication date |
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JP4890161B2 (ja) | 2012-03-07 |
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