JP2008049226A - 予備吐出装置 - Google Patents

予備吐出装置 Download PDF

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Publication number
JP2008049226A
JP2008049226A JP2006225550A JP2006225550A JP2008049226A JP 2008049226 A JP2008049226 A JP 2008049226A JP 2006225550 A JP2006225550 A JP 2006225550A JP 2006225550 A JP2006225550 A JP 2006225550A JP 2008049226 A JP2008049226 A JP 2008049226A
Authority
JP
Japan
Prior art keywords
cleaning liquid
tank
squeegee
priming roller
preliminary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006225550A
Other languages
English (en)
Japanese (ja)
Inventor
Kazunobu Yamaguchi
和伸 山口
Shinji Takase
真治 高瀬
Atsuo Kajima
淳生 楫間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2006225550A priority Critical patent/JP2008049226A/ja
Priority to TW096116519A priority patent/TW200810842A/zh
Priority to CNA2007101304339A priority patent/CN101130185A/zh
Priority to KR1020070083177A priority patent/KR100890503B1/ko
Publication of JP2008049226A publication Critical patent/JP2008049226A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
JP2006225550A 2006-08-22 2006-08-22 予備吐出装置 Pending JP2008049226A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006225550A JP2008049226A (ja) 2006-08-22 2006-08-22 予備吐出装置
TW096116519A TW200810842A (en) 2006-08-22 2007-05-09 Pre-discharging device
CNA2007101304339A CN101130185A (zh) 2006-08-22 2007-07-19 预喷出装置
KR1020070083177A KR100890503B1 (ko) 2006-08-22 2007-08-20 예비 토출장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006225550A JP2008049226A (ja) 2006-08-22 2006-08-22 予備吐出装置

Publications (1)

Publication Number Publication Date
JP2008049226A true JP2008049226A (ja) 2008-03-06

Family

ID=39127682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006225550A Pending JP2008049226A (ja) 2006-08-22 2006-08-22 予備吐出装置

Country Status (4)

Country Link
JP (1) JP2008049226A (enrdf_load_stackoverflow)
KR (1) KR100890503B1 (enrdf_load_stackoverflow)
CN (1) CN101130185A (enrdf_load_stackoverflow)
TW (1) TW200810842A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101062208B1 (ko) 2009-04-29 2011-09-05 주식회사 디지아이 프린터 헤드용 검사 장치
JP2014160612A (ja) * 2013-02-20 2014-09-04 Toppan Printing Co Ltd 凸版印刷装置及び有機ｅｌ素子の製造方法、有機ｅｌ素子
CN114146873A (zh) * 2021-12-06 2022-03-08 中铜(昆明)铜业有限公司 一种防蜡液回流的scr连铸连轧生产线线杆涂蜡器

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102378653A (zh) * 2009-03-30 2012-03-14 丰田自动车株式会社 涂敷头及具有该涂敷头的涂敷装置
JP5154510B2 (ja) * 2009-06-05 2013-02-27 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置
JP5121778B2 (ja) * 2009-06-26 2013-01-16 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置
CN102707585A (zh) * 2011-11-25 2012-10-03 京东方科技集团股份有限公司 光刻胶回收系统
CN103645607B (zh) * 2013-12-19 2016-09-07 合肥京东方光电科技有限公司 涂胶系统
CN106423755B (zh) * 2016-11-22 2019-06-25 京东方科技集团股份有限公司 涂布设备、利用其回收涂布液的方法及其清洁方法
JP7131149B2 (ja) * 2018-07-11 2022-09-06 京セラドキュメントソリューションズ株式会社 インクジェット記録装置
CN109365210B (zh) * 2018-11-29 2024-04-02 江苏远华轻化装备有限公司 一种快速定位调节的刮刀机构
CN113457917A (zh) * 2021-06-30 2021-10-01 无锡极电光能科技有限公司 涂布设备及利用该设备制备钙钛矿吸光薄膜的方法
CN114712928B (zh) * 2022-03-23 2023-07-25 广西金茂钛业股份有限公司 一种用于处理钛白粉生产副产物的转鼓过滤机及使用方法
CN118122576B (zh) * 2024-05-07 2024-08-16 德沪涂膜设备(苏州)有限公司 一种预涂布装置以及预涂布检测方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004121980A (ja) * 2002-10-02 2004-04-22 Toppan Printing Co Ltd 予備吐出装置および方法
JP3877719B2 (ja) * 2002-11-07 2007-02-07 東京応化工業株式会社 スリットコータの予備吐出装置
JP4429073B2 (ja) * 2004-05-20 2010-03-10 東京応化工業株式会社 スリットコータの予備吐出装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101062208B1 (ko) 2009-04-29 2011-09-05 주식회사 디지아이 프린터 헤드용 검사 장치
JP2014160612A (ja) * 2013-02-20 2014-09-04 Toppan Printing Co Ltd 凸版印刷装置及び有機ｅｌ素子の製造方法、有機ｅｌ素子
CN114146873A (zh) * 2021-12-06 2022-03-08 中铜(昆明)铜业有限公司 一种防蜡液回流的scr连铸连轧生产线线杆涂蜡器
CN114146873B (zh) * 2021-12-06 2023-02-24 中铜(昆明)铜业有限公司 一种防蜡液回流的scr连铸连轧生产线线杆涂蜡器

Also Published As

Publication number Publication date
KR100890503B1 (ko) 2009-03-26
KR20080019165A (ko) 2008-03-03
TWI327488B (enrdf_load_stackoverflow) 2010-07-21
TW200810842A (en) 2008-03-01
CN101130185A (zh) 2008-02-27

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