JP2008036737A5 - - Google Patents

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Publication number
JP2008036737A5
JP2008036737A5 JP2006211696A JP2006211696A JP2008036737A5 JP 2008036737 A5 JP2008036737 A5 JP 2008036737A5 JP 2006211696 A JP2006211696 A JP 2006211696A JP 2006211696 A JP2006211696 A JP 2006211696A JP 2008036737 A5 JP2008036737 A5 JP 2008036737A5
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JP
Japan
Prior art keywords
chamfering
light
substrates
translucent
corners
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Application number
JP2006211696A
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English (en)
Japanese (ja)
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JP2008036737A (ja
JP4935230B2 (ja
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Priority to JP2006211696A priority Critical patent/JP4935230B2/ja
Priority claimed from JP2006211696A external-priority patent/JP4935230B2/ja
Publication of JP2008036737A publication Critical patent/JP2008036737A/ja
Publication of JP2008036737A5 publication Critical patent/JP2008036737A5/ja
Application granted granted Critical
Publication of JP4935230B2 publication Critical patent/JP4935230B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006211696A 2006-08-03 2006-08-03 透光性基板の製造方法 Expired - Fee Related JP4935230B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006211696A JP4935230B2 (ja) 2006-08-03 2006-08-03 透光性基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006211696A JP4935230B2 (ja) 2006-08-03 2006-08-03 透光性基板の製造方法

Publications (3)

Publication Number Publication Date
JP2008036737A JP2008036737A (ja) 2008-02-21
JP2008036737A5 true JP2008036737A5 (zh) 2009-09-10
JP4935230B2 JP4935230B2 (ja) 2012-05-23

Family

ID=39172343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006211696A Expired - Fee Related JP4935230B2 (ja) 2006-08-03 2006-08-03 透光性基板の製造方法

Country Status (1)

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JP (1) JP4935230B2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4780142B2 (ja) * 2008-05-22 2011-09-28 信越半導体株式会社 ウェーハの製造方法
JP2013043246A (ja) * 2011-08-24 2013-03-04 Kyocera Crystal Device Corp 水晶片の形成方法
JP5837815B2 (ja) * 2011-12-21 2015-12-24 株式会社ディスコ 被加工物の分割方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5493277A (en) * 1977-12-29 1979-07-24 Mitsubishi Electric Corp Method of processing thin plates
JPS60191710A (ja) * 1983-12-19 1985-09-30 Nippon Shii M K Kk 印刷配線板の端子部面取方法
JPH01114261A (ja) * 1987-10-28 1989-05-02 Toshiba Corp 情報処理装置
JPH05123955A (ja) * 1991-10-31 1993-05-21 Nippon Dempa Kogyo Co Ltd 水晶片の研磨装置
JPH0639692A (ja) * 1992-07-27 1994-02-15 Toshiba Ceramics Co Ltd 面取り加工治具
JPH06106469A (ja) * 1992-09-29 1994-04-19 Nippon Electric Glass Co Ltd ガラス板の角部面取り加工方法及び面取り加工治具
JP3390842B2 (ja) * 1993-04-26 2003-03-31 勝代 田原 板状ワークの面取り研磨および鏡面研磨方法
JPH10118907A (ja) * 1996-10-15 1998-05-12 Hitachi Electron Eng Co Ltd ガラス基板の外周加工装置
JP4006855B2 (ja) * 1998-10-30 2007-11-14 エプソントヨコム株式会社 光学デバイスの製造方法

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