JPS5493277A - Method of processing thin plates - Google Patents

Method of processing thin plates

Info

Publication number
JPS5493277A
JPS5493277A JP16026577A JP16026577A JPS5493277A JP S5493277 A JPS5493277 A JP S5493277A JP 16026577 A JP16026577 A JP 16026577A JP 16026577 A JP16026577 A JP 16026577A JP S5493277 A JPS5493277 A JP S5493277A
Authority
JP
Japan
Prior art keywords
bonding agent
thin plates
lamination
plates
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16026577A
Other languages
Japanese (ja)
Inventor
Takashi Taniguchi
Kenji Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16026577A priority Critical patent/JPS5493277A/en
Publication of JPS5493277A publication Critical patent/JPS5493277A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated

Abstract

PURPOSE:To simultaneously process a plurality of thin plates without hurting the surfaces thereof. CONSTITUTION:A plurality of thin square plates 1 to be procssed are first laminated via layers of a bonding agent 2. After the bonding agent 2 has been hardened, a large lamination 4 is obtained, which is then divided into several parts 5 of a predetermined dimensions. A lamination 5 thus obtained is then pasted on a special jig 3 with the same bonding agent 2, or directly chucked by the jig 3. The outer surface of the lamination is then subjected as it is to a grinding treatment. After the grinding treatment has been completed, the bonding agent 2 is removed to separate the thin plates 1 from one another to obtain a plurality of processed thin plates of a predetermined shape. According to this invention, thin plates are not hurt during a grinding operation since the outer surfaces thereof are protected by a bonding agent. In addition, the grinding operation can be conducted easily and at a high accuracy since the material to be ground is in an integrally laminated state.
JP16026577A 1977-12-29 1977-12-29 Method of processing thin plates Pending JPS5493277A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16026577A JPS5493277A (en) 1977-12-29 1977-12-29 Method of processing thin plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16026577A JPS5493277A (en) 1977-12-29 1977-12-29 Method of processing thin plates

Publications (1)

Publication Number Publication Date
JPS5493277A true JPS5493277A (en) 1979-07-24

Family

ID=15711255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16026577A Pending JPS5493277A (en) 1977-12-29 1977-12-29 Method of processing thin plates

Country Status (1)

Country Link
JP (1) JPS5493277A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138860A (en) * 1984-07-31 1986-02-24 Nippon Sheet Glass Co Ltd Machining
DE3436502A1 (en) * 1984-10-05 1986-04-10 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Method of producing cylindrical bodies of small dimensions
JP2008036737A (en) * 2006-08-03 2008-02-21 Epson Toyocom Corp Manufacturing method for optical substrate
JP2010086633A (en) * 2008-10-02 2010-04-15 Konica Minolta Opto Inc Method for manufacturing glass substrate for magnetic recording medium
CN102554586A (en) * 2010-12-17 2012-07-11 上海无线电设备研究所 Double-sided precision machining method for large-plane thin-walled parts
JP2013043246A (en) * 2011-08-24 2013-03-04 Kyocera Crystal Device Corp Method for forming crystal piece

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138860A (en) * 1984-07-31 1986-02-24 Nippon Sheet Glass Co Ltd Machining
DE3436502A1 (en) * 1984-10-05 1986-04-10 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Method of producing cylindrical bodies of small dimensions
JP2008036737A (en) * 2006-08-03 2008-02-21 Epson Toyocom Corp Manufacturing method for optical substrate
JP2010086633A (en) * 2008-10-02 2010-04-15 Konica Minolta Opto Inc Method for manufacturing glass substrate for magnetic recording medium
CN102554586A (en) * 2010-12-17 2012-07-11 上海无线电设备研究所 Double-sided precision machining method for large-plane thin-walled parts
JP2013043246A (en) * 2011-08-24 2013-03-04 Kyocera Crystal Device Corp Method for forming crystal piece

Similar Documents

Publication Publication Date Title
IT1072925B (en) PROCEDURE AND DEVICE FOR THE PROPULSION OF THE GRINDING BODIES OF THE MILLS, PARTICULARLY OF THE SO-CALLED BALLS
IT7819534A0 (en) ABRASIVE BODIES FOR TOOLS AND PROCEDURES FOR THEIR MANUFACTURING.
JPS5493277A (en) Method of processing thin plates
JPS5429188A (en) Abrasive wheel for grinding machine and method of producing the same
JPS5327193A (en) Abrasive process
CH556218A (en) DEVICE FOR MACHINING PARTS IN ACCORDANCE WITH THE GRINDING PROCESS.
CH551764A (en) PROTECTIVE CLOTHING, IN PARTICULAR PROTECTIVE GLOVES, AND THE PROCESS FOR THEIR MANUFACTURING.
JPS53101192A (en) Method of and apparatus for treating flaws in steel materials
JPS51111993A (en) Apparatus for fabricating thin work as semiconductor or the like
AT310025B (en) Device for grinding the contour edge on elongated bodies, in particular pieces of cutlery
JPS5662306A (en) Manufacturing of laminated steel core and the device
JPS5633270A (en) Grinding stone
DK593675A (en) METHOD FOR GRINDING THE GEMSTONE
JPS55135320A (en) Manufacture of magnetic head
JPS63164444A (en) Manufacture of semiconductor device
CH534032A (en) Method and apparatus for grinding essentially flat workpiece surfaces
CH457815A (en) Method for grinding elastomers and a device for carrying out the method
JPS5373075A (en) Treatment method for wafer surface
JPS5324693A (en) Method for processing plates using thin plates processing machine
JPS5366157A (en) Method for semiconductor processing
JPS51113954A (en) Parts separating and take-out apparatus
NL7603062A (en) DEVICE FOR MATERIAL REMOVAL PROCESSING OF BODIES, IN PARTICULAR FOR PROCESSING GRINDING WHEELS, RESPECTIVE GRINDING SEGMENTS.
JPS5430593A (en) Centerless grinding method
CH339080A (en) Device for the surface treatment of metallic workpieces, in particular for the production of metallographic samples
JPS51140470A (en) Method of cutting semiconductor crystal