JP2008034408A5 - - Google Patents

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Publication number
JP2008034408A5
JP2008034408A5 JP2006202715A JP2006202715A JP2008034408A5 JP 2008034408 A5 JP2008034408 A5 JP 2008034408A5 JP 2006202715 A JP2006202715 A JP 2006202715A JP 2006202715 A JP2006202715 A JP 2006202715A JP 2008034408 A5 JP2008034408 A5 JP 2008034408A5
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JP
Japan
Prior art keywords
refrigerant
processing apparatus
plasma processing
sample stage
sample
Prior art date
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Application number
JP2006202715A
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English (en)
Japanese (ja)
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JP4906425B2 (ja
JP2008034408A (ja
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Publication date
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Priority to JP2006202715A priority Critical patent/JP4906425B2/ja
Priority claimed from JP2006202715A external-priority patent/JP4906425B2/ja
Priority to US11/512,081 priority patent/US7771564B2/en
Publication of JP2008034408A publication Critical patent/JP2008034408A/ja
Publication of JP2008034408A5 publication Critical patent/JP2008034408A5/ja
Application granted granted Critical
Publication of JP4906425B2 publication Critical patent/JP4906425B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006202715A 2006-07-26 2006-07-26 プラズマ処理装置 Expired - Fee Related JP4906425B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006202715A JP4906425B2 (ja) 2006-07-26 2006-07-26 プラズマ処理装置
US11/512,081 US7771564B2 (en) 2006-07-26 2006-08-30 Plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006202715A JP4906425B2 (ja) 2006-07-26 2006-07-26 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2008034408A JP2008034408A (ja) 2008-02-14
JP2008034408A5 true JP2008034408A5 (https=) 2009-07-09
JP4906425B2 JP4906425B2 (ja) 2012-03-28

Family

ID=38984961

Family Applications (1)

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JP2006202715A Expired - Fee Related JP4906425B2 (ja) 2006-07-26 2006-07-26 プラズマ処理装置

Country Status (2)

Country Link
US (1) US7771564B2 (https=)
JP (1) JP4906425B2 (https=)

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JP5417338B2 (ja) * 2007-10-31 2014-02-12 ラム リサーチ コーポレーション 冷却液と構成部品本体との間の熱伝導性を制御するためにガス圧を使用する温度制御モジュール及び温度制御方法
JP2009204288A (ja) * 2008-02-29 2009-09-10 Nishiyama Corp 冷却装置
JP5382602B2 (ja) * 2008-03-11 2014-01-08 住友電気工業株式会社 ウエハ保持体および半導体製造装置
JP5210706B2 (ja) * 2008-05-09 2013-06-12 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法
KR101514098B1 (ko) * 2009-02-02 2015-04-21 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치와 온도 측정 방법 및 장치
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JP5401286B2 (ja) * 2009-12-04 2014-01-29 株式会社日立ハイテクノロジーズ 試料台の温度制御機能を備えた真空処理装置及びプラズマ処理装置
US9978565B2 (en) * 2011-10-07 2018-05-22 Lam Research Corporation Systems for cooling RF heated chamber components
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WO2014116392A1 (en) * 2013-01-25 2014-07-31 Applied Materials, Inc. Electrostatic chuck with concentric cooling base
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US9034771B1 (en) * 2014-05-23 2015-05-19 Applied Materials, Inc. Cooling pedestal for dicing tape thermal management during plasma dicing
KR101563495B1 (ko) * 2014-07-31 2015-10-27 한국에너지기술연구원 광-전자적 측정 시에 샘플의 온도를 제어하는 장치 및 이를 이용한 태양전지 측정 장치
KR102147615B1 (ko) 2014-10-30 2020-08-24 도쿄엘렉트론가부시키가이샤 기판 적재대
JP6982394B2 (ja) * 2017-02-02 2021-12-17 東京エレクトロン株式会社 被加工物の処理装置、及び載置台
CN107841727A (zh) * 2017-12-15 2018-03-27 北京创昱科技有限公司 一种冷却构件及真空镀膜设备
JP7066438B2 (ja) * 2018-02-13 2022-05-13 東京エレクトロン株式会社 冷却システム
JP7101024B2 (ja) * 2018-04-03 2022-07-14 東京エレクトロン株式会社 温調システム
JP7112915B2 (ja) * 2018-09-07 2022-08-04 東京エレクトロン株式会社 温調システム
KR102646904B1 (ko) 2018-12-04 2024-03-12 삼성전자주식회사 플라즈마 처리 장치
JP7458156B2 (ja) * 2019-08-22 2024-03-29 東京エレクトロン株式会社 載置台及びプラズマ処理装置
JP2026015961A (ja) * 2024-07-22 2026-02-03 東京エレクトロン株式会社 ステージ、基板処理装置、および温度調整方法
CN120272875B (zh) * 2025-05-07 2025-11-14 山东力冠微电子装备有限公司 制备大尺寸多晶金刚石薄膜的mpcvd设备及制备方法

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JP2005079539A (ja) * 2003-09-03 2005-03-24 Hitachi Ltd プラズマ処理装置
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JP4191120B2 (ja) 2004-09-29 2008-12-03 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP4906425B2 (ja) * 2006-07-26 2012-03-28 株式会社日立ハイテクノロジーズ プラズマ処理装置

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