JP7066438B2 - 冷却システム - Google Patents
冷却システム Download PDFInfo
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- JP7066438B2 JP7066438B2 JP2018022895A JP2018022895A JP7066438B2 JP 7066438 B2 JP7066438 B2 JP 7066438B2 JP 2018022895 A JP2018022895 A JP 2018022895A JP 2018022895 A JP2018022895 A JP 2018022895A JP 7066438 B2 JP7066438 B2 JP 7066438B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
- F25B39/028—Evaporators having distributing means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/20—Disposition of valves, e.g. of on-off valves or flow control valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B5/00—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity
- F25B5/02—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity arranged in parallel
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D5/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B1/00—Compression machines, plants or systems with non-reversible cycle
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/06—Several compression cycles arranged in parallel
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/07—Details of compressors or related parts
- F25B2400/075—Details of compressors or related parts with parallel compressors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Details Of Measuring And Other Instruments (AREA)
Description
図2は、第1実施例に係る冷却システムCSの構成を示す図である。冷却システムCSは、チラーユニットCH、供給ラインSL、排出ラインDLd(第1排出ライン)、熱交換部HEを備える。
Φ0=Qmr×Wr=Qmr×(h1-h4)。
ただし、Wr,h1,h4のそれぞれは以下のように定義される。
Wr:冷凍効果[kJ/kg]。
h1:蒸発室VP出口の冷媒(過熱蒸気)の比エンタルピー[kJ/kg]。
h4:蒸発室VP入口の冷媒(湿り蒸気)の比エンタルピー[kJ/kg]。
また、冷却システムCSによって被冷却体を冷却できる能力のことを冷凍能力と呼ぶ。したがって、冷凍能力は冷媒の冷凍効果、冷媒の循環量と比例関係にある。また、蒸発室VPが分室VP‐1~分室VP-nに分割される場合にも、冷媒循環量が調整されることによって、分室VP‐1~分室VP-nのそれぞれの冷凍能力が制御され得る。
図6は、一実施形態に係る冷却システムCSの他の構成(第2実施例)を示す図である。第2実施例に係る冷却システムCSでは、第1実施例の蒸発室VPおよび貯留室RTが変更されている。
流量調整バルブFCVは、供給ラインSL上において、チラーユニットCHと枝ラインSL‐1~枝ラインSL‐nとの間に配置されている。
図10は、一実施形態に係る冷却システムCSの他の構成(第3実施例)を示す図である。第3実施例に係る冷却システムCSは、第1実施例に対して排出ラインDLu(第2排出ライン)が加えられた構成を有する。
図11は、一実施形態に係る冷却システムCSの他の構成(第4実施例)を示す図である。第4実施例に係る冷却システムCSは、第2実施例に対して、排出ラインDLuが加えられた構成を有する。第4実施例に係る排出ラインDLuは、枝ラインDLu‐1~枝ラインDLu‐nを備える。
図13は、一実施形態に係る冷却システムCSの他の構成(第5実施例)を示す図である。第5実施例に係る冷却システムCSは、複数のチラーユニット(チラーユニットCH‐1~チラーユニットCH‐n)を有する。チラーユニットCH‐1~チラーユニットCH‐nのそれぞれは、第2実施例のチラーユニットCHと同様の機能を有する。特に、チラーユニットCH‐1~チラーユニットCH‐nのそれぞれ(例えばチラーユニットCH‐1)は、互いに連通する一組の第2分室と第1分室とに対して(例えばチラーユニットCH‐1に接続する分室RT‐1と分室VP‐1とに対して)、冷媒の供給および排出を行う。
Claims (5)
- 被処理体が載置される載置台の載置面下に冷媒を循環させる冷却システムであって、
前記載置台内に設けられ、該載置台の前記載置面を介して冷媒による熱交換を行う熱交換部と、
前記熱交換部に接続される供給ラインおよび第1排出ラインと、
前記供給ラインおよび前記第1排出ラインを介して前記熱交換部に接続されたチラーユニットと、
第2排出ラインと、
を備え、
前記熱交換部は、
前記供給ラインを介して前記チラーユニットから供給される冷媒を貯留する貯留室と、
前記貯留室に貯留された冷媒を蒸発させる蒸発室と、
を備え、
前記貯留室は、前記供給ラインを介して前記チラーユニットに接続され、複数の管を介して前記蒸発室に連通し、
前記蒸発室は、前記第1排出ラインを介して前記チラーユニットに接続され、前記載置面に亘って延在し、複数の噴射口を含み、
前記噴射口は、前記管の一端に設けられ、前記蒸発室の内壁のうち前記載置面の側にある伝熱壁に向けて前記管から冷媒が噴射されるように配置され、
複数の前記噴射口は、前記載置面上から見て該載置面内に亘って分散して配置され、
前記第2排出ラインは、
前記蒸発室と前記チラーユニットとを接続し、該蒸発室において前記噴射口の上方に延在する気体拡散領域に接続されている、
冷却システム。 - 前記第1排出ラインは、前記蒸発室において前記噴射口の下方に延在する液溜まり領域に接続されている、
請求項1に記載の冷却システム。 - 前記蒸発室は、前記載置台内において互いに離隔された複数の第1分室を備え、
前記貯留室は、前記載置台内において互いに離隔された複数の第2分室を備え、
前記第1分室は、前記噴射口を含み、前記載置面上から見て該載置面内に亘って分散して配置され、
前記第2分室は、前記管を介して前記第1分室に連通し、
前記第1排出ラインは、複数の第1枝ラインを備え、
複数の前記第1枝ラインのそれぞれは、複数の前記第1分室のそれぞれに接続され、
前記供給ラインは、複数の第2枝ラインを備え、
複数の前記第2枝ラインのそれぞれは、複数の前記第2分室のそれぞれに接続されている、
請求項1または請求項2に記載の冷却システム。 - 複数の前記第2枝ラインのそれぞれに設けられた複数のバルブと、
複数の前記バルブのそれぞれの開度を調整することによって、複数の前記第2分室のそれぞれに供給する冷媒の流量を調整する制御部と、
を更に備える、
請求項3に記載の冷却システム。 - 複数の前記チラーユニットを備え、
複数の前記チラーユニットのそれぞれは、互いに連通する一組の前記第2分室と前記第1分室とに対して冷媒の供給および排出を行う、
請求項3に記載の冷却システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018022895A JP7066438B2 (ja) | 2018-02-13 | 2018-02-13 | 冷却システム |
CN201910096781.1A CN110164792B (zh) | 2018-02-13 | 2019-01-31 | 冷却系统 |
US16/273,354 US11060770B2 (en) | 2018-02-13 | 2019-02-12 | Cooling system |
KR1020190016656A KR102678708B1 (ko) | 2018-02-13 | 2019-02-13 | 냉각 시스템 |
TW108104683A TWI783118B (zh) | 2018-02-13 | 2019-02-13 | 冷卻系統 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018022895A JP7066438B2 (ja) | 2018-02-13 | 2018-02-13 | 冷却システム |
Publications (3)
Publication Number | Publication Date |
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JP2019140270A JP2019140270A (ja) | 2019-08-22 |
JP2019140270A5 JP2019140270A5 (ja) | 2020-12-24 |
JP7066438B2 true JP7066438B2 (ja) | 2022-05-13 |
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JP2018022895A Active JP7066438B2 (ja) | 2018-02-13 | 2018-02-13 | 冷却システム |
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US (1) | US11060770B2 (ja) |
JP (1) | JP7066438B2 (ja) |
KR (1) | KR102678708B1 (ja) |
CN (1) | CN110164792B (ja) |
TW (1) | TWI783118B (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN113166941A (zh) * | 2018-11-28 | 2021-07-23 | 朗姆研究公司 | 用于衬底处理系统的包含蒸气室的基座 |
WO2021231127A1 (en) * | 2020-05-14 | 2021-11-18 | Lam Research Corporation | Evaporative cooling of electrostatic chucks |
CN112451987A (zh) * | 2020-11-23 | 2021-03-09 | 芜湖锦晔双腾新能源科技有限公司 | 一种液体呈平面喷射的加热蒸发装置 |
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US11060770B2 (en) | 2021-07-13 |
TWI783118B (zh) | 2022-11-11 |
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