JP2008027373A - 液冷ユニット用受熱器および液冷ユニット並びに電子機器 - Google Patents
液冷ユニット用受熱器および液冷ユニット並びに電子機器 Download PDFInfo
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- JP2008027373A JP2008027373A JP2006202288A JP2006202288A JP2008027373A JP 2008027373 A JP2008027373 A JP 2008027373A JP 2006202288 A JP2006202288 A JP 2006202288A JP 2006202288 A JP2006202288 A JP 2006202288A JP 2008027373 A JP2008027373 A JP 2008027373A
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- heat
- cooling unit
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/0246—Arrangements for connecting header boxes with flow lines
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】液冷ユニット用受熱器28では、筐体44は、平板状の伝熱板45上に流通路46を区画する。伝熱板45は電子部品21に受け止められる。流出ノズル47は伝熱板45の外側で流通路46の下流端に臨む。伝熱板45は電子部品21に受け止められることから、流出ノズル47は電子部品21の外側で流通路46に接続されることができる。その結果、流出ノズル47が流通路46上で直接に流通路46に臨む場合に比べて、筐体44の厚みの増大は回避されることができる。
【選択図】図5
Description
Claims (10)
- 電子部品に受け止められる平板状の伝熱板上に流通路を区画する筐体と、筐体の外側から流通路の上流端に臨む流入ノズルと、伝熱板の外側で筐体の外側から流通路の下流端に臨む流出ノズルとを備えることを特徴とする液冷ユニット用受熱器。
- 請求項1に記載の液冷ユニット用受熱器において、前記筐体は、前記伝熱板から窪んで、前記流通路よりも低い空間を区画し、前記流出ノズルは前記空間に臨むことを特徴とする液冷ユニット用受熱器。
- 請求項1に記載の液冷ユニット用受熱器において、前記流入ノズルは前記伝熱板の外側で前記流通路の上流端に臨むことを特徴とする液冷ユニット用受熱器。
- 請求項3に記載の液冷ユニット用受熱器において、前記筐体は、前記伝熱板から窪んで、前記流通路よりも低い空間を区画し、前記流入ノズルは前記空間に臨むことを特徴とする液冷ユニット用受熱器。
- 平板状の伝熱板で電子部品に受け止められる受熱器と、受熱器から一巡する循環経路と、循環経路に組み入れられて、冷媒から熱を奪う熱交換器とを備え、前記受熱器は、伝熱板上に流通路を区画する筐体と、筐体の外側から流通路の上流端に臨む流入ノズルと、伝熱板の外側で筐体の外側から流通路の下流端に臨む流出ノズルとを備えることを特徴とする液冷ユニット。
- 請求項5に記載の液冷ユニットにおいて、前記筐体は、前記伝熱板から窪んで、前記流通路よりも低い空間を区画し、前記流出ノズルは前記空間に臨むことを特徴とする液冷ユニット。
- 請求項5に記載の液冷ユニットにおいて、前記流入ノズルは前記伝熱板の外側で前記流通路の上流端に臨むことを特徴とする液冷ユニット。
- 請求項7に記載の液冷ユニットにおいて、前記筐体は、前記伝熱板から窪んで、前記流通路よりも低い空間を区画し、前記流入ノズルは前記空間に臨むことを特徴とする液冷ユニット。
- 電子部品と、平板状の伝熱板で電子部品に受け止められる受熱器と、受熱器から一巡する循環経路と、循環経路に組み入れられて、冷媒から熱を奪う熱交換器とを備え、前記受熱器は、伝熱板上に流通路を区画する筐体と、筐体の外側から流通路の上流端に臨む流入ノズルと、伝熱板の外側で筐体の外側から流通路の下流端に臨む流出ノズルとを備えることを特徴とする電子機器。
- 請求項9に記載の電子機器において、前記筐体は、前記伝熱板から窪んで、前記流通路よりも低い空間を区画し、前記流出ノズルは前記空間に臨むことを特徴とする電子機器。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006202288A JP5283836B2 (ja) | 2006-07-25 | 2006-07-25 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
TW096126931A TWI377900B (en) | 2006-07-25 | 2007-07-24 | Liquid cooling unit and heat receiver therefor |
EP20070113054 EP1890216A3 (en) | 2006-07-25 | 2007-07-24 | Liquid cooling unit and heat receiver therefor |
US11/878,621 US8050036B2 (en) | 2006-07-25 | 2007-07-25 | Liquid cooling unit and heat receiver therefor |
KR1020070074559A KR100899368B1 (ko) | 2006-07-25 | 2007-07-25 | 액체 냉각 유닛용 수열기, 액체 냉각 유닛 및 전자 기기 |
CNA2007101390885A CN101115374A (zh) | 2006-07-25 | 2007-07-25 | 液体冷却单元和用于该液体冷却单元的热接收器 |
Applications Claiming Priority (1)
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JP2006202288A JP5283836B2 (ja) | 2006-07-25 | 2006-07-25 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
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JP2008027373A true JP2008027373A (ja) | 2008-02-07 |
JP5283836B2 JP5283836B2 (ja) | 2013-09-04 |
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JP2006202288A Expired - Fee Related JP5283836B2 (ja) | 2006-07-25 | 2006-07-25 | 液冷ユニット用受熱器および液冷ユニット並びに電子機器 |
Country Status (6)
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US (1) | US8050036B2 (ja) |
EP (1) | EP1890216A3 (ja) |
JP (1) | JP5283836B2 (ja) |
KR (1) | KR100899368B1 (ja) |
CN (1) | CN101115374A (ja) |
TW (1) | TWI377900B (ja) |
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US10123464B2 (en) | 2012-02-09 | 2018-11-06 | Hewlett Packard Enterprise Development Lp | Heat dissipating system |
WO2013137847A1 (en) | 2012-03-12 | 2013-09-19 | Hewlett-Packard Development Company, L.P. | Liquid temperature control cooling |
WO2014051604A1 (en) | 2012-09-28 | 2014-04-03 | Hewlett-Packard Development Company, L.P. | Cooling assembly |
CN104756618B (zh) | 2012-10-31 | 2017-07-21 | 慧与发展有限责任合伙企业 | 模块式机架系统 |
CN104919914B (zh) | 2013-01-31 | 2017-10-27 | 慧与发展有限责任合伙企业 | 用于提供液体冷却的组件、系统以及移除热量的方法 |
JP6155988B2 (ja) * | 2013-09-02 | 2017-07-05 | 富士通株式会社 | 情報処理装置 |
US20160123637A1 (en) * | 2014-10-29 | 2016-05-05 | Alliance For Sustainable Energy, Llc | Two-phase heat exchanger for cooling electrical components |
CN105097735B (zh) * | 2015-09-09 | 2017-09-08 | 江苏科技大学 | 一种采用脉动流及泡沫金属板强化散热装置 |
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JP6396533B1 (ja) * | 2017-04-26 | 2018-09-26 | レノボ・シンガポール・プライベート・リミテッド | プレート型熱輸送装置、電子機器及びプレート型熱輸送装置の製造方法 |
CN108509001B (zh) * | 2018-04-02 | 2021-01-15 | 联想(北京)有限公司 | 电子设备及其水冷服务器 |
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- 2007-07-24 EP EP20070113054 patent/EP1890216A3/en not_active Ceased
- 2007-07-25 KR KR1020070074559A patent/KR100899368B1/ko not_active IP Right Cessation
- 2007-07-25 CN CNA2007101390885A patent/CN101115374A/zh active Pending
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Also Published As
Publication number | Publication date |
---|---|
EP1890216A3 (en) | 2010-12-08 |
KR100899368B1 (ko) | 2009-05-27 |
JP5283836B2 (ja) | 2013-09-04 |
TW200819034A (en) | 2008-04-16 |
US20080024989A1 (en) | 2008-01-31 |
KR20080010333A (ko) | 2008-01-30 |
US8050036B2 (en) | 2011-11-01 |
TWI377900B (en) | 2012-11-21 |
EP1890216A2 (en) | 2008-02-20 |
CN101115374A (zh) | 2008-01-30 |
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