JP2008016413A - 配線基板の製造方法、電子源の製造方法、画像表示装置の製造方法、画像再生装置 - Google Patents

配線基板の製造方法、電子源の製造方法、画像表示装置の製造方法、画像再生装置 Download PDF

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Publication number
JP2008016413A
JP2008016413A JP2006189282A JP2006189282A JP2008016413A JP 2008016413 A JP2008016413 A JP 2008016413A JP 2006189282 A JP2006189282 A JP 2006189282A JP 2006189282 A JP2006189282 A JP 2006189282A JP 2008016413 A JP2008016413 A JP 2008016413A
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JP
Japan
Prior art keywords
groove
wiring
manufacturing
region
region adjacent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006189282A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008016413A5 (enExample
Inventor
Masafumi Moriya
雅文 守屋
Kazuya Ishiwatari
和也 石渡
Yoshio Suzuki
義勇 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2006189282A priority Critical patent/JP2008016413A/ja
Priority to US11/761,923 priority patent/US7866039B2/en
Priority to KR1020070064152A priority patent/KR100906523B1/ko
Priority to CNB2007101122788A priority patent/CN100550252C/zh
Publication of JP2008016413A publication Critical patent/JP2008016413A/ja
Publication of JP2008016413A5 publication Critical patent/JP2008016413A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02—Main electrodes
    • H01J1/30—Cold cathodes, e.g. field-emissive cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02—Main electrodes
    • H01J1/30—Cold cathodes, e.g. field-emissive cathode
    • H01J1/316—Cold cathodes, e.g. field-emissive cathode having an electric field parallel to the surface, e.g. thin film cathodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
    • H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2006189282A 2006-07-10 2006-07-10 配線基板の製造方法、電子源の製造方法、画像表示装置の製造方法、画像再生装置 Withdrawn JP2008016413A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006189282A JP2008016413A (ja) 2006-07-10 2006-07-10 配線基板の製造方法、電子源の製造方法、画像表示装置の製造方法、画像再生装置
US11/761,923 US7866039B2 (en) 2006-07-10 2007-06-12 Method for manufacturing wiring board for an image display
KR1020070064152A KR100906523B1 (ko) 2006-07-10 2007-06-28 배선기판의 제조방법, 전자원의 제조방법, 화상표시장치의제조방법 및 화상재생장치
CNB2007101122788A CN100550252C (zh) 2006-07-10 2007-06-29 布线板、电子源以及图像显示设备的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006189282A JP2008016413A (ja) 2006-07-10 2006-07-10 配線基板の製造方法、電子源の製造方法、画像表示装置の製造方法、画像再生装置

Publications (2)

Publication Number Publication Date
JP2008016413A true JP2008016413A (ja) 2008-01-24
JP2008016413A5 JP2008016413A5 (enExample) 2009-08-20

Family

ID=38917887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006189282A Withdrawn JP2008016413A (ja) 2006-07-10 2006-07-10 配線基板の製造方法、電子源の製造方法、画像表示装置の製造方法、画像再生装置

Country Status (4)

Country Link
US (1) US7866039B2 (enExample)
JP (1) JP2008016413A (enExample)
KR (1) KR100906523B1 (enExample)
CN (1) CN100550252C (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007335241A (ja) * 2006-06-15 2007-12-27 Canon Inc 配線基板、電子源、画像表示装置及び画像再生装置
JP4065551B2 (ja) * 2006-07-03 2008-03-26 キヤノン株式会社 電子源、画像表示装置、画像再生装置、配線基板、及び配線基板の製造方法
DE102019201347B3 (de) 2019-02-01 2020-06-18 Lpkf Laser & Electronics Ag Herstellung von metallischen Leiterbahnen an Glas

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2325195A1 (fr) * 1975-09-18 1977-04-15 Radiotechnique Compelec Ensemble monolithique semiconducteur electroluminescent
JP2737563B2 (ja) * 1992-08-18 1998-04-08 三菱電機株式会社 半導体発光装置
JPH09265893A (ja) * 1996-03-29 1997-10-07 Canon Inc 電子放出素子と電子源及び画像形成装置と電子放出素子の製法
JP3548498B2 (ja) * 2000-05-08 2004-07-28 キヤノン株式会社 電子源形成用基板、該基板を用いた電子源並びに画像表示装置
JP3530800B2 (ja) * 2000-05-08 2004-05-24 キヤノン株式会社 電子源形成用基板、該基板を用いた電子源並びに画像表示装置
JP2001319564A (ja) * 2000-05-08 2001-11-16 Canon Inc 電子源形成用基板、該基板を用いた電子源並びに画像表示装置
JP3703428B2 (ja) * 2000-12-18 2005-10-05 キヤノン株式会社 電子源基板および画像形成装置の製造方法
JP2002203475A (ja) 2001-01-04 2002-07-19 Toshiba Corp 電子源基板、電子源基板の製造方法、および電子源基板を備えた画像表示装置
US6853117B2 (en) * 2001-08-02 2005-02-08 Canon Kabushiki Kaisha Electron source and producing method therefor
US6653232B2 (en) * 2001-08-03 2003-11-25 Canon Kabushiki Kaisha Method of manufacturing member pattern and method of manufacturing wiring, circuit substrate, electron source, and image-forming apparatus
US6866989B2 (en) * 2001-09-07 2005-03-15 Canon Kabushiki Kaisha Method for forming patterned insulating elements and methods for making electron source and image display device
US6902455B2 (en) * 2001-09-27 2005-06-07 Canon Kabushiki Kaisha Method of manufacturing member pattern, electron source, and image display device
US6903504B2 (en) * 2002-01-29 2005-06-07 Canon Kabushiki Kaisha Electron source plate, image-forming apparatus using the same, and fabricating method thereof
JP2004146796A (ja) * 2002-09-30 2004-05-20 Seiko Epson Corp 膜パターンの形成方法、薄膜製造装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体
US7064475B2 (en) * 2002-12-26 2006-06-20 Canon Kabushiki Kaisha Electron source structure covered with resistance film
JP4192737B2 (ja) * 2003-07-15 2008-12-10 セイコーエプソン株式会社 層パターン製造方法、配線製造方法、電子機器の製造方法
JP2005190769A (ja) 2003-12-25 2005-07-14 Canon Inc 電子源基板、これを用いた画像表示装置およびこれらの製造方法
US7458872B2 (en) * 2004-01-05 2008-12-02 Canon Kabushiki Kaisha Method of manufacturing electron-emitting device, electron source, and image display device
US7285428B2 (en) * 2004-02-02 2007-10-23 Canon Kabushiki Kaisha Production method of electron source and image display
JP4065551B2 (ja) * 2006-07-03 2008-03-26 キヤノン株式会社 電子源、画像表示装置、画像再生装置、配線基板、及び配線基板の製造方法
JP2008016226A (ja) * 2006-07-03 2008-01-24 Canon Inc 電子源、画像表示装置、画像再生装置、配線基板、及び電子デバイス

Also Published As

Publication number Publication date
KR20080005850A (ko) 2008-01-15
KR100906523B1 (ko) 2009-07-07
US20080005899A1 (en) 2008-01-10
CN100550252C (zh) 2009-10-14
US7866039B2 (en) 2011-01-11
CN101106051A (zh) 2008-01-16

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