KR100906523B1 - 배선기판의 제조방법, 전자원의 제조방법, 화상표시장치의제조방법 및 화상재생장치 - Google Patents

배선기판의 제조방법, 전자원의 제조방법, 화상표시장치의제조방법 및 화상재생장치 Download PDF

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KR100906523B1
KR100906523B1 KR1020070064152A KR20070064152A KR100906523B1 KR 100906523 B1 KR100906523 B1 KR 100906523B1 KR 1020070064152 A KR1020070064152 A KR 1020070064152A KR 20070064152 A KR20070064152 A KR 20070064152A KR 100906523 B1 KR100906523 B1 KR 100906523B1
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South Korea
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region
wiring
manufacturing
groove
area
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KR20080005850A (ko
Inventor
마사후미 모리야
카즈야 이시와타
요시오 스즈키
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캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02—Main electrodes
    • H01J1/30—Cold cathodes, e.g. field-emissive cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02—Main electrodes
    • H01J1/30—Cold cathodes, e.g. field-emissive cathode
    • H01J1/316—Cold cathodes, e.g. field-emissive cathode having an electric field parallel to the surface, e.g. thin film cathodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
    • H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020070064152A 2006-07-10 2007-06-28 배선기판의 제조방법, 전자원의 제조방법, 화상표시장치의제조방법 및 화상재생장치 Expired - Fee Related KR100906523B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006189282A JP2008016413A (ja) 2006-07-10 2006-07-10 配線基板の製造方法、電子源の製造方法、画像表示装置の製造方法、画像再生装置
JPJP-P-2006-00189282 2006-07-10

Publications (2)

Publication Number Publication Date
KR20080005850A KR20080005850A (ko) 2008-01-15
KR100906523B1 true KR100906523B1 (ko) 2009-07-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070064152A Expired - Fee Related KR100906523B1 (ko) 2006-07-10 2007-06-28 배선기판의 제조방법, 전자원의 제조방법, 화상표시장치의제조방법 및 화상재생장치

Country Status (4)

Country Link
US (1) US7866039B2 (enExample)
JP (1) JP2008016413A (enExample)
KR (1) KR100906523B1 (enExample)
CN (1) CN100550252C (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007335241A (ja) * 2006-06-15 2007-12-27 Canon Inc 配線基板、電子源、画像表示装置及び画像再生装置
JP4065551B2 (ja) * 2006-07-03 2008-03-26 キヤノン株式会社 電子源、画像表示装置、画像再生装置、配線基板、及び配線基板の製造方法
DE102019201347B3 (de) 2019-02-01 2020-06-18 Lpkf Laser & Electronics Ag Herstellung von metallischen Leiterbahnen an Glas

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09265893A (ja) * 1996-03-29 1997-10-07 Canon Inc 電子放出素子と電子源及び画像形成装置と電子放出素子の製法

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FR2325195A1 (fr) * 1975-09-18 1977-04-15 Radiotechnique Compelec Ensemble monolithique semiconducteur electroluminescent
JP2737563B2 (ja) * 1992-08-18 1998-04-08 三菱電機株式会社 半導体発光装置
JP3548498B2 (ja) * 2000-05-08 2004-07-28 キヤノン株式会社 電子源形成用基板、該基板を用いた電子源並びに画像表示装置
JP3530800B2 (ja) * 2000-05-08 2004-05-24 キヤノン株式会社 電子源形成用基板、該基板を用いた電子源並びに画像表示装置
JP2001319564A (ja) * 2000-05-08 2001-11-16 Canon Inc 電子源形成用基板、該基板を用いた電子源並びに画像表示装置
JP3703428B2 (ja) * 2000-12-18 2005-10-05 キヤノン株式会社 電子源基板および画像形成装置の製造方法
JP2002203475A (ja) 2001-01-04 2002-07-19 Toshiba Corp 電子源基板、電子源基板の製造方法、および電子源基板を備えた画像表示装置
US6853117B2 (en) * 2001-08-02 2005-02-08 Canon Kabushiki Kaisha Electron source and producing method therefor
US6653232B2 (en) * 2001-08-03 2003-11-25 Canon Kabushiki Kaisha Method of manufacturing member pattern and method of manufacturing wiring, circuit substrate, electron source, and image-forming apparatus
US6866989B2 (en) * 2001-09-07 2005-03-15 Canon Kabushiki Kaisha Method for forming patterned insulating elements and methods for making electron source and image display device
US6902455B2 (en) * 2001-09-27 2005-06-07 Canon Kabushiki Kaisha Method of manufacturing member pattern, electron source, and image display device
US6903504B2 (en) * 2002-01-29 2005-06-07 Canon Kabushiki Kaisha Electron source plate, image-forming apparatus using the same, and fabricating method thereof
JP2004146796A (ja) * 2002-09-30 2004-05-20 Seiko Epson Corp 膜パターンの形成方法、薄膜製造装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体
US7064475B2 (en) * 2002-12-26 2006-06-20 Canon Kabushiki Kaisha Electron source structure covered with resistance film
JP4192737B2 (ja) * 2003-07-15 2008-12-10 セイコーエプソン株式会社 層パターン製造方法、配線製造方法、電子機器の製造方法
JP2005190769A (ja) 2003-12-25 2005-07-14 Canon Inc 電子源基板、これを用いた画像表示装置およびこれらの製造方法
US7458872B2 (en) * 2004-01-05 2008-12-02 Canon Kabushiki Kaisha Method of manufacturing electron-emitting device, electron source, and image display device
US7285428B2 (en) * 2004-02-02 2007-10-23 Canon Kabushiki Kaisha Production method of electron source and image display
JP4065551B2 (ja) * 2006-07-03 2008-03-26 キヤノン株式会社 電子源、画像表示装置、画像再生装置、配線基板、及び配線基板の製造方法
JP2008016226A (ja) * 2006-07-03 2008-01-24 Canon Inc 電子源、画像表示装置、画像再生装置、配線基板、及び電子デバイス

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Publication number Priority date Publication date Assignee Title
JPH09265893A (ja) * 1996-03-29 1997-10-07 Canon Inc 電子放出素子と電子源及び画像形成装置と電子放出素子の製法

Also Published As

Publication number Publication date
KR20080005850A (ko) 2008-01-15
JP2008016413A (ja) 2008-01-24
US20080005899A1 (en) 2008-01-10
CN100550252C (zh) 2009-10-14
US7866039B2 (en) 2011-01-11
CN101106051A (zh) 2008-01-16

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