JP2007529894A5 - - Google Patents

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Publication number
JP2007529894A5
JP2007529894A5 JP2007503893A JP2007503893A JP2007529894A5 JP 2007529894 A5 JP2007529894 A5 JP 2007529894A5 JP 2007503893 A JP2007503893 A JP 2007503893A JP 2007503893 A JP2007503893 A JP 2007503893A JP 2007529894 A5 JP2007529894 A5 JP 2007529894A5
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Japan
Prior art keywords
functional element
forming
integrated circuit
circuit functional
epitaxial layer
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JP2007503893A
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Japanese (ja)
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JP2007529894A (ja
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Priority claimed from US10/802,067 external-priority patent/US7126214B2/en
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Publication of JP2007529894A publication Critical patent/JP2007529894A/ja
Publication of JP2007529894A5 publication Critical patent/JP2007529894A5/ja
Pending legal-status Critical Current

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JP2007503893A 2004-03-16 2004-12-14 ダイ素子が積層された再構成可能なプロセッサモジュール Pending JP2007529894A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/802,067 US7126214B2 (en) 2001-12-05 2004-03-16 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
PCT/US2004/041791 WO2005094240A2 (en) 2004-03-16 2004-12-14 Reconfigurable processor module with stacked die elements

Publications (2)

Publication Number Publication Date
JP2007529894A JP2007529894A (ja) 2007-10-25
JP2007529894A5 true JP2007529894A5 (enExample) 2008-01-31

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JP2007503893A Pending JP2007529894A (ja) 2004-03-16 2004-12-14 ダイ素子が積層された再構成可能なプロセッサモジュール

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US (2) US7126214B2 (enExample)
EP (1) EP1726042A4 (enExample)
JP (1) JP2007529894A (enExample)
WO (1) WO2005094240A2 (enExample)

Families Citing this family (346)

* Cited by examiner, † Cited by third party
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