JP2007529804A - 無線周波数応答タグに使用するためのポリマーフィルム基板 - Google Patents
無線周波数応答タグに使用するためのポリマーフィルム基板 Download PDFInfo
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- JP2007529804A JP2007529804A JP2007503407A JP2007503407A JP2007529804A JP 2007529804 A JP2007529804 A JP 2007529804A JP 2007503407 A JP2007503407 A JP 2007503407A JP 2007503407 A JP2007503407 A JP 2007503407A JP 2007529804 A JP2007529804 A JP 2007529804A
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Classifications
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- H04B5/72—
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B13/00—Burglar, theft or intruder alarms
- G08B13/22—Electrical actuation
- G08B13/24—Electrical actuation by interference with electromagnetic field distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer
Abstract
Description
(ii)アンテナの導電性材料を、基板のヒートシール可能な表面の少なくとも一部分に直接配設するステップ、
(iii)ヒートシール可能な基板と導電性材料の間でヒートシールを行うステップ、および
(iv)場合により、導電性材料と電気的に連絡しているデータ搬送手段を提供するステップ。
オーブン1 170 180 170
オーブン2 170 180 170
オーブン3 170 180 170
オーブン4 165 180 165
熱安定化ステップ中のフィルムのライン速度は、15m/分であった。フィルム(元のロール幅1360mm)にかけた張力は、24〜25Nであった。
Claims (30)
- ポリエステル層を含み、収縮率が190℃で30分かけて5%未満であるヒートシール基板と、前記基板のヒートシール表面と直接接触している導電性材料のパターンを含むアンテナとを含むことを特徴とする、無線周波数応答タグ。
- 前記収縮率は、3%未満であることを特徴とする、請求項1に記載のタグ。
- 前記基板は、単層基板であることを特徴とする、請求項1または2に記載のタグ。
- 前記基板は、コポリエステルを含むことを特徴とする、請求項1、2、または3に記載のタグ。
- 前記コポリエステルは、エチレングリコール、テレフタル酸、およびイソフタル酸から誘導されることを特徴とする、請求項4に記載のタグ。
- 前記基板は、ヒートシール可能な層およびベース層を含むことを特徴とする、請求項1または2に記載のタグ。
- 前記ベース層は、ポリエチレンテレフタレートを含むことを特徴とする、請求項6に記載のタグ。
- 前記ヒートシール可能な層は、コポリエステルであることを特徴とする、請求項6または7に記載のタグ。
- 前記コポリエステルは、エチレングリコール、テレフタル酸、およびイソフタル酸から誘導されることを特徴とする、請求項8に記載のタグ。
- 前記コポリエステルは、テレフタル酸、エチレングリコール、および1,4−シクロヘキサンジメタノールから誘導されることを特徴とする、請求項8に記載のタグ。
- 1,4−シクロヘキサンジメタノールとエチレングリコールのモル比は、30:70から35:65の範囲内にあることを特徴とする、請求項10に記載のタグ。
- 前記ヒートシール可能な層およびベース層は、同時押し出しされることを特徴とする、請求項6から11のいずれかに記載のタグ。
- 前記コポリエステルは、エチレングリコール、テレフタル酸、およびイソフタル酸から誘導され、テレフタル酸成分とイソフタル酸成分のモル比が、65:35から85:15の範囲内にあることを特徴とする、請求項5から9に記載のタグ。
- 前記コポリエステルは、テレフタル酸、脂肪族ジカルボン酸、およびグリコールから誘導されることを特徴とする、請求項8に記載のタグ。
- 前記コポリエステルは、テレフタル酸、アゼライン酸、およびエチレングリコールから誘導されることを特徴とする、請求項8に記載のタグ。
- 前記コポリエステルは、エチレングリコールと、テレフタル酸約55%およびアゼライン酸約45%とのコポリエステルであることを特徴とする、請求項15に記載のタグ。
- 前記ヒートシール可能な層は、エチレン酢酸ビニル(EVA)を含むことを特徴とする、請求項5または6に記載のタグ。
- 前記ヒートシール可能な層は、ベース層上にコーティングされることを特徴とする、請求項6、7、8または14から17のいずれかに記載のタグ。
- 前記収縮率は、1%未満であることを特徴とする、請求項14から18のいずれかに記載のタグ。
- 前記収縮率は、0.5%未満であることを特徴とする、請求項14から18のいずれかに記載のタグ。
- 前記導電性材料は、金属材料を含むことを特徴とする、前記請求項のいずれかに記載のタグ。
- 前記導電性材料は、銅を含むことを特徴とする、前記請求項のいずれかに記載のタグ。
- さらに、前記アンテナに電気的に連絡しているデータ搬送手段を含むことを特徴とする、前記請求項のいずれかに記載のタグ。
- 基板と、導電性材料のパターンを含むアンテナと、場合によってはデータ搬送手段とを含む無線周波数応答タグの製造方法であって、以下のステップ、
(i)ポリエステル層を含み、収縮率が190℃で30分かけて5%未満であるヒートシール可能な基板を提供するステップと、
(ii)前記アンテナの導電性材料を、前記基板のヒートシール可能な表面の少なくとも一部分上に直接配設するステップと、
(iii)前記ヒートシール可能な基板と導電性材料との間でヒートシールを行うステップと、
(iv)場合によって、前記導電性材料と電気的に連絡しているデータ搬送手段を提供するステップと
を含むことを特徴とする方法。 - ステップ(iii)の後、さらに、前記導電性材料にパターンを形成するステップを含むことを特徴とする、請求項24に記載の方法。
- 基板としてのフィルムと、前記フィルムのヒートシール表面に直接接触している導電性材料のパターンを含むアンテナと、場合によっては、前記アンテナと電気的に連絡しているデータ搬送手段とを含む無線周波数応答タグの製造における、ポリエステル層を含み、収縮率が190℃で30分かけて5%未満であるヒートシールフィルムの基板としての使用。
- 基板のヒートシール表面と直接接触している導電性材料の層と、前記ヒートシールフィルムとを含む、RF応答タグの製造における、複合フィルムの曲げ亀裂を低減するための、ポリエステル層を含み、収縮率が190℃で30分かけて5%未満である前駆物質として適したヒートシールフィルムの使用。
- ヒートシール基板と、前記基板のヒートシール表面と直接接触している前記導電性材料のパターンを含むアンテナと、場合によっては、前記アンテナと電気的に連絡しているデータ搬送手段とを含む無線周波数応答タグの製造における、導電性材料の層と、ポリエステル層を含み、収縮率が190℃で30分かけて5%未満であるヒートシール基板とを含む複合フィルムの前駆物質としての使用。
- 無線周波数応答タグの製造において前駆物質として使用するのに適しており、基板のヒートシール表面と直接接触している導電性材料の層と、ポリエステル層を含み、収縮率が190℃で30分かけて5%未満であるヒートシール基板とを含むことを特徴とする複合フィルム。
- 前記導電性材料と前記基板の間のヒートシールの接着強度は、少なくとも200g/25mm2であることを特徴とする、請求項29に記載の複合フィルム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0405883.0A GB0405883D0 (en) | 2004-03-16 | 2004-03-16 | Polymeric film substrate |
GB0405883.0 | 2004-03-16 | ||
PCT/GB2005/000999 WO2005091213A1 (en) | 2004-03-16 | 2005-03-16 | Polymeric film substrate for use in radio-frequency responsive tags |
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JP2007529804A true JP2007529804A (ja) | 2007-10-25 |
JP4852034B2 JP4852034B2 (ja) | 2012-01-11 |
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US (2) | US20080211629A1 (ja) |
EP (1) | EP1725978B1 (ja) |
JP (1) | JP4852034B2 (ja) |
KR (1) | KR101118853B1 (ja) |
CN (1) | CN100583133C (ja) |
DE (1) | DE602005016655D1 (ja) |
GB (1) | GB0405883D0 (ja) |
WO (1) | WO2005091213A1 (ja) |
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US8461992B2 (en) * | 2006-05-12 | 2013-06-11 | Solstice Medical, Llc | RFID coupler for metallic implements |
DE102006030913A1 (de) | 2006-06-29 | 2008-01-03 | Inotec Barcode Security Gmbh | In-Mold-Flächenelement |
JP5087941B2 (ja) * | 2007-02-07 | 2012-12-05 | 東洋製罐株式会社 | Icタグを備えたプラスチック成形品 |
US8514060B2 (en) * | 2008-05-21 | 2013-08-20 | Mitomo Corporation | Wireless identification tag |
US20110175706A1 (en) * | 2010-01-19 | 2011-07-21 | Userstar Information System Co., Ltd. | Radio frequency identification tag |
CN105008949A (zh) * | 2012-10-09 | 2015-10-28 | Mc10股份有限公司 | 与服装整合的保形电子装置 |
US20140186606A1 (en) * | 2012-12-31 | 2014-07-03 | Toray Plastics (America), Inc. | Balanced and low heat shrinkage sequentially biaxially oriented polyethylene terephthalate film and process for producing the same |
WO2015042820A1 (en) * | 2013-09-26 | 2015-04-02 | Dow Global Technologies Llc | A polymeric blend composition |
DE102017117328A1 (de) * | 2017-07-31 | 2019-01-31 | Mitsubishi Polyester Film Gmbh | Peelfähige Polyesterfolie, Verfahren zu ihrer Herstellung und ihre Verwendung |
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- 2005-03-16 CN CN200580015010A patent/CN100583133C/zh not_active Expired - Fee Related
- 2005-03-16 DE DE602005016655T patent/DE602005016655D1/de active Active
- 2005-03-16 US US10/592,898 patent/US20080211629A1/en not_active Abandoned
- 2005-03-16 EP EP05718047A patent/EP1725978B1/en not_active Expired - Fee Related
- 2005-03-16 WO PCT/GB2005/000999 patent/WO2005091213A1/en active Application Filing
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Also Published As
Publication number | Publication date |
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KR20070012405A (ko) | 2007-01-25 |
EP1725978B1 (en) | 2009-09-16 |
GB0405883D0 (en) | 2004-04-21 |
US20080211629A1 (en) | 2008-09-04 |
JP4852034B2 (ja) | 2012-01-11 |
CN100583133C (zh) | 2010-01-20 |
US20140283971A1 (en) | 2014-09-25 |
WO2005091213A1 (en) | 2005-09-29 |
CN1950837A (zh) | 2007-04-18 |
EP1725978A1 (en) | 2006-11-29 |
DE602005016655D1 (de) | 2009-10-29 |
KR101118853B1 (ko) | 2012-03-16 |
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