JP2007515782A5 - - Google Patents

Download PDF

Info

Publication number
JP2007515782A5
JP2007515782A5 JP2006535939A JP2006535939A JP2007515782A5 JP 2007515782 A5 JP2007515782 A5 JP 2007515782A5 JP 2006535939 A JP2006535939 A JP 2006535939A JP 2006535939 A JP2006535939 A JP 2006535939A JP 2007515782 A5 JP2007515782 A5 JP 2007515782A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006535939A
Other versions
JP4943852B2 (ja
JP2007515782A (ja
Filing date
Publication date
Priority claimed from DE10349963A external-priority patent/DE10349963A1/de
Application filed filed Critical
Publication of JP2007515782A publication Critical patent/JP2007515782A/ja
Publication of JP2007515782A5 publication Critical patent/JP2007515782A5/ja
Application granted granted Critical
Publication of JP4943852B2 publication Critical patent/JP4943852B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006535939A 2003-10-24 2004-10-19 少なくとも一つの電気的コンポーネントを有するフィルム及びその生産プロセス Expired - Fee Related JP4943852B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10349963A DE10349963A1 (de) 2003-10-24 2003-10-24 Verfahren zur Herstellung einer Folie
DE10349963.6 2003-10-24
PCT/DE2004/002319 WO2005039868A2 (de) 2003-10-24 2004-10-19 Strukturierung von elektrischen funktionsschichten mittels einer transferfolie und strukturierung des klebers

Publications (3)

Publication Number Publication Date
JP2007515782A JP2007515782A (ja) 2007-06-14
JP2007515782A5 true JP2007515782A5 (ja) 2011-06-23
JP4943852B2 JP4943852B2 (ja) 2012-05-30

Family

ID=34485079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006535939A Expired - Fee Related JP4943852B2 (ja) 2003-10-24 2004-10-19 少なくとも一つの電気的コンポーネントを有するフィルム及びその生産プロセス

Country Status (14)

Country Link
US (1) US7700402B2 (ja)
EP (1) EP1676330B1 (ja)
JP (1) JP4943852B2 (ja)
KR (1) KR101193315B1 (ja)
CN (1) CN1871721B (ja)
AT (1) ATE469442T1 (ja)
AU (1) AU2004283127B2 (ja)
BR (1) BRPI0415539B1 (ja)
CA (1) CA2542360C (ja)
DE (2) DE10349963A1 (ja)
ES (1) ES2346655T3 (ja)
RU (1) RU2346359C2 (ja)
TW (1) TWI383459B (ja)
WO (1) WO2005039868A2 (ja)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004004713A1 (de) * 2004-01-30 2005-09-01 Leonhard Kurz Gmbh & Co. Kg Sicherheitselement mit partieller Magnetschicht
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
KR101368748B1 (ko) 2004-06-04 2014-03-05 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치
US20070015079A1 (en) * 2005-07-18 2007-01-18 Wolk Martin B Laser induced thermal imaging business models and methods
DE102006012708A1 (de) * 2006-03-17 2007-09-20 Polyic Gmbh & Co. Kg Verfahren zur Herstellung eines aktiven oder passiven elektrischen Bauteils sowie elektrisches Bauteil
US7744717B2 (en) 2006-07-17 2010-06-29 E. I. Du Pont De Nemours And Company Process for enhancing the resolution of a thermally transferred pattern
WO2008009447A2 (de) * 2006-07-21 2008-01-24 Leonhard Kurz Stiftung & Co. Kg Mehrschichtkörper mit elektrisch leitfähiger polymerschicht und verfahren zur dessen herstellung
DE102006033887B4 (de) * 2006-07-21 2015-04-09 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung eines Mehrschichtkörpers mit leitfähiger Polymerschicht
DE102006037433B4 (de) * 2006-08-09 2010-08-19 Ovd Kinegram Ag Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper
TWI438827B (zh) * 2006-09-20 2014-05-21 Univ Illinois 用於製造可印刷半導體結構、裝置及裝置元件的脫離對策
US20080131590A1 (en) * 2006-12-04 2008-06-05 Illinois Tool Works Inc. Method for printing electrically conductive circuits
KR101519038B1 (ko) 2007-01-17 2015-05-11 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 프린팅­기반 어셈블리에 의해 제조되는 광학 시스템
AT10029U1 (de) * 2007-02-16 2008-07-15 Austria Tech & System Tech Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte
DE102007032250B3 (de) * 2007-07-11 2008-12-18 ROWO Coating Gesellschaft für Beschichtung mbH Vorrichtung zum Detektieren von Flüssigkeitslecks
GB2453766A (en) * 2007-10-18 2009-04-22 Novalia Ltd Method of fabricating an electronic device
DE102007051930A1 (de) 2007-10-29 2009-04-30 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung einer Leiterbahnstruktur
DE102008034616A1 (de) 2008-07-25 2010-02-04 Leonhard Kurz Stiftung & Co. Kg Prägefolie und deren Verwendung sowie Verfahren zur Herstellung von Strukturelementen aus Kupfer
DE102008047096A1 (de) 2008-09-12 2010-03-25 Leonhard Kurz Stiftung & Co. Kg Drucktuch für ein Kaltfolientransferverfahren
DE102008047095A1 (de) * 2008-09-12 2010-03-18 Leonhard Kurz Stiftung & Co. Kg Transferfolie zur Verwendung in einem Kaltfolientransferverfahren
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
EP2349440B1 (en) 2008-10-07 2019-08-21 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
CN101428978B (zh) * 2008-12-09 2011-01-26 深圳市大族激光科技股份有限公司 一种陶瓷或玻璃的烤花方法
US20100209843A1 (en) * 2009-02-16 2010-08-19 E. I. Du Pont De Nemours And Company Process for thick film circuit patterning
KR101706915B1 (ko) 2009-05-12 2017-02-15 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 변형가능 및 반투과 디스플레이를 위한 초박형, 미세구조 무기발광다이오드의 인쇄 어셈블리
KR101052219B1 (ko) * 2009-05-29 2011-07-27 주식회사 선경홀로그램 자외선 경화 접착제에 의한 콜드 스템핑 시트 및 그 제조방법
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
EP2513953B1 (en) 2009-12-16 2017-10-18 The Board of Trustees of the University of Illionis Electrophysiology using conformal electronics
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
JP5751728B2 (ja) 2010-03-17 2015-07-22 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 生体吸収性基板上の埋め込み型バイオメディカルデバイス
KR20120065136A (ko) 2010-12-10 2012-06-20 삼성모바일디스플레이주식회사 유기 발광 표시 장치와 이의 제조 방법 및 이의 제조 설비
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
JP2014523633A (ja) 2011-05-27 2014-09-11 エムシー１０ インコーポレイテッド 電子的、光学的、且つ／又は機械的装置及びシステム並びにこれらの装置及びシステムを製造する方法
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
CN102963143A (zh) * 2011-08-28 2013-03-13 瑞世达科技(厦门)有限公司 步进网版印刷方法及其印刷装置
CN108389893A (zh) 2011-12-01 2018-08-10 伊利诺伊大学评议会 经设计以经历可编程转变的瞬态器件
CN102623472B (zh) * 2012-03-27 2015-07-22 格科微电子（上海）有限公司 去除csp封装型图像传感器芯片表面透光板的方法
EP2830492B1 (en) 2012-03-30 2021-05-19 The Board of Trustees of the University of Illinois Appendage mountable electronic devices conformable to surfaces and method of making the same
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
WO2014171597A1 (ko) 2013-04-15 2014-10-23 (주)플렉센스 나노 입자 어레이의 제조 방법, 표면 플라즈몬 공명 기반의 센서, 및 이를 이용한 분석 방법
US10060851B2 (en) 2013-03-05 2018-08-28 Plexense, Inc. Surface plasmon detection apparatuses and methods
DE102015107122A1 (de) * 2015-05-07 2016-11-10 Osram Oled Gmbh Verfahren zum Strukturieren einer Schicht
AU2016270805A1 (en) 2015-06-01 2017-12-14 The Board Of Trustees Of The University Of Illinois Alternative approach to UV sensing
KR20180033468A (ko) 2015-06-01 2018-04-03 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 무선 전력 및 근거리 통신기능을 갖는 소형화된 전자 시스템
US20170135220A1 (en) * 2015-11-07 2017-05-11 The Governing Council Of The University Of Toronto Printable Films for Printed Circuit Boards and Processes for Making Same
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
DE102016122803A1 (de) * 2016-11-25 2018-05-30 Osram Oled Gmbh Verfahren zum herstellen eines optoelektronischen bauelementes und optoelektronisches bauelement
EP3373712B1 (fr) * 2017-03-09 2023-03-29 MGI Digital Technology Procédé de dépôt de traces conductrices
KR101808985B1 (ko) * 2017-03-31 2017-12-13 성균관대학교산학협력단 고분자 나노무기입자 복합체 및 이를 제조하는 방법
KR102371678B1 (ko) 2017-06-12 2022-03-07 삼성디스플레이 주식회사 금속 나노선 전극 및 이의 제조 방법
CN108963101B (zh) * 2017-11-30 2022-08-26 广东聚华印刷显示技术有限公司 用于柔性显示器件的制作的离型层及复合基板
DE102018105735A1 (de) 2018-03-13 2019-09-19 Mitsubishi Polyester Film Gmbh Trennfolie für Tiefdruckanwendung

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4919994A (en) * 1986-04-01 1990-04-24 Minnesota Mining And Manufacturing Company Dry transfer graphics article and methods of preparation and use thereof
JPS63127592A (ja) * 1986-11-18 1988-05-31 古河電気工業株式会社 剥離性シ−ト付パタ−ン導電化薄膜の製造法
JPS63241986A (ja) * 1987-03-30 1988-10-07 株式会社日立製作所 印刷回路の製造および装置
FI91573C (sv) 1990-01-04 1994-07-11 Neste Oy Sätt att framställa elektroniska och elektro-optiska komponenter och kretsar
DE19633675B4 (de) 1996-08-21 2007-07-19 Robert Bosch Gmbh Verfahren zum Übertragen von Schichten oder Schichtsystemen auf einen sinterfähigen Schichtträger
AU733522B2 (en) 1998-01-28 2001-05-17 Thin Film Electronics Asa A method for generating electrical conducting and/or semiconducting structures in three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating
GB9806066D0 (en) 1998-03-20 1998-05-20 Cambridge Display Tech Ltd Multilayer photovoltaic or photoconductive devices
CN1331736A (zh) * 1998-11-23 2002-01-16 让－马克·弗朗索斯 压敏粘合层合材料,改进此类层合材料起始剥离力的方法和装置
EP1041620A3 (en) * 1999-04-02 2005-01-05 Interuniversitair Microelektronica Centrum Vzw Method of transferring ultrathin substrates and application of the method to the manufacture of a multi-layer thin film device
DE10033112C2 (de) 2000-07-07 2002-11-14 Siemens Ag Verfahren zur Herstellung und Strukturierung organischer Feldeffekt-Transistoren (OFET), hiernach gefertigter OFET und seine Verwendung
US20040026121A1 (en) * 2000-09-22 2004-02-12 Adolf Bernds Electrode and/or conductor track for organic components and production method thereof
DE10061297C2 (de) * 2000-12-08 2003-05-28 Siemens Ag Verfahren zur Sturkturierung eines OFETs
US6852355B2 (en) * 2001-03-01 2005-02-08 E. I. Du Pont De Nemours And Company Thermal imaging processes and products of electroactive organic material
JP4524561B2 (ja) * 2001-07-24 2010-08-18 セイコーエプソン株式会社 転写方法
JP4211256B2 (ja) 2001-12-28 2009-01-21 セイコーエプソン株式会社 半導体集積回路、半導体集積回路の製造方法、電気光学装置、電子機器

Similar Documents

Publication Publication Date Title
BE2015C038I2 (ja)
BRPI0518216C1 (ja)
BRPI0515516B8 (ja)
BR122015024347A2 (ja)
JP2005228217A5 (ja)
BRPI0508002A (ja)
JP2007515782A5 (ja)
JP2004279419A5 (ja)
JP2006033104A5 (ja)
BR122018073034B8 (ja)
BRPI0508029A (ja)
BRPI0419105B8 (ja)
BRPI0508026A (ja)
JP2005321917A5 (ja)
JP2005149708A5 (ja)
JP2005243752A5 (ja)
JP2005212561A5 (ja)
BRPI0508033A (ja)
AT501137B8 (ja)
JP2006034330A5 (ja)
AT500847B8 (ja)
CN300765733S (zh) 瓶子
CN300763786S (zh) 传感器壳体
CN300729373S (zh) 包装盒（曲面的蛤壳式）
CN300736473S (zh) 洗手盆