JP2007294530A - リードフレーム組立体 - Google Patents
リードフレーム組立体 Download PDFInfo
- Publication number
- JP2007294530A JP2007294530A JP2006118116A JP2006118116A JP2007294530A JP 2007294530 A JP2007294530 A JP 2007294530A JP 2006118116 A JP2006118116 A JP 2006118116A JP 2006118116 A JP2006118116 A JP 2006118116A JP 2007294530 A JP2007294530 A JP 2007294530A
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- Prior art keywords
- metal
- lead
- strap
- lead terminal
- wire
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Abstract
【解決手段】リード部材(7,8)は、電子部品(5)の第1の電極(15a)とリード端子(3a)の接続面(14)とを接続する金属ストラップ(7)と、電子部品(6)の第2の電極(16a)と金属ストラップ(7)の上面(7a)とを接続する金属細線(8)とを有する。リード端子(3a)の接続面(14)に金属ストラップ(7)を接続し、金属ストラップ(7)の上面(7a)に金属細線(8)を接続するため、リード端子(3a)の接続面(14)を金属ストラップ(7)との接続強度の高い金属により形成するだけで、リード端子(3a)に金属ストラップ(7)及び金属細線(8)を高い接続強度で接続できる。
【選択図】図1
Description
Claims (4)
- 支持板と、該支持板の縁部側に並列に配置される複数のリード端子と、前記支持板の主面に固着される単一又は複数の電子部品とを備え、該電子部品の複数の電極と前記複数のリード端子の1つとを異なる材質の複数のリード部材により電気的に接続するリードフレーム組立体において、
前記リード部材を接続する前記リード端子の接続面は、同一の金属により形成され、
前記リード部材は、前記電子部品の第1の電極と前記リード端子の接続面とを接続する金属ストラップと、前記電子部品の第2の電極と前記金属ストラップの上面とを接続する金属細線とを有することを特徴とするリードフレーム組立体。 - 前記金属ストラップを形成する金属と前記リード端子の接続面を形成する金属との間の接続強度及び前記金属細線を形成する金属と前記金属ストラップを形成する金属との間の接続強度は、前記金属細線を形成する金属と前記リード端子の接続面を形成する金属との間の接続強度よりも高い請求項1に記載のリードフレーム組立体。
- 前記金属ストラップは、アルミニウムを主成分として形成され、前記金属細線は、金を主成分として形成され、
前記金属ストラップを接続する前記リード端子のパッド部は、ニッケルを主成分として形成される上面を有する請求項1に記載のリードフレーム組立体。 - 前記金属細線を接続する前記リード端子のパッド部は、ニッケルを主成分として形成される上面と、該上面に固着され且つアルミニウムを主成分として形成されるストラップ片とを有する請求項3に記載のリードフレーム組立体。
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Cited By (5)
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US9147647B2 (en) | 2012-11-05 | 2015-09-29 | Renesas Electronics Corporation | Semiconductor device and method of manufacturing the same |
CN106024745A (zh) * | 2016-07-01 | 2016-10-12 | 长电科技(宿迁)有限公司 | 一种半导体管脚贴装结构及其焊接方法 |
JP2017069584A (ja) * | 2017-01-10 | 2017-04-06 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP2019004137A (ja) * | 2017-05-29 | 2019-01-10 | ローム株式会社 | 半導体装置およびその製造方法 |
CN111834350A (zh) * | 2019-04-18 | 2020-10-27 | 无锡华润安盛科技有限公司 | Ipm的封装方法以及ipm封装中的键合方法 |
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JPH10303247A (ja) * | 1997-04-25 | 1998-11-13 | Nec Corp | 半導体装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US9147647B2 (en) | 2012-11-05 | 2015-09-29 | Renesas Electronics Corporation | Semiconductor device and method of manufacturing the same |
US9240368B2 (en) | 2012-11-05 | 2016-01-19 | Renesas Electronics Corporation | Semiconductor device and method of manufacturing the same |
US9349675B2 (en) | 2012-11-05 | 2016-05-24 | Renesas Electronics Corporation | Semiconductor device and method of manufacturing the same |
CN106024745A (zh) * | 2016-07-01 | 2016-10-12 | 长电科技(宿迁)有限公司 | 一种半导体管脚贴装结构及其焊接方法 |
JP2017069584A (ja) * | 2017-01-10 | 2017-04-06 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP2019004137A (ja) * | 2017-05-29 | 2019-01-10 | ローム株式会社 | 半導体装置およびその製造方法 |
CN111834350A (zh) * | 2019-04-18 | 2020-10-27 | 无锡华润安盛科技有限公司 | Ipm的封装方法以及ipm封装中的键合方法 |
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